JPWO2021005953A1 - - Google Patents

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Publication number
JPWO2021005953A1
JPWO2021005953A1 JP2021530542A JP2021530542A JPWO2021005953A1 JP WO2021005953 A1 JPWO2021005953 A1 JP WO2021005953A1 JP 2021530542 A JP2021530542 A JP 2021530542A JP 2021530542 A JP2021530542 A JP 2021530542A JP WO2021005953 A1 JPWO2021005953 A1 JP WO2021005953A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530542A
Other versions
JP7231033B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021005953A1 publication Critical patent/JPWO2021005953A1/ja
Application granted granted Critical
Publication of JP7231033B2 publication Critical patent/JP7231033B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0271—Housings; Attachments or accessories for photometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/4446—Type of detector
    • G01J2001/446—Photodiode

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2021530542A 2019-07-10 2020-06-11 光学センサ、及び、それを備えた近接センサ Active JP7231033B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019128197 2019-07-10
JP2019128197 2019-07-10
PCT/JP2020/023043 WO2021005953A1 (ja) 2019-07-10 2020-06-11 光学センサ、及び、それを備えた近接センサ

Publications (2)

Publication Number Publication Date
JPWO2021005953A1 true JPWO2021005953A1 (ja) 2021-01-14
JP7231033B2 JP7231033B2 (ja) 2023-03-01

Family

ID=74114512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530542A Active JP7231033B2 (ja) 2019-07-10 2020-06-11 光学センサ、及び、それを備えた近接センサ

Country Status (4)

Country Link
US (1) US11698295B2 (ja)
JP (1) JP7231033B2 (ja)
CN (1) CN114097097A (ja)
WO (1) WO2021005953A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296777A (ja) * 1985-06-25 1986-12-27 Nec Corp 光結合装置
JP2001291893A (ja) * 2000-04-04 2001-10-19 Sharp Corp 反射型フォトインタラプタ
JP2008150437A (ja) * 2006-12-14 2008-07-03 Momentive Performance Materials Japan Kk 光半導体封止用シリコーンゴム組成物および光半導体装置
US20120197093A1 (en) * 2011-01-27 2012-08-02 Leboeuf Steven Francis Apparatus and methods for monitoring physiological data during environmental interference
JP2014220339A (ja) * 2013-05-07 2014-11-20 ルネサスエレクトロニクス株式会社 光結合素子
JP2016162895A (ja) * 2015-03-02 2016-09-05 株式会社東芝 光結合装置および絶縁装置
JP2017216281A (ja) * 2016-05-30 2017-12-07 ローム株式会社 受発光モジュール、電子機器および受発光モジュールの製造方法
CN108871609A (zh) * 2017-05-09 2018-11-23 维瓦灵克有限公司 一种长工作周期的可穿戴温度测量贴片

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062496U (ja) 1983-10-07 1985-05-01 星崎電機株式会社 飲料デイスペンサ−
JP2604178B2 (ja) * 1987-10-06 1997-04-30 東レ・ダウコーニング・シリコーン株式会社 樹脂封止型光結合半導体装置およびその製造方法
JP2561329B2 (ja) * 1988-10-13 1996-12-04 日本電気株式会社 光結合型半導体装置
JP3392748B2 (ja) * 1998-03-13 2003-03-31 日本電信電話株式会社 半導体光モジュールの製造方法
JP3609617B2 (ja) * 1998-05-20 2005-01-12 ローム株式会社 反射型センサ
EP1484802B1 (en) * 2003-06-06 2018-06-13 Stanley Electric Co., Ltd. Optical semiconductor device
WO2005043636A1 (ja) * 2003-11-04 2005-05-12 Shin-Etsu Handotai Co., Ltd. 発光素子
CN100442483C (zh) * 2004-09-16 2008-12-10 夏普株式会社 半导体光器件、其制造方法、引线框以及电子设备
US7617980B2 (en) * 2005-04-25 2009-11-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Integrated optical module for reflectance sensing
JP2008205317A (ja) * 2007-02-21 2008-09-04 Nec Electronics Corp 固体撮像装置及びその製造方法及びそれを用いた電子機器
JP4683053B2 (ja) * 2008-01-28 2011-05-11 日亜化学工業株式会社 射出成形用金型及びこれによって成形される半導体パッケージ並びに半導体パッケージの製造方法
JP2009188185A (ja) * 2008-02-06 2009-08-20 Toshiba Corp 光半導体装置
JP2012169511A (ja) * 2011-02-16 2012-09-06 Renesas Electronics Corp 光結合型半導体素子、その製造方法
JP2013080821A (ja) * 2011-10-04 2013-05-02 Kaneka Corp 樹脂成形体および側面発光型の半導体発光装置
WO2014033768A1 (ja) * 2012-08-27 2014-03-06 パイオニア株式会社 半導体装置および半導体装置の製造方法
JP6392654B2 (ja) * 2014-02-04 2018-09-19 エイブリック株式会社 光センサ装置
JP2015177052A (ja) * 2014-03-14 2015-10-05 株式会社東芝 光結合装置
JP2017028161A (ja) * 2015-07-24 2017-02-02 株式会社東芝 光結合装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296777A (ja) * 1985-06-25 1986-12-27 Nec Corp 光結合装置
JP2001291893A (ja) * 2000-04-04 2001-10-19 Sharp Corp 反射型フォトインタラプタ
JP2008150437A (ja) * 2006-12-14 2008-07-03 Momentive Performance Materials Japan Kk 光半導体封止用シリコーンゴム組成物および光半導体装置
US20120197093A1 (en) * 2011-01-27 2012-08-02 Leboeuf Steven Francis Apparatus and methods for monitoring physiological data during environmental interference
JP2014220339A (ja) * 2013-05-07 2014-11-20 ルネサスエレクトロニクス株式会社 光結合素子
JP2016162895A (ja) * 2015-03-02 2016-09-05 株式会社東芝 光結合装置および絶縁装置
JP2017216281A (ja) * 2016-05-30 2017-12-07 ローム株式会社 受発光モジュール、電子機器および受発光モジュールの製造方法
CN108871609A (zh) * 2017-05-09 2018-11-23 维瓦灵克有限公司 一种长工作周期的可穿戴温度测量贴片

Also Published As

Publication number Publication date
CN114097097A (zh) 2022-02-25
US20220128397A1 (en) 2022-04-28
US11698295B2 (en) 2023-07-11
JP7231033B2 (ja) 2023-03-01
WO2021005953A1 (ja) 2021-01-14

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