JPWO2020172186A5 - - Google Patents

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JPWO2020172186A5
JPWO2020172186A5 JP2021547158A JP2021547158A JPWO2020172186A5 JP WO2020172186 A5 JPWO2020172186 A5 JP WO2020172186A5 JP 2021547158 A JP2021547158 A JP 2021547158A JP 2021547158 A JP2021547158 A JP 2021547158A JP WO2020172186 A5 JPWO2020172186 A5 JP WO2020172186A5
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measurement
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JP2022520247A (ja
JP2022520247A5 (https=
JP7471312B2 (ja
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JP2021547158A 2019-02-19 2020-02-18 センサ計測データ統合 Active JP7471312B2 (ja)

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JP2024015763A JP2024059663A (ja) 2019-02-19 2024-02-05 センサ計測データ統合

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US201962807619P 2019-02-19 2019-02-19
US62/807,619 2019-02-19
US16/791,081 2020-02-14
US16/791,081 US11592812B2 (en) 2019-02-19 2020-02-14 Sensor metrology data integration
PCT/US2020/018673 WO2020172186A1 (en) 2019-02-19 2020-02-18 Sensor metrology data integration

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JP2022520247A JP2022520247A (ja) 2022-03-29
JP2022520247A5 JP2022520247A5 (https=) 2023-03-01
JPWO2020172186A5 true JPWO2020172186A5 (https=) 2023-03-01
JP7471312B2 JP7471312B2 (ja) 2024-04-19

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US (3) US11592812B2 (https=)
JP (2) JP7471312B2 (https=)
KR (2) KR102611824B1 (https=)
CN (2) CN113454552B (https=)
SG (1) SG11202108577UA (https=)
TW (2) TW202538611A (https=)
WO (1) WO2020172186A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9606519B2 (en) * 2013-10-14 2017-03-28 Applied Materials, Inc. Matching process controllers for improved matching of process
US11940488B2 (en) 2017-01-05 2024-03-26 Xcalipr Corporation Systems and methods for high precision optical characterization of carrier transport properties in semiconductor manufacturing
US11592812B2 (en) * 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
US12283503B2 (en) 2020-07-22 2025-04-22 Applied Materials, Inc. Substrate measurement subsystem
US11688616B2 (en) 2020-07-22 2023-06-27 Applied Materials, Inc. Integrated substrate measurement system to improve manufacturing process performance
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
US11375582B2 (en) * 2020-10-16 2022-06-28 Verizon Patent And Licensing Inc. Systems and methods for scalable edge-based microcontrollers
CN112364561B (zh) * 2020-10-26 2022-07-26 上海感探号信息科技有限公司 控车动作修正方法、装置、电子设备和存储介质
TWI777317B (zh) * 2020-11-30 2022-09-11 智慧貼紙股份有限公司 多點量測系統及其方法
JP7632968B2 (ja) * 2021-02-04 2025-02-19 東京エレクトロン株式会社 情報処理装置、プログラム及びプロセス条件探索方法
US11853042B2 (en) 2021-02-17 2023-12-26 Applied Materials, Inc. Part, sensor, and metrology data integration
US11532525B2 (en) * 2021-03-03 2022-12-20 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
US12568791B2 (en) 2021-03-03 2026-03-03 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
CN117121027A (zh) * 2021-04-08 2023-11-24 3M创新有限公司 粘合剂预测系统
US12506024B2 (en) 2021-07-08 2025-12-23 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization
US12131105B2 (en) * 2021-09-15 2024-10-29 Applied Materials, Inc. Virtual measurement of conditions proximate to a substrate with physics-informed compressed sensing
US12111355B2 (en) * 2021-11-22 2024-10-08 Onto Innovation Inc. Semiconductor substrate yield prediction based on spectra data from multiple substrate dies
US12585232B2 (en) * 2021-12-21 2026-03-24 Applied Materials, Inc. Substrate support characterization to build a digital twin
US12189380B2 (en) 2022-01-27 2025-01-07 Applied Materials, Inc. Diagnostic tool to tool matching and comparative drill-down analysis methods for manufacturing equipment
US11961030B2 (en) * 2022-01-27 2024-04-16 Applied Materials, Inc. Diagnostic tool to tool matching methods for manufacturing equipment
US12298748B2 (en) 2022-01-27 2025-05-13 Applied Materials, Inc. Diagnostic tool to tool matching and full-trace drill-down analysis methods for manufacturing equipment
US12191126B2 (en) * 2022-02-15 2025-01-07 Applied Materials, Inc. Process control knob estimation
US12105504B2 (en) * 2022-04-27 2024-10-01 Applied Materials, Inc. Run-to-run control at a manufacturing system using machine learning
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
US20240005143A1 (en) * 2022-06-30 2024-01-04 Capital One Services, Llc Machine learning for power consumption attribution
US11731317B1 (en) * 2022-07-08 2023-08-22 The Boeing Company System and method for material manufacturing based on predicted properties of unconsolidated composite material
US12566132B2 (en) 2022-07-08 2026-03-03 The Boeing Company Real time contaminants identification during composite material manufacturing via non-contact chemical sensing
US12422831B2 (en) * 2022-07-08 2025-09-23 The Boeing Company Property prediction for unconsolidated composite materials
US20240037442A1 (en) * 2022-07-26 2024-02-01 Applied Materials, Inc. Generating indications of learning of models for semiconductor processing
CN115314995B (zh) * 2022-08-08 2023-08-04 深圳市海曼科技股份有限公司 一种无线级联消防定位方法、装置、电子设备及存储介质
US12591805B2 (en) * 2022-08-22 2026-03-31 Applied Materials, Inc. Equipment parameter management at a manufacturing system using machine learning
JP7274655B1 (ja) 2022-09-09 2023-05-16 Dmg森精機株式会社 携帯端末および計測管理プログラム
US12504726B2 (en) 2022-11-28 2025-12-23 Applied Materials, Inc. Determining equipment constant updates by machine learning
US12498705B2 (en) 2022-11-28 2025-12-16 Applied Materials, Inc. Chamber matching by equipment constant updates
US12560916B2 (en) 2022-11-28 2026-02-24 Applied Materials, Inc. Adjusting chamber performance by equipment constant updates
US20240184858A1 (en) * 2022-12-05 2024-06-06 Applied Materials, Inc. Methods and mechanisms for automatic sensor grouping to improve anomaly detection
WO2024166508A1 (ja) * 2023-02-06 2024-08-15 パナソニックIpマネジメント株式会社 情報処理方法、および、情報処理装置
JP2024144254A (ja) * 2023-03-30 2024-10-11 ザ・ボーイング・カンパニー 未固化複合材料のリアルタイム特性予測
US12474755B2 (en) * 2023-10-17 2025-11-18 Dell Products, L.P. Systems and methods for detecting presence or absence of a component on a circuit board
CN117234170B (zh) * 2023-11-16 2024-01-12 中钢集团武汉安全环保研究院有限公司 一种钢铁关键工艺参数监测管理方法和装置
EP4703826A1 (en) 2024-08-30 2026-03-04 Siemens Aktiengesellschaft Computer-implemented method and apparatus for monitoring an industrial system

