JPWO2020202968A1 - - Google Patents
Info
- Publication number
- JPWO2020202968A1 JPWO2020202968A1 JP2020513350A JP2020513350A JPWO2020202968A1 JP WO2020202968 A1 JPWO2020202968 A1 JP WO2020202968A1 JP 2020513350 A JP2020513350 A JP 2020513350A JP 2020513350 A JP2020513350 A JP 2020513350A JP WO2020202968 A1 JPWO2020202968 A1 JP WO2020202968A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Materials For Photolithography (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019066804 | 2019-03-29 | ||
JP2019066804 | 2019-03-29 | ||
PCT/JP2020/008646 WO2020202968A1 (ja) | 2019-03-29 | 2020-03-02 | 導電パターンの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020202968A1 true JPWO2020202968A1 (zh) | 2020-10-08 |
JP7371619B2 JP7371619B2 (ja) | 2023-10-31 |
Family
ID=72668799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020513350A Active JP7371619B2 (ja) | 2019-03-29 | 2020-03-02 | 導電パターンの製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7371619B2 (zh) |
KR (1) | KR20210144665A (zh) |
CN (1) | CN113412687A (zh) |
WO (1) | WO2020202968A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113354984A (zh) * | 2021-06-21 | 2021-09-07 | 江苏德恒新材料科技有限公司 | 一种单组分低温固化仿电镀油墨及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0212236A (ja) * | 1988-06-30 | 1990-01-17 | Fuji Photo Film Co Ltd | ハロゲン化銀写真感光材料 |
JPH02103536A (ja) * | 1988-10-13 | 1990-04-16 | Fuji Photo Film Co Ltd | 画像形成方法 |
JP2008277250A (ja) * | 2006-12-21 | 2008-11-13 | Fujifilm Corp | 導電膜およびその製造方法 |
WO2013002195A1 (ja) * | 2011-06-30 | 2013-01-03 | 富士フイルム株式会社 | 導電膜及びその製造方法、並びにタッチパネル |
JP2013196918A (ja) * | 2012-03-21 | 2013-09-30 | Jnc Corp | 透明導電膜の形成に用いられる塗膜形成用組成物 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5499943B2 (ja) | 2010-06-29 | 2014-05-21 | 大日本印刷株式会社 | 電磁波遮蔽材の電気抵抗低減化処理を利用した製造方法 |
US20160118155A1 (en) | 2013-06-27 | 2016-04-28 | Toray Industries, Inc. | Conductive paste, method of producing conductive pattern, and touch panel |
-
2020
- 2020-03-02 KR KR1020217024255A patent/KR20210144665A/ko not_active Application Discontinuation
- 2020-03-02 WO PCT/JP2020/008646 patent/WO2020202968A1/ja active Application Filing
- 2020-03-02 JP JP2020513350A patent/JP7371619B2/ja active Active
- 2020-03-02 CN CN202080013524.8A patent/CN113412687A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0212236A (ja) * | 1988-06-30 | 1990-01-17 | Fuji Photo Film Co Ltd | ハロゲン化銀写真感光材料 |
JPH02103536A (ja) * | 1988-10-13 | 1990-04-16 | Fuji Photo Film Co Ltd | 画像形成方法 |
JP2008277250A (ja) * | 2006-12-21 | 2008-11-13 | Fujifilm Corp | 導電膜およびその製造方法 |
WO2013002195A1 (ja) * | 2011-06-30 | 2013-01-03 | 富士フイルム株式会社 | 導電膜及びその製造方法、並びにタッチパネル |
JP2013196918A (ja) * | 2012-03-21 | 2013-09-30 | Jnc Corp | 透明導電膜の形成に用いられる塗膜形成用組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP7371619B2 (ja) | 2023-10-31 |
CN113412687A (zh) | 2021-09-17 |
KR20210144665A (ko) | 2021-11-30 |
TW202043384A (zh) | 2020-12-01 |
WO2020202968A1 (ja) | 2020-10-08 |
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