JPWO2020230821A1 - - Google Patents

Info

Publication number
JPWO2020230821A1
JPWO2020230821A1 JP2021519463A JP2021519463A JPWO2020230821A1 JP WO2020230821 A1 JPWO2020230821 A1 JP WO2020230821A1 JP 2021519463 A JP2021519463 A JP 2021519463A JP 2021519463 A JP2021519463 A JP 2021519463A JP WO2020230821 A1 JPWO2020230821 A1 JP WO2020230821A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021519463A
Other versions
JP7197002B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020230821A1 publication Critical patent/JPWO2020230821A1/ja
Application granted granted Critical
Publication of JP7197002B2 publication Critical patent/JP7197002B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/125—Details of the optical system between the polygonal mirror and the image plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
JP2021519463A 2019-05-14 2020-05-13 溝加工装置及び溝加工方法 Active JP7197002B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019091044 2019-05-14
JP2019091044 2019-05-14
PCT/JP2020/019132 WO2020230821A1 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Publications (2)

Publication Number Publication Date
JPWO2020230821A1 true JPWO2020230821A1 (ja) 2020-11-19
JP7197002B2 JP7197002B2 (ja) 2022-12-27

Family

ID=73289594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519463A Active JP7197002B2 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Country Status (8)

Country Link
US (1) US20220219262A1 (ja)
EP (1) EP3970904B1 (ja)
JP (1) JP7197002B2 (ja)
KR (1) KR102616094B1 (ja)
CN (1) CN113825588B (ja)
BR (1) BR112021022750A2 (ja)
PL (1) PL3970904T3 (ja)
WO (1) WO2020230821A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07178581A (ja) * 1993-12-21 1995-07-18 Toshiba Corp レーザ加工装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置
JP2016203222A (ja) * 2015-04-27 2016-12-08 株式会社ディスコ レーザー加工装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07334602A (ja) * 1994-06-13 1995-12-22 Olympus Optical Co Ltd バーコード読み取り装置
JP4340943B2 (ja) * 2000-09-11 2009-10-07 澁谷工業株式会社 レーザ照射装置
JP2002292484A (ja) 2001-03-30 2002-10-08 Nippon Steel Corp レーザによる溝加工装置
US6788445B2 (en) * 2002-01-14 2004-09-07 Applied Materials, Inc. Multi-beam polygon scanning system
KR100462359B1 (ko) * 2004-08-18 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치 및 방법
KR20080079828A (ko) * 2007-02-28 2008-09-02 주식회사 이오테크닉스 레이저 가공 장치 및 방법
KR101681822B1 (ko) * 2012-04-27 2016-12-01 신닛테츠스미킨 카부시키카이샤 방향성 전자 강판 및 그 제조 방법
KR102630078B1 (ko) 2015-12-30 2024-01-26 엘지디스플레이 주식회사 화소, 이를 포함하는 표시 장치 및 그 제어 방법
DE112017004557T5 (de) * 2016-09-09 2019-05-23 Mitsubishi Electric Corporation Laserbearbeitungsvorrichtung
EP3412400A1 (en) * 2017-06-09 2018-12-12 Bystronic Laser AG Beam shaper and use thereof, device for laser beam treatment of a workpiece and use thereof, method for laser beam treatment of a workpiece
JP7178581B2 (ja) 2018-03-20 2022-11-28 パナソニックＩｐマネジメント株式会社 送り端子カバー及び分電盤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07178581A (ja) * 1993-12-21 1995-07-18 Toshiba Corp レーザ加工装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置
JP2016203222A (ja) * 2015-04-27 2016-12-08 株式会社ディスコ レーザー加工装置

Also Published As

Publication number Publication date
CN113825588A (zh) 2021-12-21
JP7197002B2 (ja) 2022-12-27
PL3970904T3 (pl) 2023-08-28
EP3970904A4 (en) 2022-07-20
US20220219262A1 (en) 2022-07-14
EP3970904A1 (en) 2022-03-23
BR112021022750A2 (pt) 2022-01-18
WO2020230821A1 (ja) 2020-11-19
KR102616094B1 (ko) 2023-12-21
EP3970904B1 (en) 2023-06-21
KR20210150560A (ko) 2021-12-10
CN113825588B (zh) 2023-12-22

Similar Documents

Publication Publication Date Title
BR112021017339A2 (ja)
BR112021018450A2 (ja)
BR112021017892A2 (ja)
AU2020104490A4 (ja)
BR112021017939A2 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
BR112019016138A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021018102A2 (ja)
BR112021017173A2 (ja)
BR112021017083A2 (ja)
BR112021017637A2 (ja)
BR112021018452A2 (ja)
BR112021018250A2 (ja)
BR112021018093A2 (ja)
BR112021018084A2 (ja)
BR112021017703A2 (ja)
BR112021018484A2 (ja)
BR112021017732A2 (ja)
BR112021017949A2 (ja)
BR112021017983A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211111

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221128

R151 Written notification of patent or utility model registration

Ref document number: 7197002

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151