JP7471312B2 - センサ計測データ統合 - Google Patents

センサ計測データ統合 Download PDF

Info

Publication number
JP7471312B2
JP7471312B2 JP2021547158A JP2021547158A JP7471312B2 JP 7471312 B2 JP7471312 B2 JP 7471312B2 JP 2021547158 A JP2021547158 A JP 2021547158A JP 2021547158 A JP2021547158 A JP 2021547158A JP 7471312 B2 JP7471312 B2 JP 7471312B2
Authority
JP
Japan
Prior art keywords
data
sensor
identifier
metrology
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021547158A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022520247A (ja
JP2022520247A5 (https=
JPWO2020172186A5 (https=
Inventor
シドハース バーティア,
ギャレット エイチ. シン,
ヘン チェン パイ,
プラモド ナンビア,
ガネーシュ バラスブラマニアン,
イルファン ジャミール,
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2022520247A publication Critical patent/JP2022520247A/ja
Publication of JP2022520247A5 publication Critical patent/JP2022520247A5/ja
Publication of JPWO2020172186A5 publication Critical patent/JPWO2020172186A5/ja
Priority to JP2024015763A priority Critical patent/JP2024059663A/ja
Application granted granted Critical
Publication of JP7471312B2 publication Critical patent/JP7471312B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0286Modifications to the monitored process, e.g. stopping operation or adapting control
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/404Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0221Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0262Confirmation of fault detection, e.g. extra checks to confirm that a failure has indeed occurred
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0286Modifications to the monitored process, e.g. stopping operation or adapting control
    • G05B23/0294Optimizing process, e.g. process efficiency, product quality
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/3089Monitoring arrangements determined by the means or processing involved in sensing the monitored data, e.g. interfaces, connectors, sensors, probes, agents
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/34Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment
    • G06F11/3447Performance evaluation by modeling
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/34Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment
    • G06F11/3466Performance evaluation by tracing or monitoring
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/34Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment
    • G06F11/3466Performance evaluation by tracing or monitoring
    • G06F11/3495Performance evaluation by tracing or monitoring for systems
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • G06N3/09Supervised learning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/24Pc safety
    • G05B2219/24065Real time diagnostics
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31357Observer based fault detection, use model
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32194Quality prediction
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32201Build statistical model of past normal proces, compare with actual process
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32252Scheduling production, machining, job shop
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Software Systems (AREA)
  • Mathematical Physics (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Hardware Design (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Human Computer Interaction (AREA)
  • General Health & Medical Sciences (AREA)
  • Computational Linguistics (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Factory Administration (AREA)
  • Image Analysis (AREA)
  • Atmospheric Sciences (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Ecology (AREA)
  • Environmental Sciences (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Inspection Of Paper Currency And Valuable Securities (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
JP2021547158A 2019-02-19 2020-02-18 センサ計測データ統合 Active JP7471312B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024015763A JP2024059663A (ja) 2019-02-19 2024-02-05 センサ計測データ統合

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962807619P 2019-02-19 2019-02-19
US62/807,619 2019-02-19
US16/791,081 2020-02-14
US16/791,081 US11592812B2 (en) 2019-02-19 2020-02-14 Sensor metrology data integration
PCT/US2020/018673 WO2020172186A1 (en) 2019-02-19 2020-02-18 Sensor metrology data integration

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024015763A Division JP2024059663A (ja) 2019-02-19 2024-02-05 センサ計測データ統合

Publications (4)

Publication Number Publication Date
JP2022520247A JP2022520247A (ja) 2022-03-29
JP2022520247A5 JP2022520247A5 (https=) 2023-03-01
JPWO2020172186A5 JPWO2020172186A5 (https=) 2023-03-01
JP7471312B2 true JP7471312B2 (ja) 2024-04-19

Family

ID=72043419

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021547158A Active JP7471312B2 (ja) 2019-02-19 2020-02-18 センサ計測データ統合
JP2024015763A Pending JP2024059663A (ja) 2019-02-19 2024-02-05 センサ計測データ統合

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024015763A Pending JP2024059663A (ja) 2019-02-19 2024-02-05 センサ計測データ統合

