JPWO2020202968A1 - - Google Patents

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Publication number
JPWO2020202968A1
JPWO2020202968A1 JP2020513350A JP2020513350A JPWO2020202968A1 JP WO2020202968 A1 JPWO2020202968 A1 JP WO2020202968A1 JP 2020513350 A JP2020513350 A JP 2020513350A JP 2020513350 A JP2020513350 A JP 2020513350A JP WO2020202968 A1 JPWO2020202968 A1 JP WO2020202968A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020513350A
Other languages
Japanese (ja)
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JP7371619B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2020202968A1 publication Critical patent/JPWO2020202968A1/ja
Application granted granted Critical
Publication of JP7371619B2 publication Critical patent/JP7371619B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Conductive Materials (AREA)
JP2020513350A 2019-03-29 2020-03-02 導電パターンの製造方法 Active JP7371619B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019066804 2019-03-29
JP2019066804 2019-03-29
PCT/JP2020/008646 WO2020202968A1 (ja) 2019-03-29 2020-03-02 導電パターンの製造方法

Publications (2)

Publication Number Publication Date
JPWO2020202968A1 true JPWO2020202968A1 (zh) 2020-10-08
JP7371619B2 JP7371619B2 (ja) 2023-10-31

Family

ID=72668799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020513350A Active JP7371619B2 (ja) 2019-03-29 2020-03-02 導電パターンの製造方法

Country Status (4)

Country Link
JP (1) JP7371619B2 (zh)
KR (1) KR20210144665A (zh)
CN (1) CN113412687A (zh)
WO (1) WO2020202968A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113354984A (zh) * 2021-06-21 2021-09-07 江苏德恒新材料科技有限公司 一种单组分低温固化仿电镀油墨及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212236A (ja) * 1988-06-30 1990-01-17 Fuji Photo Film Co Ltd ハロゲン化銀写真感光材料
JPH02103536A (ja) * 1988-10-13 1990-04-16 Fuji Photo Film Co Ltd 画像形成方法
JP2008277250A (ja) * 2006-12-21 2008-11-13 Fujifilm Corp 導電膜およびその製造方法
WO2013002195A1 (ja) * 2011-06-30 2013-01-03 富士フイルム株式会社 導電膜及びその製造方法、並びにタッチパネル
JP2013196918A (ja) * 2012-03-21 2013-09-30 Jnc Corp 透明導電膜の形成に用いられる塗膜形成用組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499943B2 (ja) 2010-06-29 2014-05-21 大日本印刷株式会社 電磁波遮蔽材の電気抵抗低減化処理を利用した製造方法
US20160118155A1 (en) 2013-06-27 2016-04-28 Toray Industries, Inc. Conductive paste, method of producing conductive pattern, and touch panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212236A (ja) * 1988-06-30 1990-01-17 Fuji Photo Film Co Ltd ハロゲン化銀写真感光材料
JPH02103536A (ja) * 1988-10-13 1990-04-16 Fuji Photo Film Co Ltd 画像形成方法
JP2008277250A (ja) * 2006-12-21 2008-11-13 Fujifilm Corp 導電膜およびその製造方法
WO2013002195A1 (ja) * 2011-06-30 2013-01-03 富士フイルム株式会社 導電膜及びその製造方法、並びにタッチパネル
JP2013196918A (ja) * 2012-03-21 2013-09-30 Jnc Corp 透明導電膜の形成に用いられる塗膜形成用組成物

Also Published As

Publication number Publication date
JP7371619B2 (ja) 2023-10-31
CN113412687A (zh) 2021-09-17
KR20210144665A (ko) 2021-11-30
TW202043384A (zh) 2020-12-01
WO2020202968A1 (ja) 2020-10-08

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