JPWO2020196138A1 - - Google Patents

Info

Publication number
JPWO2020196138A1
JPWO2020196138A1 JP2021509245A JP2021509245A JPWO2020196138A1 JP WO2020196138 A1 JPWO2020196138 A1 JP WO2020196138A1 JP 2021509245 A JP2021509245 A JP 2021509245A JP 2021509245 A JP2021509245 A JP 2021509245A JP WO2020196138 A1 JPWO2020196138 A1 JP WO2020196138A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509245A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196138A1 publication Critical patent/JPWO2020196138A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021509245A 2019-03-22 2020-03-18 Pending JPWO2020196138A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019054994 2019-03-22
PCT/JP2020/011893 WO2020196138A1 (ja) 2019-03-22 2020-03-18 フィルム状接着剤及び半導体加工用シート

Publications (1)

Publication Number Publication Date
JPWO2020196138A1 true JPWO2020196138A1 (ja) 2020-10-01

Family

ID=72610139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509245A Pending JPWO2020196138A1 (ja) 2019-03-22 2020-03-18

Country Status (3)

Country Link
JP (1) JPWO2020196138A1 (ja)
TW (1) TWI829890B (ja)
WO (1) WO2020196138A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7291310B1 (ja) * 2021-10-05 2023-06-14 リンテック株式会社 熱硬化性フィルム、複合シート、及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877309B2 (ja) * 1988-01-06 1999-03-31 株式会社東芝 ゴム変性フェノール樹脂の製造方法
JP5727811B2 (ja) * 2011-02-10 2015-06-03 リンテック株式会社 半導体チップのピックアップ方法および半導体装置の製造方法
JP5860231B2 (ja) * 2011-06-23 2016-02-16 積水化学工業株式会社 電子部品用接着剤
WO2014136836A1 (ja) * 2013-03-07 2014-09-12 住友ベークライト株式会社 接着フィルム、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、バックグラインドテープ兼ダイシングシート一体型接着フィルム、積層体、積層体の硬化物、および半導体装置、並び半導体装置の製造方法
KR20160137506A (ko) * 2014-03-26 2016-11-30 린텍 가부시키가이샤 수지막 형성용 시트 적층체
WO2019022062A1 (ja) * 2017-07-26 2019-01-31 リンテック株式会社 半導体用接着フィルム及び半導体用接着シート
TWI798390B (zh) * 2018-03-23 2023-04-11 日商琳得科股份有限公司 薄膜狀黏著劑及半導體加工用薄片

Also Published As

Publication number Publication date
TW202100604A (zh) 2021-01-01
TWI829890B (zh) 2024-01-21
WO2020196138A1 (ja) 2020-10-01

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