Country Status (7)

Country Link
US (3) US11592812B2 (https=)
JP (2) JP7471312B2 (https=)
KR (2) KR102611824B1 (https=)
CN (2) CN113454552B (https=)
SG (1) SG11202108577UA (https=)
TW (2) TW202538611A (https=)
WO (1) WO2020172186A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9606519B2 (en) * 2013-10-14 2017-03-28 Applied Materials, Inc. Matching process controllers for improved matching of process
US11940488B2 (en) 2017-01-05 2024-03-26 Xcalipr Corporation Systems and methods for high precision optical characterization of carrier transport properties in semiconductor manufacturing
US11592812B2 (en) * 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
US12283503B2 (en) 2020-07-22 2025-04-22 Applied Materials, Inc. Substrate measurement subsystem
US11688616B2 (en) 2020-07-22 2023-06-27 Applied Materials, Inc. Integrated substrate measurement system to improve manufacturing process performance
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
US11375582B2 (en) * 2020-10-16 2022-06-28 Verizon Patent And Licensing Inc. Systems and methods for scalable edge-based microcontrollers
CN112364561B (zh) * 2020-10-26 2022-07-26 上海感探号信息科技有限公司 控车动作修正方法、装置、电子设备和存储介质
TWI777317B (zh) * 2020-11-30 2022-09-11 智慧貼紙股份有限公司 多點量測系統及其方法
JP7632968B2 (ja) * 2021-02-04 2025-02-19 東京エレクトロン株式会社 情報処理装置、プログラム及びプロセス条件探索方法
US11853042B2 (en) 2021-02-17 2023-12-26 Applied Materials, Inc. Part, sensor, and metrology data integration
US11532525B2 (en) * 2021-03-03 2022-12-20 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
US12568791B2 (en) 2021-03-03 2026-03-03 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
CN117121027A (zh) * 2021-04-08 2023-11-24 3M创新有限公司 粘合剂预测系统
US12506024B2 (en) 2021-07-08 2025-12-23 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization
US12131105B2 (en) * 2021-09-15 2024-10-29 Applied Materials, Inc. Virtual measurement of conditions proximate to a substrate with physics-informed compressed sensing
US12111355B2 (en) * 2021-11-22 2024-10-08 Onto Innovation Inc. Semiconductor substrate yield prediction based on spectra data from multiple substrate dies
US12585232B2 (en) * 2021-12-21 2026-03-24 Applied Materials, Inc. Substrate support characterization to build a digital twin
US12189380B2 (en) 2022-01-27 2025-01-07 Applied Materials, Inc. Diagnostic tool to tool matching and comparative drill-down analysis methods for manufacturing equipment
US11961030B2 (en) * 2022-01-27 2024-04-16 Applied Materials, Inc. Diagnostic tool to tool matching methods for manufacturing equipment
US12298748B2 (en) 2022-01-27 2025-05-13 Applied Materials, Inc. Diagnostic tool to tool matching and full-trace drill-down analysis methods for manufacturing equipment
US12191126B2 (en) * 2022-02-15 2025-01-07 Applied Materials, Inc. Process control knob estimation
US12105504B2 (en) * 2022-04-27 2024-10-01 Applied Materials, Inc. Run-to-run control at a manufacturing system using machine learning
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
US20240005143A1 (en) * 2022-06-30 2024-01-04 Capital One Services, Llc Machine learning for power consumption attribution
US11731317B1 (en) * 2022-07-08 2023-08-22 The Boeing Company System and method for material manufacturing based on predicted properties of unconsolidated composite material
US12566132B2 (en) 2022-07-08 2026-03-03 The Boeing Company Real time contaminants identification during composite material manufacturing via non-contact chemical sensing
US12422831B2 (en) * 2022-07-08 2025-09-23 The Boeing Company Property prediction for unconsolidated composite materials
US20240037442A1 (en) * 2022-07-26 2024-02-01 Applied Materials, Inc. Generating indications of learning of models for semiconductor processing
CN115314995B (zh) * 2022-08-08 2023-08-04 深圳市海曼科技股份有限公司 一种无线级联消防定位方法、装置、电子设备及存储介质
US12591805B2 (en) * 2022-08-22 2026-03-31 Applied Materials, Inc. Equipment parameter management at a manufacturing system using machine learning
JP7274655B1 (ja) 2022-09-09 2023-05-16 Dmg森精機株式会社 携帯端末および計測管理プログラム
US12504726B2 (en) 2022-11-28 2025-12-23 Applied Materials, Inc. Determining equipment constant updates by machine learning
US12498705B2 (en) 2022-11-28 2025-12-16 Applied Materials, Inc. Chamber matching by equipment constant updates
US12560916B2 (en) 2022-11-28 2026-02-24 Applied Materials, Inc. Adjusting chamber performance by equipment constant updates
US20240184858A1 (en) * 2022-12-05 2024-06-06 Applied Materials, Inc. Methods and mechanisms for automatic sensor grouping to improve anomaly detection
WO2024166508A1 (ja) * 2023-02-06 2024-08-15 パナソニックIpマネジメント株式会社 情報処理方法、および、情報処理装置
JP2024144254A (ja) * 2023-03-30 2024-10-11 ザ・ボーイング・カンパニー 未固化複合材料のリアルタイム特性予測
US12474755B2 (en) * 2023-10-17 2025-11-18 Dell Products, L.P. Systems and methods for detecting presence or absence of a component on a circuit board
CN117234170B (zh) * 2023-11-16 2024-01-12 中钢集团武汉安全环保研究院有限公司 一种钢铁关键工艺参数监测管理方法和装置
EP4703826A1 (en) 2024-08-30 2026-03-04 Siemens Aktiengesellschaft Computer-implemented method and apparatus for monitoring an industrial system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017142595A (ja) 2016-02-09 2017-08-17 ファナック株式会社 生産制御システムおよび統合生産制御システム
WO2018123116A1 (ja) 2016-12-26 2018-07-05 三菱電機株式会社 加工工程生成装置、加工工程生成方法およびプログラム

