JPWO2020162144A1 - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
JPWO2020162144A1
JPWO2020162144A1 JP2020571070A JP2020571070A JPWO2020162144A1 JP WO2020162144 A1 JPWO2020162144 A1 JP WO2020162144A1 JP 2020571070 A JP2020571070 A JP 2020571070A JP 2020571070 A JP2020571070 A JP 2020571070A JP WO2020162144 A1 JPWO2020162144 A1 JP WO2020162144A1
Authority
JP
Japan
Prior art keywords
polishing
nitrogen
polishing composition
acid
containing organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020571070A
Other languages
English (en)
Japanese (ja)
Inventor
誼之 田邉
恵 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of JPWO2020162144A1 publication Critical patent/JPWO2020162144A1/ja
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2020571070A 2019-02-05 2020-01-20 研磨用組成物 Pending JPWO2020162144A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019018930 2019-02-05
JP2019018930 2019-02-05
PCT/JP2020/001646 WO2020162144A1 (ja) 2019-02-05 2020-01-20 研磨用組成物

Publications (1)

Publication Number Publication Date
JPWO2020162144A1 true JPWO2020162144A1 (ja) 2021-12-09

Family

ID=71947985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020571070A Pending JPWO2020162144A1 (ja) 2019-02-05 2020-01-20 研磨用組成物

Country Status (3)

Country Link
JP (1) JPWO2020162144A1 (zh)
TW (1) TW202039718A (zh)
WO (1) WO2020162144A1 (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5497400B2 (ja) * 2009-10-14 2014-05-21 日本化学工業株式会社 半導体ウエハ研磨用組成物および研磨方法
WO2015019706A1 (ja) * 2013-08-09 2015-02-12 株式会社フジミインコーポレーテッド 研磨済研磨対象物の製造方法および研磨用組成物キット
JP6250454B2 (ja) * 2014-03-27 2017-12-20 株式会社フジミインコーポレーテッド シリコン材料研磨用組成物
JP6990969B2 (ja) * 2016-09-29 2022-02-03 株式会社フジミインコーポレーテッド 砥粒分散液、容器入り砥粒分散液およびその製造方法

Also Published As

Publication number Publication date
WO2020162144A1 (ja) 2020-08-13
TW202039718A (zh) 2020-11-01

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