JPWO2020171004A1 - - Google Patents

Info

Publication number
JPWO2020171004A1
JPWO2020171004A1 JP2021501971A JP2021501971A JPWO2020171004A1 JP WO2020171004 A1 JPWO2020171004 A1 JP WO2020171004A1 JP 2021501971 A JP2021501971 A JP 2021501971A JP 2021501971 A JP2021501971 A JP 2021501971A JP WO2020171004 A1 JPWO2020171004 A1 JP WO2020171004A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021501971A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020171004A1 publication Critical patent/JPWO2020171004A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021501971A 2019-02-21 2020-02-17 Pending JPWO2020171004A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019029777 2019-02-21
PCT/JP2020/005993 WO2020171004A1 (ja) 2019-02-21 2020-02-17 硬化性樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
JPWO2020171004A1 true JPWO2020171004A1 (ja) 2020-08-27

Family

ID=72143430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021501971A Pending JPWO2020171004A1 (ja) 2019-02-21 2020-02-17

Country Status (4)

Country Link
JP (1) JPWO2020171004A1 (ja)
CN (1) CN113195585A (ja)
TW (1) TW202035558A (ja)
WO (1) WO2020171004A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268721A (ja) * 1985-05-24 1986-11-28 Asahi Chem Ind Co Ltd エポキシ樹脂硬化剤
JP4749027B2 (ja) * 2004-05-20 2011-08-17 日本化薬株式会社 フェノール樹脂、エポキシ樹脂およびその硬化物
TWI278463B (en) * 2006-09-04 2007-04-11 Chang Chun Plastics Co Ltd Flame retardant resin composition
JP5024605B2 (ja) * 2007-03-20 2012-09-12 Ｄｉｃ株式会社 硬化性樹脂組成物、その硬化物、新規フェノール樹脂及びその製造方法
JP5365014B2 (ja) * 2008-02-01 2013-12-11 住友ベークライト株式会社 半導体封止用樹脂組成物及び半導体装置
JP2009231605A (ja) * 2008-03-24 2009-10-08 Sekisui Chem Co Ltd 接着剤及び接合体の製造方法
JP5463110B2 (ja) * 2009-09-24 2014-04-09 ナミックス株式会社 カバーレイフィルム
US20120205822A1 (en) * 2009-10-26 2012-08-16 Yusuke Tanaka Resin composition for encapsulating semiconductor and semiconductor device using the resin composition
JP5736718B2 (ja) * 2010-10-18 2015-06-17 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法
JP5212578B1 (ja) * 2011-05-31 2013-06-19 日立化成株式会社 めっきプロセス用プライマー層、配線板用積層板及びその製造方法、多層配線板及びその製造方法

Also Published As

Publication number Publication date
WO2020171004A1 (ja) 2020-08-27
CN113195585A (zh) 2021-07-30
TW202035558A (zh) 2020-10-01

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