CN115213158B - Medicine adding device for preparing flaked monocrystalline silicon slice drop-down cleaning agent - Google Patents
Medicine adding device for preparing flaked monocrystalline silicon slice drop-down cleaning agent Download PDFInfo
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- CN115213158B CN115213158B CN202210938828.6A CN202210938828A CN115213158B CN 115213158 B CN115213158 B CN 115213158B CN 202210938828 A CN202210938828 A CN 202210938828A CN 115213158 B CN115213158 B CN 115213158B
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- cleaning agent
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 24
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 14
- 239000003814 drug Substances 0.000 title abstract description 36
- 229940079593 drug Drugs 0.000 title description 11
- 238000004140 cleaning Methods 0.000 claims abstract description 100
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 96
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 88
- 239000010703 silicon Substances 0.000 claims abstract description 88
- 238000002360 preparation method Methods 0.000 claims abstract description 3
- 238000002156 mixing Methods 0.000 claims description 28
- 238000003756 stirring Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 abstract description 24
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000008030 elimination Effects 0.000 abstract description 4
- 238000003379 elimination reaction Methods 0.000 abstract description 4
- 238000004064 recycling Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 77
- 238000010408 sweeping Methods 0.000 description 6
- 238000007790 scraping Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application discloses a dosing device for preparing a thinned monocrystalline silicon wafer drop-in cleaning agent, and particularly relates to the field of silicon wafer preparation. According to the application, when the medicine is added, the medicine is uniformly dispersed on the surface of the independent silicon wafer, so that the uniform reaction on the surface of the independent silicon wafer is quickened, the elimination of impurities on the surface of the silicon wafer is more convenient, and meanwhile, the impurities are prevented from being mixed into a cleaning pool, so that the recycling rate of the cleaning agent is improved, and the cost is reduced.
Description
Technical Field
The application relates to the technical field of silicon wafer preparation, in particular to a dosing device for preparing a thinned monocrystalline silicon wafer drop-in cleaning agent.
Background
In the production of semiconductor devices, silicon wafers must be strictly cleaned. Trace contamination can also lead to device failure. The cleaning aims at removing surface pollution impurities including organic matters and inorganic matters. Some of these impurities exist in an atomic state or an ionic state, and some exist in a thin film form or a particle form on the surface of the silicon wafer. Various drawbacks can result. The method for removing the pollution comprises two methods of physical cleaning and chemical cleaning.
The application provides a chemical adding device for preparing a thinned monocrystalline silicon slice drop-in cleaning agent, which aims to clean silicon slice surface impurities in the production of semiconductor devices, and generally places the whole batch of silicon slices into a cleaning tank for cleaning at present, however, the content of the cleaning agent in the cleaning tank is reduced due to the fact that the content of the cleaned impurities is increased, and the quality and the efficiency of cleaning the silicon slices are affected.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the application provides a dosing device for preparing a thinned monocrystalline silicon wafer drop-on cleaning agent, which can accelerate the uniform reaction on the surface of an independent silicon wafer by uniformly dispersing the drug on the surface of the independent silicon wafer when adding the drug so as to solve the problems in the prior art.
In order to achieve the above purpose, the present application provides the following technical solutions: the chemical adding device for preparing the flaked monocrystalline silicon piece reduced-feeding cleaning agent comprises a main body mechanism, wherein a first cleaning mechanism is arranged on one side of the main body mechanism, an adjusting mechanism for adjusting the height of the first cleaning mechanism is fixedly arranged at the top of the first cleaning mechanism, a silicon piece limiting mechanism for fixing a silicon piece is fixedly arranged at the top of the first cleaning mechanism, a second cleaning mechanism for cleaning the surface of the silicon piece is arranged at the top of the first cleaning mechanism, the main body mechanism comprises a mixing bin, a plurality of chemical adding pipes are communicated with the top of the mixing bin, a supporting frame is fixedly arranged at the bottom of the mixing bin, a flow pipe is communicated with one side of the mixing bin, a plurality of branch pipes are communicated with the outer wall of the flow pipe in a linear and orderly equidistant state, and a cleaning pool is arranged at the bottom of each branch pipe;
the utility model discloses a mixing bin, including the fixed mounting, the bottom of mixing bin is fixed connection, the bottom fixedly connected with of fifth support is a plurality of telescopic links that are the equidistant state setting in proper order of linearity, first wiper mechanism includes the first support of fixed mounting in the telescopic link bottom, the bottom fixed mounting of first support has a plurality of second supports, one side fixed mounting of second support has the spacing ring corresponding with the bleeder, the bottom fixed mounting of second support has the third support, the bottom fixed mounting of third support has the fourth support, one side fixed mounting of fourth support has the tray, the bottom fixed mounting of tray has the filter plate, offer a plurality of to be the mesh that runs through the form setting on the filter plate, just the centre of a circle of tray, filter plate with the centre of a circle of spacing ring sets up on same vertical line.
