JPWO2020196571A1 - - Google Patents

Info

Publication number
JPWO2020196571A1
JPWO2020196571A1 JP2021509476A JP2021509476A JPWO2020196571A1 JP WO2020196571 A1 JPWO2020196571 A1 JP WO2020196571A1 JP 2021509476 A JP2021509476 A JP 2021509476A JP 2021509476 A JP2021509476 A JP 2021509476A JP WO2020196571 A1 JPWO2020196571 A1 JP WO2020196571A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509476A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196571A1 publication Critical patent/JPWO2020196571A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/23—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by opening or closing resistor geometric tracks of predetermined resistive values, e.g. snapistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Adjustable Resistors (AREA)
JP2021509476A 2019-03-28 2020-03-25 Pending JPWO2020196571A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019063944 2019-03-28
PCT/JP2020/013184 WO2020196571A1 (ja) 2019-03-28 2020-03-25 チップ抵抗器

Publications (1)

Publication Number Publication Date
JPWO2020196571A1 true JPWO2020196571A1 (ja) 2020-10-01

Family

ID=72612000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509476A Pending JPWO2020196571A1 (ja) 2019-03-28 2020-03-25

Country Status (3)

Country Link
US (1) US11769612B2 (ja)
JP (1) JPWO2020196571A1 (ja)
WO (1) WO2020196571A1 (ja)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366101A (ja) * 1989-08-04 1991-03-20 Matsushita Electric Ind Co Ltd 電気回路部品
JP2935143B2 (ja) * 1991-06-21 1999-08-16 ローム株式会社 角形チップ抵抗器及びその製造方法
JP2000156303A (ja) 1998-11-19 2000-06-06 Matsushita Electric Ind Co Ltd 角形チップ抵抗器
JP2000188203A (ja) * 1998-12-21 2000-07-04 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
US6194979B1 (en) * 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
TW539229U (en) * 2002-06-06 2003-06-21 Protectronics Technology Corp Surface mountable laminated thermistor device
JP4782354B2 (ja) 2002-09-24 2011-09-28 釜屋電機株式会社 チップ抵抗器及びその製造方法
US6882266B2 (en) * 2003-01-07 2005-04-19 Cts Corporation Ball grid array resistor network having a ground plane
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
JP4166820B2 (ja) * 2006-03-09 2008-10-15 松下電器産業株式会社 抵抗変化型素子、半導体装置、およびその製造方法
JP2008117873A (ja) 2006-11-02 2008-05-22 Taiyosha Electric Co Ltd チップ抵抗器
JP4224109B2 (ja) * 2007-03-02 2009-02-12 コーア株式会社 積層体およびその製造方法
JP5225598B2 (ja) * 2007-03-19 2013-07-03 コーア株式会社 電子部品およびその製造法
JP6503943B2 (ja) 2015-07-10 2019-04-24 株式会社村田製作所 複合電子部品および抵抗素子

Also Published As

Publication number Publication date
US20220130578A1 (en) 2022-04-28
WO2020196571A1 (ja) 2020-10-01
US11769612B2 (en) 2023-09-26

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Legal Events

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Effective date: 20230127

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