JPWO2020203071A1 - - Google Patents
Info
- Publication number
- JPWO2020203071A1 JPWO2020203071A1 JP2021511309A JP2021511309A JPWO2020203071A1 JP WO2020203071 A1 JPWO2020203071 A1 JP WO2020203071A1 JP 2021511309 A JP2021511309 A JP 2021511309A JP 2021511309 A JP2021511309 A JP 2021511309A JP WO2020203071 A1 JPWO2020203071 A1 JP WO2020203071A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019068349 | 2019-03-29 | ||
JP2019068349 | 2019-03-29 | ||
PCT/JP2020/010018 WO2020203071A1 (ja) | 2019-03-29 | 2020-03-09 | 銅材及び放熱部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020203071A1 true JPWO2020203071A1 (ja) | 2020-10-08 |
JP7248104B2 JP7248104B2 (ja) | 2023-03-29 |
Family
ID=72668260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021511309A Active JP7248104B2 (ja) | 2019-03-29 | 2020-03-09 | 圧延銅材及び放熱部材 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP3950981A4 (ja) |
JP (1) | JP7248104B2 (ja) |
CN (1) | CN113631742A (ja) |
TW (1) | TWI842854B (ja) |
WO (1) | WO2020203071A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022224940A1 (ja) * | 2021-04-19 | 2022-10-27 | 株式会社 Kmct | 耐食性銅合金、銅合金管および熱交換器 |
JP7491960B2 (ja) * | 2021-04-19 | 2024-05-28 | 株式会社Kmct | 耐食性銅合金、銅合金管および熱交換器 |
KR20240132097A (ko) | 2022-07-29 | 2024-09-02 | 미쓰비시 마테리알 가부시키가이샤 | 순구리재, 절연 기판, 전자 디바이스 |
KR20240134029A (ko) | 2022-07-29 | 2024-09-05 | 미쓰비시 마테리알 가부시키가이샤 | 순구리재, 절연 기판, 전자 디바이스 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212660A (ja) * | 1999-01-18 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP2014189817A (ja) * | 2013-03-26 | 2014-10-06 | Mitsubishi Materials Corp | 純銅板及び放熱基板 |
JP2016125115A (ja) * | 2015-01-07 | 2016-07-11 | 三菱マテリアル株式会社 | 超伝導線、及び、超伝導コイル |
JP2017188339A (ja) * | 2016-04-06 | 2017-10-12 | 三菱マテリアル株式会社 | 超伝導安定化材、超伝導線及び超伝導コイル |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH062058A (ja) | 1992-06-23 | 1994-01-11 | Furukawa Electric Co Ltd:The | 結晶粒成長抑制無酸素銅 |
JP4519775B2 (ja) * | 2004-01-29 | 2010-08-04 | 日鉱金属株式会社 | 超高純度銅及びその製造方法 |
JP5866411B2 (ja) * | 2013-08-09 | 2016-02-17 | 三菱マテリアル株式会社 | 銅合金薄板および銅合金薄板の製造方法 |
JP6299803B2 (ja) * | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | 超伝導線、及び、超伝導コイル |
JP6939367B2 (ja) | 2017-10-04 | 2021-09-22 | 株式会社リコー | 情報処理システム、情報処理装置、情報処理方法及び情報処理プログラム |
-
2020
- 2020-03-09 EP EP20783133.0A patent/EP3950981A4/en active Pending
- 2020-03-09 CN CN202080024700.8A patent/CN113631742A/zh active Pending
- 2020-03-09 JP JP2021511309A patent/JP7248104B2/ja active Active
- 2020-03-09 WO PCT/JP2020/010018 patent/WO2020203071A1/ja unknown
- 2020-03-12 TW TW109108172A patent/TWI842854B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212660A (ja) * | 1999-01-18 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP2014189817A (ja) * | 2013-03-26 | 2014-10-06 | Mitsubishi Materials Corp | 純銅板及び放熱基板 |
JP2016125115A (ja) * | 2015-01-07 | 2016-07-11 | 三菱マテリアル株式会社 | 超伝導線、及び、超伝導コイル |
JP2017188339A (ja) * | 2016-04-06 | 2017-10-12 | 三菱マテリアル株式会社 | 超伝導安定化材、超伝導線及び超伝導コイル |
Also Published As
Publication number | Publication date |
---|---|
CN113631742A (zh) | 2021-11-09 |
JP7248104B2 (ja) | 2023-03-29 |
TWI842854B (zh) | 2024-05-21 |
EP3950981A1 (en) | 2022-02-09 |
TW202104604A (zh) | 2021-02-01 |
EP3950981A4 (en) | 2023-04-26 |
WO2020203071A1 (ja) | 2020-10-08 |
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