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06301690A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 製造ライン及び該製造ラインにおける条件設定方法
JPH06304723A (ja) * 1993-04-20 1994-11-01 Nippon Steel Corp 品質制御診断装置および診断方法
IT1272036B (it) * 1993-11-05 1997-06-11 Marelli Autronica Sistema di registraziome per una linea di produzione.
US7401066B2 (en) 2002-03-21 2008-07-15 Applied Materials, Inc. Correlation of end-of-line data mining with process tool data mining
US6751518B1 (en) 2002-04-29 2004-06-15 Advanced Micro Devices, Inc. Dynamic process state adjustment of a processing tool to reduce non-uniformity
US6773931B2 (en) 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
US6834213B1 (en) * 2003-01-06 2004-12-21 Advanced Micro Devices, Inc. Process control based upon a metrology delay
US7277824B1 (en) * 2005-07-13 2007-10-02 Advanced Micro Devices, Inc. Method and apparatus for classifying faults based on wafer state data and sensor tool trace data
US7359759B2 (en) 2005-10-31 2008-04-15 Taiwan Semiconductor Manufacturing Company Method and system for virtual metrology in semiconductor manufacturing
US7765020B2 (en) 2007-05-04 2010-07-27 Applied Materials, Inc. Graphical user interface for presenting multivariate fault contributions
JP5169096B2 (ja) 2007-09-14 2013-03-27 Jfeスチール株式会社 品質予測装置、品質予測方法及び製品の製造方法
CN101621016B (zh) 2008-07-02 2011-10-05 中芯国际集成电路制造(上海)有限公司 在制造集成电路中用于缺陷检测的方法和系统
JP5597047B2 (ja) 2010-07-06 2014-10-01 三菱電機株式会社 発電プラントの運転要領表示システム
US9915940B2 (en) 2011-10-31 2018-03-13 Applied Materials, Llc Bi-directional association and graphical acquisition of time-based equipment sensor data and material-based metrology statistical process control data
SG11201405844XA (en) * 2012-03-18 2014-10-30 Mfg System Insights India Pvt Ltd A system and apparatus that identifies, captures, classifies and deploys tribal knowledge unique to each operator in a semi-automated manufacturing set-up to execute automatic technical superintending
US20140149296A1 (en) 2012-11-29 2014-05-29 Applied Materials, Inc. Enhanced preventative maintenance utilizing direct part marking
US9372922B2 (en) * 2013-07-11 2016-06-21 Neura, Inc. Data consolidation mechanisms for internet of things integration platform
US10284651B2 (en) * 2014-02-27 2019-05-07 Harman International Industries, Incorporated Data aggregation and delivery
US9881072B2 (en) * 2014-08-14 2018-01-30 McAFEE, LLC. Dynamic feature set management
US20160342147A1 (en) 2015-05-19 2016-11-24 Applied Materials, Inc. Methods and systems for applying run-to-run control and virtual metrology to reduce equipment recovery time
WO2017016839A1 (en) 2015-07-24 2017-02-02 Asml Netherlands B.V. Inspection apparatus, inspection method, lithographic apparatus and manufacturing method
SG11201509818UA (en) 2015-07-24 2017-03-30 Certis Cisco Security Pte Ltd System and method for high speed threat intelligence management using unsupervised machine learning and prioritization algorithms
EP3347827A4 (en) * 2015-09-09 2019-03-27 INTEL Corporation SECURITY MANAGEMENT OF SEPARATE APPLICATIONS
US20170090866A1 (en) * 2015-09-25 2017-03-30 Robert L. Vaughn Universal sensor and/or sensor cluster to provide a detection pattern
US10289949B2 (en) * 2015-09-29 2019-05-14 International Business Machines Corporation Incident prediction and response using deep learning techniques and multimodal data