By adopting the technical scheme, the medicines are uniformly dispersed on the surface of the single silicon wafer, so that the dispersion efficiency of the cleaning agent is quickened on one hand, the uniform reaction on the surface of the single silicon wafer is quickened on the other hand, and the elimination of organic matters, metal impurities, mechanical damage layers and other impurities on the surface of the silicon wafer is facilitated.
In a preferred embodiment, the inner cavity of the mixing bin is rotatably provided with a stirring shaft, the outer wall of the stirring shaft is fixedly provided with a plurality of blades, and the top of the mixing bin is fixedly provided with a stirrer connected with the stirring shaft.
By adopting the technical scheme, the medicines added into the inner cavity of the mixing bin can be mixed more uniformly, so that the medicines can be directly added into the cleaning pool through the flow pipe and the branch pipe for cleaning.
In a preferred embodiment, the silicon wafer limiting mechanism comprises a concentration detector fixedly installed at the bottom of the tray, a plurality of first sliding grooves and second sliding grooves are formed in the surface of the tray in an annular and sequentially equidistant state, a limiting rod is slidably installed in an inner cavity of the first sliding groove, and a sliding block is slidably installed in an inner cavity of the second sliding groove.
By adopting the technical scheme, the silicon wafer can be placed on the first supporting plate according to the size difference of the silicon wafer and is clamped and fixed by being extruded by the sliding block.
In a preferred embodiment, every two adjacent limit rods are connected in a sliding state, and the sliding block is sleeved on the outer wall of each two adjacent limit rods.
By adopting the technical scheme, the adjacent two limiting rods slide on the stacking surface in a staggered manner, so that the distance between the sliding block and the center point of the tray is increased, and the silicon wafer stacking device is suitable for silicon wafers with different sizes.
In a preferred embodiment, a first supporting plate is fixedly arranged at the bottom of the sliding block, a second supporting plate is fixedly arranged on the outer wall of the tray, and a spring connected with the sliding block is fixedly arranged on one side of the second supporting plate.
By adopting the technical scheme, when the silicon wafer is placed on the first supporting plate, the sliding block can be extruded according to the size of the silicon wafer, so that the sliding block slides in the inner cavity of the second sliding groove to extrude the spring, and therefore clamping force is formed to fix the silicon wafer.
In a preferred embodiment, one side of the sliding block is fixedly provided with a supporting block, the number of the supporting blocks is at least two, and the two supporting blocks are arranged in a mirror symmetry mode relative to the center line of the tray.
By adopting the technical scheme, when the silicon wafer is rectangular, the two longer sides of the silicon wafer can be clamped through the abutting blocks.
In a preferred embodiment, the second cleaning mechanism comprises a gear ring rotatably mounted on the outer wall of the limiting ring, two connecting rods which are obliquely arranged are fixedly mounted at the bottom of the gear ring, a first cleaning brush is hinged to the bottom of each connecting rod, and two second cleaning brushes which are symmetrically arranged are fixedly mounted at the bottom of the gear ring.
By adopting the technical scheme, the surface of the silicon wafer on the tray can be scraped and swept, the first cleaning brush is used for scraping and sweeping the surface of the central part of the silicon wafer, the second cleaning brush is used for sweeping the side part of the silicon wafer, and meanwhile, the impurities falling off from the surface of the silicon wafer are scraped and swept and fall into the filter plate.
In a preferred embodiment, the engagement bars are arranged in a one-to-one correspondence with the first cleaning brush, and the two engagement bars are symmetrically arranged about the center line of the gear ring.
By adopting the technical scheme, the scraping and sweeping work on the surface of the silicon wafer is more comprehensive.
In a preferred embodiment, the outer wall of the gear ring is meshed with a first gear block, a rotating rod penetrating through a second bracket is fixedly arranged at the top of the first gear block, and a motor for driving the rotating rod to rotate is fixedly arranged at the top of the second bracket.
