JPWO2021024571A1 - - Google Patents

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Publication number
JPWO2021024571A1
JPWO2021024571A1 JP2021537586A JP2021537586A JPWO2021024571A1 JP WO2021024571 A1 JPWO2021024571 A1 JP WO2021024571A1 JP 2021537586 A JP2021537586 A JP 2021537586A JP 2021537586 A JP2021537586 A JP 2021537586A JP WO2021024571 A1 JPWO2021024571 A1 JP WO2021024571A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021537586A
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JP7261963B2 (ja
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Publication of JPWO2021024571A1 publication Critical patent/JPWO2021024571A1/ja
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Publication of JP7261963B2 publication Critical patent/JP7261963B2/ja
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/086Supply management, e.g. supply of components or of substrates
JP2021537586A 2019-08-07 2020-05-13 部品実装支援装置および部品実装システム Active JP7261963B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019145008 2019-08-07
JP2019145008 2019-08-07
PCT/JP2020/019153 WO2021024571A1 (ja) 2019-08-07 2020-05-13 部品実装支援装置および部品実装システム

Publications (2)

Publication Number Publication Date
JPWO2021024571A1 true JPWO2021024571A1 (ja) 2021-02-11
JP7261963B2 JP7261963B2 (ja) 2023-04-21

Family

ID=74503447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021537586A Active JP7261963B2 (ja) 2019-08-07 2020-05-13 部品実装支援装置および部品実装システム

Country Status (4)

Country Link
JP (1) JP7261963B2 (ja)
CN (1) CN114026974A (ja)
DE (1) DE112020003728T5 (ja)
WO (1) WO2021024571A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124693A (ja) * 1998-10-16 2000-04-28 Matsushita Electric Ind Co Ltd 実装データ作成方法及び部品実装方法
JP2003273596A (ja) * 2002-03-18 2003-09-26 Fuji Mach Mfg Co Ltd 電子回路部品装着システム,装着制御プログラムおよび電子回路部品誤搭載防止システム
US20070250201A1 (en) * 2006-04-20 2007-10-25 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
JP2007311546A (ja) * 2006-05-18 2007-11-29 Yamaha Motor Co Ltd 部品実装方法および部品実装装置
JP2016009734A (ja) * 2014-06-24 2016-01-18 パナソニックIpマネジメント株式会社 部品実装システムおよび部品データ作成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124693A (ja) * 1998-10-16 2000-04-28 Matsushita Electric Ind Co Ltd 実装データ作成方法及び部品実装方法
JP2003273596A (ja) * 2002-03-18 2003-09-26 Fuji Mach Mfg Co Ltd 電子回路部品装着システム,装着制御プログラムおよび電子回路部品誤搭載防止システム
US20070250201A1 (en) * 2006-04-20 2007-10-25 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
JP2007311546A (ja) * 2006-05-18 2007-11-29 Yamaha Motor Co Ltd 部品実装方法および部品実装装置
JP2016009734A (ja) * 2014-06-24 2016-01-18 パナソニックIpマネジメント株式会社 部品実装システムおよび部品データ作成方法

Also Published As

Publication number Publication date
JP7261963B2 (ja) 2023-04-21
WO2021024571A1 (ja) 2021-02-11
DE112020003728T5 (de) 2022-04-21
CN114026974A (zh) 2022-02-08

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