JPWO2020225884A1 - - Google Patents

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Publication number
JPWO2020225884A1
JPWO2020225884A1 JP2021518258A JP2021518258A JPWO2020225884A1 JP WO2020225884 A1 JPWO2020225884 A1 JP WO2020225884A1 JP 2021518258 A JP2021518258 A JP 2021518258A JP 2021518258 A JP2021518258 A JP 2021518258A JP WO2020225884 A1 JPWO2020225884 A1 JP WO2020225884A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2021518258A
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Japanese (ja)
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JP7294412B2 (ja
JPWO2020225884A5 (enrdf_load_stackoverflow
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2021518258A 2019-05-08 2019-05-08 樹脂粒子混合物 Active JP7294412B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/018444 WO2020225884A1 (ja) 2019-05-08 2019-05-08 樹脂粒子混合物

Publications (3)

Publication Number Publication Date
JPWO2020225884A1 true JPWO2020225884A1 (enrdf_load_stackoverflow) 2020-11-12
JPWO2020225884A5 JPWO2020225884A5 (enrdf_load_stackoverflow) 2022-02-08
JP7294412B2 JP7294412B2 (ja) 2023-06-20

Family

ID=73050795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021518258A Active JP7294412B2 (ja) 2019-05-08 2019-05-08 樹脂粒子混合物

Country Status (3)

Country Link
JP (1) JP7294412B2 (enrdf_load_stackoverflow)
CN (1) CN113785000A (enrdf_load_stackoverflow)
WO (1) WO2020225884A1 (enrdf_load_stackoverflow)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62289572A (ja) * 1986-06-07 1987-12-16 Agency Of Ind Science & Technol 自己硬化型エポキシ化合物
JPS63223020A (ja) * 1987-03-13 1988-09-16 Ube Ind Ltd ポリフエノ−ル類の製造法
JPH04288317A (ja) * 1990-05-28 1992-10-13 Somar Corp エポキシ樹脂粉体組成物及びその製造方法
JPH04359023A (ja) * 1991-06-05 1992-12-11 Nippon Unicar Co Ltd シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
JPH10204331A (ja) * 1997-01-28 1998-08-04 Sumitomo Chem Co Ltd 粉体塗料およびその塗装物
JPH11322897A (ja) * 1998-05-20 1999-11-26 Nippon Kayaku Co Ltd 光カチオン重合性エポキシ樹脂系固形組成物及び物品
JP2004002792A (ja) * 2002-04-12 2004-01-08 Toto Kasei Co Ltd エポキシ粉体塗料組成物
JP2004292645A (ja) * 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd エポキシ樹脂粉体塗料
JP2007269980A (ja) * 2006-03-31 2007-10-18 Dainippon Ink & Chem Inc 粉体塗料用エポキシ樹脂組成物
JP2008063488A (ja) * 2006-09-08 2008-03-21 Ntn Corp 樹脂摺動材
JP2011017018A (ja) * 2010-09-10 2011-01-27 Mitsubishi Chemicals Corp エポキシ樹脂組成物及び半導体装置
JP2011131389A (ja) * 2009-12-22 2011-07-07 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置
US20140179835A1 (en) * 2012-12-26 2014-06-26 Min Gyum KIM Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
WO2016117295A1 (ja) * 2015-01-19 2016-07-28 日本曹達株式会社 包接化合物の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685669B2 (ja) * 1999-11-01 2005-08-24 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62289572A (ja) * 1986-06-07 1987-12-16 Agency Of Ind Science & Technol 自己硬化型エポキシ化合物
JPS63223020A (ja) * 1987-03-13 1988-09-16 Ube Ind Ltd ポリフエノ−ル類の製造法
JPH04288317A (ja) * 1990-05-28 1992-10-13 Somar Corp エポキシ樹脂粉体組成物及びその製造方法
JPH04359023A (ja) * 1991-06-05 1992-12-11 Nippon Unicar Co Ltd シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
JPH10204331A (ja) * 1997-01-28 1998-08-04 Sumitomo Chem Co Ltd 粉体塗料およびその塗装物
JPH11322897A (ja) * 1998-05-20 1999-11-26 Nippon Kayaku Co Ltd 光カチオン重合性エポキシ樹脂系固形組成物及び物品
JP2004002792A (ja) * 2002-04-12 2004-01-08 Toto Kasei Co Ltd エポキシ粉体塗料組成物
JP2004292645A (ja) * 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd エポキシ樹脂粉体塗料
JP2007269980A (ja) * 2006-03-31 2007-10-18 Dainippon Ink & Chem Inc 粉体塗料用エポキシ樹脂組成物
JP2008063488A (ja) * 2006-09-08 2008-03-21 Ntn Corp 樹脂摺動材
JP2011131389A (ja) * 2009-12-22 2011-07-07 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置
JP2011017018A (ja) * 2010-09-10 2011-01-27 Mitsubishi Chemicals Corp エポキシ樹脂組成物及び半導体装置
US20140179835A1 (en) * 2012-12-26 2014-06-26 Min Gyum KIM Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
WO2016117295A1 (ja) * 2015-01-19 2016-07-28 日本曹達株式会社 包接化合物の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
社団法人高分子学会, 高分子辞典, vol. 第３版, JPN6019025972, 30 June 2005 (2005-06-30), JP, pages 524, ISSN: 0004932427 *

Also Published As

Publication number Publication date
WO2020225884A1 (ja) 2020-11-12
JP7294412B2 (ja) 2023-06-20
CN113785000A (zh) 2021-12-10

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