By adopting the technical scheme, when the motor starts to drive the rotating rod to rotate, the first gear block can drive the gear ring to rotate, so that the first cleaning brush and the second cleaning brush at the bottom of the gear ring rotate on the surface of the silicon wafer, and the surface of the silicon wafer is scraped.
In a preferred embodiment, the rotating rods are arranged in a one-to-one correspondence with the second brackets, the top parts of the rotating rods are fixedly connected with second gear blocks, and the outer walls of the second gear blocks are meshed with conveying chains.
By adopting the technical scheme, the rotating rods at the tops of the second brackets and the first gear block can be synchronously driven to rotate, so that the gear ring on the outer wall of the limiting ring on one side of the second brackets can rotate, and the silicon wafers on the surfaces of the trays can be scraped and cleaned.
The application has the technical effects and advantages that:
1. when the medicine is added into the cleaning tank, the medicine is correspondingly added to the top of the independent silicon wafer, so that the medicine is uniformly dispersed on the surface of the independent silicon wafer, the dispersion efficiency of the cleaning agent is accelerated on one hand, the uniform reaction on the surface of the independent silicon wafer is accelerated on the other hand, and the elimination of organic matters, metal impurities, mechanical damage layers and other impurities on the surface of the silicon wafer is facilitated, so that the situation that the medicine cannot have a cleaning effect on the silicon wafer due to insufficient concentration in the cleaning tank is avoided;
2. according to the application, the silicon wafer is cleaned independently by the tray, and the cleaned impurities are collected and taken out by the filter plate, so that the situation of reducing the concentration of the medicine caused by mixing the impurities into the cleaning pool can be avoided, the recycling rate of the cleaning agent is improved, and the cost is reduced.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present application.
Fig. 2 is a schematic view of a partial structure of the present application.
Fig. 3 is an enlarged view of the structure of the portion a of fig. 2 according to the present application.
Fig. 4 is a schematic structural view of the first cleaning mechanism and the adjusting mechanism of the present application.
Fig. 5 is an enlarged view of the B part structure of fig. 4 according to the present application.
Fig. 6 is an enlarged view of the C-section structure of fig. 4 according to the present application.
Fig. 7 is a partial structural cross-sectional view of the body mechanism of the present application.
Fig. 8 is an enlarged view of the D-section structure of fig. 7 according to the present application.
Fig. 9 is an enlarged view of the E-section structure of fig. 7 according to the present application.
Fig. 10 is a schematic view of the axial structure of the present application.
The reference numerals are: the device comprises a main body mechanism, a 101 mixing bin, a 102 flow pipe, a 103 branch pipe, a 104 supporting frame, a 105 cleaning tank, a 106 medicine adding pipe, a 107 stirring shaft, 108 blades, a 109 stirring machine, a 2 first cleaning mechanism, a 21 first bracket, a 22 second bracket, a 23 limiting ring, a 24 third bracket, a 25 fourth bracket, a 26 tray, a 27 filter plate, a 3 adjusting mechanism, a 31 fifth bracket, a 32 telescopic rod, a 4 silicon wafer limiting mechanism, a 41 concentration detector, a 42 first sliding groove, a 43 second sliding groove, a 44 limiting rod, a 45 sliding block, a 46 first supporting plate, a 47 second supporting plate, a 48 spring, a 49 abutting block, a 5 second cleaning mechanism, a 51 gear ring, a 52 first gear block, a 53 rotating rod, a 54 motor, a 55 connecting rod, a 56 first cleaning brush, a 57 second cleaning brush, a 58 second gear block and a 59 conveying chain.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-10 of the specification, the medicine adding device for preparing a flaked monocrystalline silicon wafer drop-in cleaning agent in an embodiment of the application, as shown in fig. 1, comprises a main body mechanism 1, wherein a first cleaning mechanism 2 is arranged on one side of the main body mechanism 1, the first cleaning mechanism 2 is used for independently loading and unloading silicon wafers, impurities dropped in the cleaning process of the silicon wafers are collected and unloaded from the main body mechanism 1, impurities are prevented from being mixed into the main body mechanism 1, the purity of the cleaning agent in the main body mechanism 1 is influenced, thereby the repeated use rate of the cleaning agent is improved, the dropping of the cleaning agent is reduced, an adjusting mechanism 3 for adjusting the height of the first cleaning mechanism 2 is fixedly arranged at the top of the first cleaning mechanism 2, when the adjusting mechanism 3 controls the first cleaning mechanism 2 to be lifted to the highest position, the first cleaning mechanism 2 is separated from the main body mechanism 1 for soaking, the first cleaning mechanism 2 can be used for placing and fixing the silicon wafers, when the adjusting mechanism 3 controls the first cleaning mechanism 2 to the lowest