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06301690A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 製造ライン及び該製造ラインにおける条件設定方法
JPH06304723A (ja) * 1993-04-20 1994-11-01 Nippon Steel Corp 品質制御診断装置および診断方法
IT1272036B (it) * 1993-11-05 1997-06-11 Marelli Autronica Sistema di registraziome per una linea di produzione.
US7401066B2 (en) 2002-03-21 2008-07-15 Applied Materials, Inc. Correlation of end-of-line data mining with process tool data mining
US6751518B1 (en) 2002-04-29 2004-06-15 Advanced Micro Devices, Inc. Dynamic process state adjustment of a processing tool to reduce non-uniformity
US6773931B2 (en) 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
US6834213B1 (en) * 2003-01-06 2004-12-21 Advanced Micro Devices, Inc. Process control based upon a metrology delay
US7277824B1 (en) * 2005-07-13 2007-10-02 Advanced Micro Devices, Inc. Method and apparatus for classifying faults based on wafer state data and sensor tool trace data
US7359759B2 (en) 2005-10-31 2008-04-15 Taiwan Semiconductor Manufacturing Company Method and system for virtual metrology in semiconductor manufacturing
US7765020B2 (en) 2007-05-04 2010-07-27 Applied Materials, Inc. Graphical user interface for presenting multivariate fault contributions
JP5169096B2 (ja) 2007-09-14 2013-03-27 Jfeスチール株式会社 品質予測装置、品質予測方法及び製品の製造方法
CN101621016B (zh) 2008-07-02 2011-10-05 中芯国际集成电路制造(上海)有限公司 在制造集成电路中用于缺陷检测的方法和系统
JP5597047B2 (ja) 2010-07-06 2014-10-01 三菱電機株式会社 発電プラントの運転要領表示システム
US9915940B2 (en) 2011-10-31 2018-03-13 Applied Materials, Llc Bi-directional association and graphical acquisition of time-based equipment sensor data and material-based metrology statistical process control data
SG11201405844XA (en) * 2012-03-18 2014-10-30 Mfg System Insights India Pvt Ltd A system and apparatus that identifies, captures, classifies and deploys tribal knowledge unique to each operator in a semi-automated manufacturing set-up to execute automatic technical superintending
US20140149296A1 (en) 2012-11-29 2014-05-29 Applied Materials, Inc. Enhanced preventative maintenance utilizing direct part marking
US9372922B2 (en) * 2013-07-11 2016-06-21 Neura, Inc. Data consolidation mechanisms for internet of things integration platform
US10284651B2 (en) * 2014-02-27 2019-05-07 Harman International Industries, Incorporated Data aggregation and delivery
US9881072B2 (en) * 2014-08-14 2018-01-30 McAFEE, LLC. Dynamic feature set management
US20160342147A1 (en) 2015-05-19 2016-11-24 Applied Materials, Inc. Methods and systems for applying run-to-run control and virtual metrology to reduce equipment recovery time
WO2017016839A1 (en) 2015-07-24 2017-02-02 Asml Netherlands B.V. Inspection apparatus, inspection method, lithographic apparatus and manufacturing method
SG11201509818UA (en) 2015-07-24 2017-03-30 Certis Cisco Security Pte Ltd System and method for high speed threat intelligence management using unsupervised machine learning and prioritization algorithms
EP3347827A4 (en) * 2015-09-09 2019-03-27 INTEL Corporation SECURITY MANAGEMENT OF SEPARATE APPLICATIONS
US20170090866A1 (en) * 2015-09-25 2017-03-30 Robert L. Vaughn Universal sensor and/or sensor cluster to provide a detection pattern
US10289949B2 (en) * 2015-09-29 2019-05-14 International Business Machines Corporation Incident prediction and response using deep learning techniques and multimodal data
