JPWO2020094053A5 - - Google Patents
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- JPWO2020094053A5 JPWO2020094053A5 JP2021524229A JP2021524229A JPWO2020094053A5 JP WO2020094053 A5 JPWO2020094053 A5 JP WO2020094053A5 JP 2021524229 A JP2021524229 A JP 2021524229A JP 2021524229 A JP2021524229 A JP 2021524229A JP WO2020094053 A5 JPWO2020094053 A5 JP WO2020094053A5
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- JP
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- Prior art keywords
- injection
- channel
- cleaned
- atomized
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 claims 30
- 239000007788 liquid Substances 0.000 claims 27
- 238000002347 injection Methods 0.000 claims 25
- 239000007924 injection Substances 0.000 claims 25
- 238000005507 spraying Methods 0.000 claims 13
- 239000007921 spray Substances 0.000 claims 12
- 238000000889 atomisation Methods 0.000 claims 9
- 239000000969 carrier Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000000694 effects Effects 0.000 claims 1
- 230000001105 regulatory Effects 0.000 claims 1
Claims (17)
洗浄液を噴霧して液滴を形成する際に、前記洗浄液を霧化する霧化構造と、
決定された方向に沿ってガスを噴霧して、噴霧された前記ガスを前記液滴に衝突させて霧化粒子を形成するように構成された噴射構造とを含み、
前記霧化構造は、霧化体を含み、前記霧化体内に霧化チャネルが配置されており、前記霧化チャネルは、第1の方向に沿って前記霧化体を貫通しており、前記霧化チャネルの液体入口端が、洗浄液源に接続されており、前記霧化チャネルを形成する前記霧化体の部分は、半導体結晶材料からなり、前記噴霧デバイスは、電極パルスシステムをさらに含み、前記電極パルスシステムは、前記半導体結晶材料にパルス電圧を印加して、前記霧化チャネルから前記洗浄液を噴霧するときに前記洗浄液に前記液滴を形成させる電歪効果を前記半導体結晶材料に生成させるように構成されている、噴霧デバイス。 A spraying device including a first nozzle, wherein the first nozzle is
An atomizing structure that atomizes the cleaning liquid when spraying the cleaning liquid to form droplets.
Including a jet structure configured to spray a gas along a determined direction and cause the sprayed gas to collide with the droplets to form atomized particles.
The atomized structure includes an atomized body, and an atomized body is arranged in the atomized body, and the atomized channel penetrates the atomized body along a first direction. The liquid inlet end of the atomization channel is connected to a cleaning liquid source, the portion of the atomizer forming the atomization channel is made of a semiconductor crystal material, and the spray device further comprises an electrode pulse system. The electrode pulse system applies a pulse voltage to the semiconductor crystal material to cause the semiconductor crystal material to generate an electrolytic strain effect that causes the cleaning liquid to form the droplets when the cleaning liquid is sprayed from the atomization channel. A spray device that is configured to .
前記複数の縁部は、前記中央部の周囲に間隔をおいて位置し、前記中央部に固定的に接続されており、縁部チャネルが、前記複数の縁部に配置されており、前記縁部チャネルの液体入口端は、前記中央チャネルの液体出口端に接続されており、
複数の霧化チャネルが含まれており、前記複数の霧化チャネルは、前記複数の縁部に一対一に対応して配置されており、前記縁部の前記複数の霧化チャネルの各々は、複数の霧化孔を含み、前記複数の霧化孔の液体入口端は、前記縁部チャネルの液体出口端に接続され、前記複数の霧化孔は、前記第1の方向に沿って前記複数の縁部を貫通する、請求項2に記載の噴霧デバイス。 The atomized body includes a central portion and a plurality of edge portions, and a central channel is arranged in the central portion.
The plurality of edges are spaced apart from the periphery of the central portion and are fixedly connected to the central portion, and edge channels are arranged at the plurality of edges, and the edges are arranged. The liquid inlet end of the partial channel is connected to the liquid outlet end of the central channel.
A plurality of atomization channels are included, and the plurality of atomization channels are arranged on the plurality of edges in a one-to-one correspondence, and each of the plurality of atomization channels at the edges is described. The plurality of atomizing holes include the plurality of atomizing holes, the liquid inlet end of the plurality of atomizing holes is connected to the liquid outlet end of the edge channel, and the plurality of atomizing holes are the plurality of atomizing holes along the first direction. The spraying device according to claim 2 , which penetrates the edge of the surface.
前記ガス入口チャネルは、環状チャネルであり、前記液体入口チャネルを取り囲み、前記ガス入口チャネルは、前記ガスを供給するために噴射チャネルに接続されている、請求項7に記載の噴霧デバイス。 The first nozzle further includes a nozzle body, the nozzle body is connected to the central portion and the plurality of injection divided bodies, and a liquid inlet channel and a gas inlet channel are arranged in the nozzle body. The liquid inlet channel is connected to the atomization channel and is configured to supply the cleaning liquid to the atomization channel.
The spraying device of claim 7 , wherein the gas inlet channel is an annular channel, surrounds the liquid inlet channel, and the gas inlet channel is connected to an injection channel to supply the gas.
前記第1の駆動源は、前記第1のノズルを前記被洗浄面の縁と中心との間で前後に揺動するように駆動するように構成されており、
前記第1の液体入口パイプラインは、前記洗浄液を前記霧化構造に供給するように構成されており、第1の流量調整弁が、前記第1の液体入口パイプライン内に配置されており、前記ガス入口パイプラインは、前記ガスを前記噴射構造に供給するように構成されている、請求項1~9のいずれか1項に記載の噴霧デバイス。 Further equipped with a first liquid inlet pipeline, a gas inlet pipeline, and a first drive source,
The first drive source is configured to drive the first nozzle so as to swing back and forth between the edge and the center of the surface to be cleaned.