position, the first cleaning mechanism 2 can be moved into the main body mechanism 1 for use, the first cleaning mechanism 2 is fixedly arranged at the top of the cleaning mechanism, the silicon wafers are fixedly arranged at the top of the cleaning mechanism 2 for cleaning mechanism, the silicon wafers are prevented from being cleaned by the first cleaning mechanism 4, the surface of the silicon wafers 5 is simultaneously cleaned by rotating the silicon wafers, the surface of the silicon wafers 5 is simultaneously, the silicon wafers are cleaned by combining with the first cleaning mechanism 5 and the surface cleaning mechanism, and the surface cleaning mechanism 5 is uniformly cleaned, and the silicon wafers are simultaneously cleaned by the first cleaning mechanism, and the silicon wafers are simultaneously cleaned by the surface cleaning mechanism is cleaned by the first cleaning mechanism and the silicon wafer, and the surface cleaning mechanism 5 is uniformly cleaning mechanism and cleaned, according to the application, when the medicine is added and used during cleaning of the silicon wafer, the medicine can be correspondingly added to the top of the independent silicon wafer when the medicine is added into the main body mechanism 1, so that the medicine is uniformly dispersed on the surface of the independent silicon wafer, the dispersing efficiency of the cleaning agent is accelerated, the uniform reaction on the surface of the independent silicon wafer is accelerated, the elimination of organic matters, metal impurities, mechanical damage layers and other impurities on the surface of the silicon wafer is facilitated, the situation that the medicine cannot play a cleaning effect on the silicon wafer due to insufficient concentration in a cleaning tank is avoided, meanwhile, the first cleaning mechanism 2 is used for collecting and taking out the cleaned impurities, the situation that the medicine concentration is reduced due to the fact that the impurities are mixed into the cleaning tank is avoided, the recycling rate of the cleaning agent is improved, and the cost is reduced.
Referring to fig. 7, the main body mechanism 1 includes a mixing bin 101, a plurality of dosing pipes 106 are communicated with the top of the mixing bin 101, and are used for taking out an external dosing tank, a support frame 104 is fixedly installed at the bottom of the mixing bin 101, a flow pipe 102 is communicated with one side of the mixing bin 101, a plurality of branch pipes 103 are communicated with the outer wall of the flow pipe 102 in a linear and sequentially equidistant state, a cleaning pool 105 is arranged at the bottom of the branch pipe 103, when the concentration of medicines in the cleaning pool 105 is insufficient, the medicines are extracted into the inner cavity of the mixing bin 101 through the dosing pipes 106, and then are dispersed and added into the cleaning pool 105 from the branch pipes 103 through the flow pipe 102;
referring to fig. 6, the adjusting mechanism 3 includes a fifth bracket 31 fixedly installed at the bottom of the mixing bin 101, a plurality of telescopic rods 32 which are arranged in a linear and sequentially equidistant state are fixedly connected at the bottom of the fifth bracket 31, the telescopic rods 32 are XDFA-12 series electric pushing rod devices, the first cleaning mechanism 2 includes a first bracket 21 fixedly installed at the bottom of the telescopic rods 32, a plurality of second brackets 22 are fixedly installed at the bottom of the first bracket 21, a limiting ring 23 corresponding to the branch pipe 103 is fixedly installed at one side of the second bracket 22, a third bracket 24 is fixedly installed at the bottom of the second bracket 22, a fourth bracket 25 is fixedly installed at the bottom of the third bracket 24, a tray 26 is fixedly installed at one side of the fourth bracket 25, a plurality of meshes which are arranged in a penetrating manner are formed on the filter plate 27 are fixedly installed at the bottom of the tray 26, the circle centers of the tray 26 and the filter plate 27 are arranged on the same vertical line with the circle center of the limiting ring 23, the tray 26 is used for placing single silicon chips, the filter plate 27 is used for receiving impurities falling from the surface of the silicon chips placed on the tray 26, wherein when the telescopic rod 32 is shortest, the first cleaning mechanism 2 is integrally lifted to the top of the cleaning pool 105, meanwhile, the limiting ring 23 is sleeved on the outer wall of the branch pipe 103, when the silicon chips are placed on the tray 26, the telescopic rod 32 is stretched to the longest state, the first cleaning mechanism 2 integrally drives the silicon chips to be soaked in the cleaning pool 105, when the medicament is added to the branch pipe 103, the medicament can fall onto the surface of the silicon chips placed on the tray 26 along the limiting ring 23, simultaneously, the surface of the silicon chips is scrubbed by combining the second cleaning mechanism 5, the separation of the refractory impurities is accelerated, meanwhile, the cleaning medicament on the surface of the silicon chips is uniformly dispersed by combining the scraping and sweeping rotation of the second cleaning mechanism 5 on the surface of the silicon chips, thereby improving the efficiency and quality of cleaning the silicon wafer.