JP6059375B1 (ja) * 2016-02-09 2017-01-11 ファナック株式会社 生産制御システムおよび統合生産制御システム
US10747768B2 (en) * 2016-06-14 2020-08-18 Fuji Xerox Co., Ltd. Data processing system and data processing method
JP6403722B2 (ja) 2016-07-21 2018-10-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム
US10571899B2 (en) 2016-08-18 2020-02-25 i Smart Technologies Corporation Operating state acquisition apparatus, production management system, and production management method for manufacturing line
JP6382911B2 (ja) 2016-11-01 2018-08-29 ファナック株式会社 ワイヤ放電加工機
WO2018123116A1 (ja) * 2016-12-26 2018-07-05 三菱電機株式会社 加工工程生成装置、加工工程生成方法およびプログラム
WO2018204410A1 (en) * 2017-05-04 2018-11-08 Minds Mechanical, Llc Metrology system for machine learning-based manufacturing error predictions
TWI644190B (zh) 2017-06-29 2018-12-11 台灣積體電路製造股份有限公司 製程系統與製程方法
CN111095955B (zh) * 2017-07-27 2023-09-08 上游安全有限公司 用于联网车辆网络安全的系统和方法
TWI647564B (zh) 2017-11-07 2019-01-11 先智雲端數據股份有限公司 用於診斷資料中心儲存設備之剩餘壽命的方法與系統
KR102813170B1 (ko) 2018-03-13 2025-05-28 어플라이드 머티어리얼스, 인코포레이티드 반도체 처리의 모니터링을 위한 기계 학습 시스템들
US11037573B2 (en) * 2018-09-05 2021-06-15 Hitachi, Ltd. Management and execution of equipment maintenance
US12067485B2 (en) * 2018-09-28 2024-08-20 Applied Materials, Inc Long short-term memory anomaly detection for multi-sensor equipment monitoring
US10930531B2 (en) * 2018-10-09 2021-02-23 Applied Materials, Inc. Adaptive control of wafer-to-wafer variability in device performance in advanced semiconductor processes
US10705514B2 (en) * 2018-10-09 2020-07-07 Applied Materials, Inc. Adaptive chamber matching in advanced semiconductor process control
US11263737B2 (en) 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
WO2020205339A1 (en) 2019-03-29 2020-10-08 Lam Research Corporation Model-based scheduling for substrate processing systems
US11279032B2 (en) * 2019-04-11 2022-03-22 Applied Materials, Inc. Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots
US11610076B2 (en) * 2019-08-07 2023-03-21 Applied Materials, Inc. Automatic and adaptive fault detection and classification limits
WO2021030833A1 (en) * 2019-08-09 2021-02-18 Lam Research Corporation Model based control of wafer non-uniformity
US20210088867A1 (en) * 2019-09-20 2021-03-25 Kinestral Technologies, Inc. Quality control of an electrochromic device
US11513504B2 (en) * 2019-10-18 2022-11-29 Applied Materials, Inc. Characterizing and monitoring electrical components of manufacturing equipment
US11749543B2 (en) * 2020-07-06 2023-09-05 Applied Materials, Inc. Chamber matching and calibration
US11371148B2 (en) * 2020-08-24 2022-06-28 Applied Materials, Inc. Fabricating a recursive flow gas distribution stack using multiple layers
WO2022140097A1 (en) * 2020-12-21 2022-06-30 Lam Research Corporation Adaptive model training for process control of semiconductor manufacturing equipment
US11853042B2 (en) * 2021-02-17 2023-12-26 Applied Materials, Inc. Part, sensor, and metrology data integration
US12189380B2 (en) * 2022-01-27 2025-01-07 Applied Materials, Inc. Diagnostic tool to tool matching and comparative drill-down analysis methods for manufacturing equipment
US20240329626A1 (en) * 2023-03-28 2024-10-03 Applied Materials, Inc. Digital simulation for semiconductor manufacturing processes

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