The first liquid inlet pipeline is configured to supply the cleaning liquid to the atomized structure, and the first flow rate regulating valve is arranged in the first liquid inlet pipeline. The spray device according to any one of claims 1 to 9 , wherein the gas inlet pipeline is configured to supply the gas to the injection structure.
前記第1の駆動アームは、前記被洗浄面に垂直な方向に沿って被洗浄加工片を搬送するように構成されたキャリアの側面に配置されており、
前記第1のノズルは、前記第1の駆動アームに配置され、前記キャリアの上に配置され、
前記第1の回転モータは、前記第1の駆動アームを前記被洗浄面の前記縁と前記中心との間で前後に揺動するように駆動するように構成される、請求項11に記載の噴霧デバイス。 The first drive source includes a first drive arm and a first rotary motor.
The first drive arm is arranged on the side surface of a carrier configured to convey a piece to be cleaned along a direction perpendicular to the surface to be cleaned.
The first nozzle is arranged on the first drive arm and is arranged on the carrier.
11. The eleventh claim, wherein the first rotary motor is configured to drive the first drive arm so as to swing back and forth between the edge of the surface to be cleaned and the center. Spray device.
前記第2のノズルは、前記洗浄液を前記被洗浄面に向かって噴霧するように構成されており、
前記第2の駆動源は、前記第2のノズルを前記被洗浄面の前記縁と前記中心との間で前後に揺動するように駆動するように構成されており、
前記第2の液体入口パイプラインは、前記洗浄液を前記第2のノズルに供給するように構成されており、
第2の流量調整弁が、前記第2の液体入口パイプライン内に配置されており、前記第2の液体入口パイプラインにおける前記洗浄液の流れは、前記第1の液体入口パイプラインにおける前記洗浄液の流れよりも大きい、請求項11に記載の噴霧デバイス。 Further equipped with a second nozzle, a second liquid inlet pipeline, and a second drive source,
The second nozzle is configured to spray the cleaning liquid toward the surface to be cleaned.
The second drive source is configured to drive the second nozzle so as to swing back and forth between the edge and the center of the surface to be cleaned.
The second liquid inlet pipeline is configured to supply the cleaning liquid to the second nozzle.
A second flow control valve is arranged in the second liquid inlet pipeline, and the flow of the cleaning liquid in the second liquid inlet pipeline is the flow of the cleaning liquid in the first liquid inlet pipeline. 11. The spraying device of claim 11 , which is larger than the flow.
前記第2の駆動アームは、前記被洗浄面に垂直な方向に沿って被洗浄加工片を搬送するように構成されたキャリアの側面に配置されており、
前記第2のノズルは、前記第2の駆動アームに配置され、前記キャリアの上に配置され、
前記第2の回転モータは、前記第2の駆動アームを前記被洗浄面の前記縁と前記中心との間で前後に揺動するように駆動するように構成される、請求項13に記載の噴霧デバイス。 The second drive source includes a second drive arm and a second rotary motor.
The second drive arm is arranged on the side surface of a carrier configured to convey the work piece to be cleaned along a direction perpendicular to the surface to be cleaned.
The second nozzle is placed on the second drive arm and placed on the carrier.
13. The thirteenth aspect of the present invention, wherein the second rotary motor is configured to drive the second drive arm so as to swing back and forth between the edge and the center of the surface to be cleaned. Spray device.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811324019.6A CN111162023B (en) | 2018-11-08 | 2018-11-08 | Spray device and cleaning equipment |
CN201811324019.6 | 2018-11-08 | ||
PCT/CN2019/115971 WO2020094053A1 (en) | 2018-11-08 | 2019-11-06 | Spraying apparatus and cleaning device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022506689A JP2022506689A (en) | 2022-01-17 |
JPWO2020094053A5 true JPWO2020094053A5 (en) | 2022-04-07 |
JP7179985B2 JP7179985B2 (en) | 2022-11-29 |
Family
ID=70555383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021524229A Active JP7179985B2 (en) | 2018-11-08 | 2019-11-06 | Atomizing devices and cleaning equipment |
Country Status (6)
Country | Link |
---|---|
US (1) | US11504727B2 (en) |
EP (1) | EP3879562A4 (en) |
JP (1) | JP7179985B2 (en) |
CN (1) | CN111162023B (en) |
TW (1) | TWI738108B (en) |
WO (1) | WO2020094053A1 (en) |
Families Citing this family (4)
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CL2018000341A1 (en) * | 2018-02-06 | 2018-07-06 | Ingeagro Eirl | Device and method of electrostatic application. |
CN111696852A (en) * | 2020-06-22 | 2020-09-22 | 徐文凯 | Method for cleaning third generation semiconductor |
CN115213158B (en) * | 2022-08-05 | 2023-08-11 | 无锡京运通科技有限公司 | Medicine adding device for preparing flaked monocrystalline silicon slice drop-down cleaning agent |
CN117165924B (en) * | 2023-11-03 | 2024-02-02 | 江苏微导纳米科技股份有限公司 | Spraying device, treatment equipment and spraying process of treatment equipment |
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2018
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2019
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- 2019-11-06 TW TW108140270A patent/TWI738108B/en active
- 2019-11-06 US US17/288,461 patent/US11504727B2/en active Active
- 2019-11-06 JP JP2021524229A patent/JP7179985B2/en active Active
- 2019-11-06 WO PCT/CN2019/115971 patent/WO2020094053A1/en unknown
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