US10747768B2 (en) * 2016-06-14 2020-08-18 Fuji Xerox Co., Ltd. Data processing system and data processing method
JP6403722B2 (ja) 2016-07-21 2018-10-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム
US10571899B2 (en) 2016-08-18 2020-02-25 i Smart Technologies Corporation Operating state acquisition apparatus, production management system, and production management method for manufacturing line
JP6382911B2 (ja) 2016-11-01 2018-08-29 ファナック株式会社 ワイヤ放電加工機
WO2018204410A1 (en) * 2017-05-04 2018-11-08 Minds Mechanical, Llc Metrology system for machine learning-based manufacturing error predictions
TWI644190B (zh) 2017-06-29 2018-12-11 台灣積體電路製造股份有限公司 製程系統與製程方法
CN111095955B (zh) * 2017-07-27 2023-09-08 上游安全有限公司 用于联网车辆网络安全的系统和方法
TWI647564B (zh) 2017-11-07 2019-01-11 先智雲端數據股份有限公司 用於診斷資料中心儲存設備之剩餘壽命的方法與系統
KR102813170B1 (ko) 2018-03-13 2025-05-28 어플라이드 머티어리얼스, 인코포레이티드 반도체 처리의 모니터링을 위한 기계 학습 시스템들
US11037573B2 (en) * 2018-09-05 2021-06-15 Hitachi, Ltd. Management and execution of equipment maintenance
US12067485B2 (en) * 2018-09-28 2024-08-20 Applied Materials, Inc Long short-term memory anomaly detection for multi-sensor equipment monitoring
US10930531B2 (en) * 2018-10-09 2021-02-23 Applied Materials, Inc. Adaptive control of wafer-to-wafer variability in device performance in advanced semiconductor processes
US10705514B2 (en) * 2018-10-09 2020-07-07 Applied Materials, Inc. Adaptive chamber matching in advanced semiconductor process control
US11263737B2 (en) 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
WO2020205339A1 (en) 2019-03-29 2020-10-08 Lam Research Corporation Model-based scheduling for substrate processing systems
US11279032B2 (en) * 2019-04-11 2022-03-22 Applied Materials, Inc. Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots
US11610076B2 (en) * 2019-08-07 2023-03-21 Applied Materials, Inc. Automatic and adaptive fault detection and classification limits
WO2021030833A1 (en) * 2019-08-09 2021-02-18 Lam Research Corporation Model based control of wafer non-uniformity
US20210088867A1 (en) * 2019-09-20 2021-03-25 Kinestral Technologies, Inc. Quality control of an electrochromic device
US11513504B2 (en) * 2019-10-18 2022-11-29 Applied Materials, Inc. Characterizing and monitoring electrical components of manufacturing equipment
US11749543B2 (en) * 2020-07-06 2023-09-05 Applied Materials, Inc. Chamber matching and calibration
US11371148B2 (en) * 2020-08-24 2022-06-28 Applied Materials, Inc. Fabricating a recursive flow gas distribution stack using multiple layers
WO2022140097A1 (en) * 2020-12-21 2022-06-30 Lam Research Corporation Adaptive model training for process control of semiconductor manufacturing equipment
US11853042B2 (en) * 2021-02-17 2023-12-26 Applied Materials, Inc. Part, sensor, and metrology data integration
US12189380B2 (en) * 2022-01-27 2025-01-07 Applied Materials, Inc. Diagnostic tool to tool matching and comparative drill-down analysis methods for manufacturing equipment
US20240329626A1 (en) * 2023-03-28 2024-10-03 Applied Materials, Inc. Digital simulation for semiconductor manufacturing processes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017142595A (ja) 2016-02-09 2017-08-17 ファナック株式会社 生産制御システムおよび統合生産制御システム
WO2018123116A1 (ja) 2016-12-26 2018-07-05 三菱電機株式会社 加工工程生成装置、加工工程生成方法およびプログラム

