JPWO2020179937A1 - - Google Patents

Info

Publication number
JPWO2020179937A1
JPWO2020179937A1 JP2021503681A JP2021503681A JPWO2020179937A1 JP WO2020179937 A1 JPWO2020179937 A1 JP WO2020179937A1 JP 2021503681 A JP2021503681 A JP 2021503681A JP 2021503681 A JP2021503681 A JP 2021503681A JP WO2020179937 A1 JPWO2020179937 A1 JP WO2020179937A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021503681A
Other versions
JP7145311B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020179937A1 publication Critical patent/JPWO2020179937A1/ja
Application granted granted Critical
Publication of JP7145311B2 publication Critical patent/JP7145311B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
JP2021503681A 2019-03-07 2020-03-09 配線基板、電子部品用パッケージおよび電子装置 Active JP7145311B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019042056 2019-03-07
JP2019042056 2019-03-07
PCT/JP2020/010108 WO2020179937A1 (ja) 2019-03-07 2020-03-09 配線基板、電子部品用パッケージおよび電子装置

Publications (2)

Publication Number Publication Date
JPWO2020179937A1 true JPWO2020179937A1 (ja) 2020-09-10
JP7145311B2 JP7145311B2 (ja) 2022-09-30

Family

ID=72337803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021503681A Active JP7145311B2 (ja) 2019-03-07 2020-03-09 配線基板、電子部品用パッケージおよび電子装置

Country Status (5)

Country Link
US (1) US20220165889A1 (ja)
EP (1) EP3937223A4 (ja)
JP (1) JP7145311B2 (ja)
CN (1) CN113519048A (ja)
WO (1) WO2020179937A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023145651A1 (ja) * 2022-01-28 2023-08-03 京セラ株式会社 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249584A (ja) * 2002-02-25 2003-09-05 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2006179839A (ja) * 2004-11-29 2006-07-06 Kyocera Corp 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2010171572A (ja) * 2009-01-21 2010-08-05 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
WO2014192687A1 (ja) * 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015012405A1 (ja) * 2013-07-26 2015-01-29 京セラ株式会社 素子収納用パッケージおよび実装構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013015327A1 (ja) * 2011-07-25 2013-01-31 京セラ株式会社 配線基板、電子装置および電子モジュール
KR102046988B1 (ko) * 2012-05-25 2019-11-20 삼성전자 주식회사 낮은 삽입력을 갖는 인쇄회로기판(ｐｃｂ), 그 제조방법, 및 그 ｐｃｂ를 포함하는 시스템
US9107316B2 (en) * 2013-09-11 2015-08-11 Eastman Kodak Company Multi-layer micro-wire substrate structure
JP2016115736A (ja) * 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP2016146439A (ja) * 2015-02-09 2016-08-12 Ｎｇｋエレクトロデバイス株式会社 高周波用半導体素子収納用パッケージ
WO2016186128A1 (ja) * 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
US10791632B1 (en) * 2019-09-20 2020-09-29 Raytheon Company Extremely low profile electrical interconnect for printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249584A (ja) * 2002-02-25 2003-09-05 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2006179839A (ja) * 2004-11-29 2006-07-06 Kyocera Corp 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2010171572A (ja) * 2009-01-21 2010-08-05 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
WO2014192687A1 (ja) * 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015012405A1 (ja) * 2013-07-26 2015-01-29 京セラ株式会社 素子収納用パッケージおよび実装構造体

Also Published As

Publication number Publication date
CN113519048A (zh) 2021-10-19
WO2020179937A1 (ja) 2020-09-10
EP3937223A4 (en) 2023-02-01
US20220165889A1 (en) 2022-05-26
JP7145311B2 (ja) 2022-09-30
EP3937223A1 (en) 2022-01-12

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112021017339A2 (ja)
BR112021013854A2 (ja)
BR112021018450A2 (ja)
BR112021017939A2 (ja)
BR112021017892A2 (ja)
BR112019016141A2 (ja)
AU2020104490A4 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
BR112019016142A2 (ja)
BR112019016138A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
BR112021008711A2 (ja)
BR112021018452A2 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017703A2 (ja)
BR112021017173A2 (ja)
BR112021018102A2 (ja)
BR112021017083A2 (ja)
BR112021017637A2 (ja)
BR112021012348A2 (ja)
BR112021018250A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210906

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220803

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220823

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220916

R150 Certificate of patent or registration of utility model

Ref document number: 7145311

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150