JPWO2021024480A1 - - Google Patents

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Publication number
JPWO2021024480A1
JPWO2021024480A1 JP2021537539A JP2021537539A JPWO2021024480A1 JP WO2021024480 A1 JPWO2021024480 A1 JP WO2021024480A1 JP 2021537539 A JP2021537539 A JP 2021537539A JP 2021537539 A JP2021537539 A JP 2021537539A JP WO2021024480 A1 JPWO2021024480 A1 JP WO2021024480A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021537539A
Other versions
JP7416069B2 (ja
JPWO2021024480A5 (ja
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Publication of JPWO2021024480A1 publication Critical patent/JPWO2021024480A1/ja
Publication of JPWO2021024480A5 publication Critical patent/JPWO2021024480A5/ja
Priority to JP2023220760A priority Critical patent/JP2024045133A/ja
Application granted granted Critical
Publication of JP7416069B2 publication Critical patent/JP7416069B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2021537539A 2019-08-08 2019-08-08 加工装置 Active JP7416069B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023220760A JP2024045133A (ja) 2019-08-08 2023-12-27 加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/031480 WO2021024480A1 (ja) 2019-08-08 2019-08-08 加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023220760A Division JP2024045133A (ja) 2019-08-08 2023-12-27 加工装置

Publications (3)

Publication Number Publication Date
JPWO2021024480A1 true JPWO2021024480A1 (ja) 2021-02-11
JPWO2021024480A5 JPWO2021024480A5 (ja) 2022-06-17
JP7416069B2 JP7416069B2 (ja) 2024-01-17

Family

ID=74502798

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021537539A Active JP7416069B2 (ja) 2019-08-08 2019-08-08 加工装置
JP2021537381A Pending JPWO2021025119A1 (ja) 2019-08-08 2020-08-06
JP2023220760A Pending JP2024045133A (ja) 2019-08-08 2023-12-27 加工装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021537381A Pending JPWO2021025119A1 (ja) 2019-08-08 2020-08-06
JP2023220760A Pending JP2024045133A (ja) 2019-08-08 2023-12-27 加工装置

Country Status (6)

Country Link
US (1) US20220355412A1 (ja)
EP (1) EP4011542A4 (ja)
JP (3) JP7416069B2 (ja)
CN (1) CN114206538A (ja)
TW (1) TW202115975A (ja)
WO (2) WO2021024480A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7270216B2 (ja) * 2019-08-23 2023-05-10 パナソニックＩｐマネジメント株式会社 レーザ加工装置、レーザ加工方法、および補正データ生成方法
US11969823B2 (en) 2020-04-16 2024-04-30 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
WO2023073833A1 (ja) 2021-10-27 2023-05-04 株式会社ニコン データ生成方法、クラウドシステム、加工装置、コンピュータプログラム及び記録媒体
DE102022116927A1 (de) 2022-07-07 2024-01-18 Trumpf Laser Gmbh Laserbearbeitungsmaschine mit frequenzkammbasiertem Abstandssensor sowie zugehöriges Verfahren mit frequenzkammbasierter Abstandsmessung
WO2024042681A1 (ja) * 2022-08-25 2024-02-29 株式会社ニコン 加工システム