Also Published As

Publication number Publication date
JP2022520247A (ja) 2022-03-29
CN113454552A (zh) 2021-09-28
TW202040500A (zh) 2020-11-01
KR20230169475A (ko) 2023-12-15
KR20210118243A (ko) 2021-09-29
US12366853B2 (en) 2025-07-22
US20230205196A1 (en) 2023-06-29
TW202538611A (zh) 2025-10-01
US20200264335A1 (en) 2020-08-20
CN113454552B (zh) 2024-03-12
JP2024059663A (ja) 2024-05-01
SG11202108577UA (en) 2021-09-29
TW202403658A (zh) 2024-01-16
WO2020172186A1 (en) 2020-08-27
CN118131709A (zh) 2024-06-04
US11592812B2 (en) 2023-02-28
US20250271847A1 (en) 2025-08-28
KR102611824B1 (ko) 2023-12-07
TWI818153B (zh) 2023-10-11

Similar Documents

Publication Publication Date Title
JP7471312B2 (ja) センサ計測データ統合
US11610076B2 (en) Automatic and adaptive fault detection and classification limits
US11853042B2 (en) Part, sensor, and metrology data integration
TW202346959A (zh) 用於製造設備的診斷工具與工具之匹配和比較下鑽分析方法
TWI831893B (zh) 用於高度共線響應空間中的規範性分析的方法、系統與電腦可讀取媒體
TW201423883A (zh) 用於半導體製造的自動化工具參數影響識別系統的方法和裝置
TW202343177A (zh) 用於製造設備的診斷工具與工具之匹配和全跡比較下鑽分析方法
JP7808302B2 (ja) 測定値違反解析を使用したプロセス異常の識別
TW202343176A (zh) 用於製造設備的診斷工具與工具之匹配方法
TW202409764A (zh) 用於基板處理設備的多維感測器資料的整體分析
TW202424831A (zh) 在使用機器學習的製造系統處的裝備參數管理
WO2024092057A1 (en) Classification of defect patterns of substrates
TWI920460B (zh) 用於感測器計量資料整合的方法、系統與電腦可讀取媒體
KR102953550B1 (ko) 부품, 센서, 및 계측 데이터 통합
US20260064925A1 (en) Substrate process data labeling
TWI913902B (zh) 用於高度共線響應空間中的規範性分析的方法、系統與電腦可讀取媒體
KR20260054733A (ko) 부품, 센서, 및 계측 데이터 통합

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230220

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230425

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230724

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231003

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240205

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20240220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240319

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240409

R150 Certificate of patent or registration of utility model

Ref document number: 7471312

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150