JPWO2021002075A1 - - Google Patents

Info

Publication number
JPWO2021002075A1
JPWO2021002075A1 JP2021529892A JP2021529892A JPWO2021002075A1 JP WO2021002075 A1 JPWO2021002075 A1 JP WO2021002075A1 JP 2021529892 A JP2021529892 A JP 2021529892A JP 2021529892 A JP2021529892 A JP 2021529892A JP WO2021002075 A1 JPWO2021002075 A1 JP WO2021002075A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021529892A
Other versions
JP7214870B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021002075A1 publication Critical patent/JPWO2021002075A1/ja
Application granted granted Critical
Publication of JP7214870B2 publication Critical patent/JP7214870B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021529892A 2019-07-01 2020-04-08 撮像素子ユニット及び撮像装置 Active JP7214870B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019123076 2019-07-01
JP2019123076 2019-07-01
PCT/JP2020/015886 WO2021002075A1 (ja) 2019-07-01 2020-04-08 撮像素子ユニット及び撮像装置

Publications (2)

Publication Number Publication Date
JPWO2021002075A1 true JPWO2021002075A1 (ja) 2021-01-07
JP7214870B2 JP7214870B2 (ja) 2023-01-30

Family

ID=74100671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021529892A Active JP7214870B2 (ja) 2019-07-01 2020-04-08 撮像素子ユニット及び撮像装置

Country Status (4)

Country Link
US (1) US20220085087A1 (ja)
JP (1) JP7214870B2 (ja)
CN (1) CN113994468A (ja)
WO (1) WO2021002075A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012719A (ja) * 1998-06-25 2000-01-14 Kyocera Corp 固体撮像素子収納用パッケージ
JP2005341522A (ja) * 2004-04-27 2005-12-08 Kyocera Corp カメラモジュール及びそれを用いた車載用カメラ装置並びにそれらの製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2014017334A (ja) * 2012-07-06 2014-01-30 Canon Inc 半導体装置およびその製造方法、ならびにカメラ
JP2014045048A (ja) * 2012-08-25 2014-03-13 Nikon Corp 固体撮像装置及びその製造方法
JP2015170638A (ja) * 2014-03-05 2015-09-28 株式会社リコー 撮像素子パッケージ及び撮像装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018747A (ja) * 2009-07-08 2011-01-27 Olympus Corp 撮像ユニット
JP6318530B2 (ja) * 2013-10-07 2018-05-09 株式会社ニコン 撮像ユニットおよび撮像装置
JP6567934B2 (ja) * 2015-01-28 2019-08-28 京セラ株式会社 撮像装置
JP6745418B2 (ja) * 2018-01-29 2020-08-26 富士フイルム株式会社 撮像ユニット及び撮像装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012719A (ja) * 1998-06-25 2000-01-14 Kyocera Corp 固体撮像素子収納用パッケージ
JP2005341522A (ja) * 2004-04-27 2005-12-08 Kyocera Corp カメラモジュール及びそれを用いた車載用カメラ装置並びにそれらの製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2014017334A (ja) * 2012-07-06 2014-01-30 Canon Inc 半導体装置およびその製造方法、ならびにカメラ
JP2014045048A (ja) * 2012-08-25 2014-03-13 Nikon Corp 固体撮像装置及びその製造方法
JP2015170638A (ja) * 2014-03-05 2015-09-28 株式会社リコー 撮像素子パッケージ及び撮像装置

Also Published As

Publication number Publication date
CN113994468A (zh) 2022-01-28
JP7214870B2 (ja) 2023-01-30
US20220085087A1 (en) 2022-03-17
WO2021002075A1 (ja) 2021-01-07

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