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002290056A (ja) * 2001-03-27 2002-10-04 Sumitomo Heavy Ind Ltd レーザ加工装置
JP2005040809A (ja) * 2003-07-24 2005-02-17 Toshiba Corp レーザー照射装置
JP2005161387A (ja) * 2003-12-05 2005-06-23 Nissan Motor Co Ltd レーザ加工装置及びレーザ加工方法
JP2009244319A (ja) * 2008-03-28 2009-10-22 V Technology Co Ltd パターン形成方法及びパターン形成装置
JP2010082663A (ja) * 2008-09-30 2010-04-15 Sunx Ltd レーザ加工機
JP2013108977A (ja) * 2011-10-25 2013-06-06 The Wakasa Wan Energy Research Center レーザー除染装置
JP2013545613A (ja) * 2010-09-25 2013-12-26 クィーンズ ユニバーシティー アット キングストン 材料の改変のためのコヒーレント撮像およびフィードバック制御のための方法およびシステム
JP2016048188A (ja) * 2014-08-27 2016-04-07 国立大学法人電気通信大学 距離測定装置
JP2019111580A (ja) * 2017-10-27 2019-07-11 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 最適化された範囲の選択的レーザーアブレーションシステム及び方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2226970B (en) 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
US5001324A (en) * 1989-09-14 1991-03-19 General Electric Company Precision joint tracking laser welding system
DE10207535B4 (de) * 2002-02-22 2006-07-06 Carl Zeiss Vorrichtung zum Bearbeiten und Vermessen eines Objekts sowie Verfahren hierzu
JP2004243383A (ja) * 2003-02-14 2004-09-02 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
PL2972479T3 (pl) * 2013-03-13 2021-04-19 Ipg Photonics (Canada) Inc. Sposoby i układy do charakteryzacji właściwości obróbki laserem poprzez pomiar dynamiki kapilary z zastosowaniem interferometrii
JP6148075B2 (ja) * 2013-05-31 2017-06-14 株式会社ディスコ レーザー加工装置
DE102013015656B4 (de) * 2013-09-23 2016-02-18 Precitec Optronik Gmbh Verfahren zum Messen der Eindringtiefe eines Laserstrahls in ein Werkstück, Verfahren zum Bearbeiten eines Werkstücks sowie Laserbearbeitungsvorrichtung
JP6244017B2 (ja) 2014-04-23 2017-12-06 国立研究開発法人科学技術振興機構 ブレード複合型開放流路装置およびその接合体
DE102016001661B3 (de) * 2016-02-12 2017-04-13 Lessmüller Lasertechnik GmbH Messvorrichtung und Verfahren zum Ermitteln einer relativen Neigung eines Werkstücks mittels optischer Kohärenztomographie bei einer Bearbeitung
JP2018153842A (ja) * 2017-03-17 2018-10-04 トヨタ自動車株式会社 計測装置およびレーザ溶接装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002290056A (ja) * 2001-03-27 2002-10-04 Sumitomo Heavy Ind Ltd レーザ加工装置
JP2005040809A (ja) * 2003-07-24 2005-02-17 Toshiba Corp レーザー照射装置
JP2005161387A (ja) * 2003-12-05 2005-06-23 Nissan Motor Co Ltd レーザ加工装置及びレーザ加工方法
JP2009244319A (ja) * 2008-03-28 2009-10-22 V Technology Co Ltd パターン形成方法及びパターン形成装置
JP2010082663A (ja) * 2008-09-30 2010-04-15 Sunx Ltd レーザ加工機
JP2013545613A (ja) * 2010-09-25 2013-12-26 クィーンズ ユニバーシティー アット キングストン 材料の改変のためのコヒーレント撮像およびフィードバック制御のための方法およびシステム
JP2013108977A (ja) * 2011-10-25 2013-06-06 The Wakasa Wan Energy Research Center レーザー除染装置
JP2016048188A (ja) * 2014-08-27 2016-04-07 国立大学法人電気通信大学 距離測定装置
JP2019111580A (ja) * 2017-10-27 2019-07-11 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 最適化された範囲の選択的レーザーアブレーションシステム及び方法

Also Published As

Publication number Publication date
WO2021025119A1 (ja) 2021-02-11
JP7416069B2 (ja) 2024-01-17
JPWO2021025119A1 (ja) 2021-02-11
CN114206538A (zh) 2022-03-18
JP2024045133A (ja) 2024-04-02
TW202115975A (zh) 2021-04-16
EP4011542A4 (en) 2023-09-20
US20220355412A1 (en) 2022-11-10
EP4011542A1 (en) 2022-06-15
WO2021024480A1 (ja) 2021-02-11

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