In specific implementation, the telescopic rod 32 is firstly pulled to be shortest, then a silicon wafer is placed on the tops of the trays 26, and then the telescopic rod 32 is pulled to be longest, so that the trays 26 and the filter plates 27 are moved to clean water in the cleaning pool 105 for soaking, and simultaneously the surfaces of the silicon wafers are brushed by combining the second cleaning mechanism 5, so that the separation of stubborn impurities is accelerated, the cleaning medicines on the surfaces of the silicon wafers are uniformly dispersed, and the cleaning efficiency and quality of the impurities on the surfaces of the silicon wafers are improved.
Referring to fig. 7-8, the stirring shaft 107 is rotatably installed in the inner cavity of the mixing bin 101, the plurality of blades 108 are fixedly installed on the outer wall of the stirring shaft 107, and the stirrer 109 connected with the stirring shaft 107 is fixedly installed on the top of the mixing bin 101, and the stirrer 109 is used for driving the stirring shaft 107 to rotate so that the blades 108 rotate, so that the medicines added into the inner cavity of the mixing bin 101 are more uniformly mixed, and can be directly added into the cleaning tank 105 for cleaning through the flow pipe 102 and the branch pipe 103.
As shown in fig. 3 and 5, the silicon wafer limiting mechanism 4 comprises a concentration detector 41 fixedly installed at the bottom of the tray 26, the concentration detector 41 is used for detecting the concentration of the medicine in the cleaning tank 105, the concentration detector 41 is connected with an external controller, the controller is connected with a medicine adding pipe 106 and a water pump between the external medicine adding tank, when the medicine content in the cleaning tank 105 is detected to be low, the water pump is controlled by the external controller to add the medicine in the external medicine adding tank into the inner cavity of the mixing bin 101, the medicine is stirred and mixed by the blades 108 and then is added into the inner cavity of the cleaning tank 105 in a dispersing way through the flow pipes 102 and the branch pipes 103, the surface of the tray 26 is provided with a plurality of first sliding grooves 42 and second sliding grooves 43 in an annular and sequentially equidistant state, the inner cavity of the first sliding grooves 42 is provided with limiting rods 44 in a sliding way, the inner cavity of the second sliding grooves 43 is provided with sliding blocks 45, every two adjacent limiting rods 44 are connected in a mutual sliding state, the slide blocks 45 are sleeved on the outer walls of every two adjacent limiting rods 44, when the silicon wafers are placed on the first supporting plates 46 according to different sizes of the silicon wafers, the slide blocks 45 are extruded, so that the slide blocks 45 slide in the inner cavities of the second sliding grooves 43, meanwhile, under the influence of displacement of the slide blocks 45, the limiting rods 44 are pushed to slide in the inner cavities of the second sliding grooves 43, so that the adjacent two limiting rods 44 slide on the stacking surface in a staggered manner, the distance between the slide blocks 45 and the center point of the tray 26 is increased, the silicon wafer stacking device is suitable for silicon wafers with different sizes, the first supporting plates 46 are fixedly arranged at the bottoms of the slide blocks 45, the first supporting plates 46 are used for supporting and pressing the side edges of the silicon wafers, the second supporting plates 47 are fixedly arranged on the outer walls of the tray 26, springs 48 connected with the slide blocks 45 are fixedly arranged on one sides of the second supporting plates 47, under normal state, the spring 48 is in an expanded state, the sliding block 45 is pushed to support towards the straight line direction close to the tray 26, when the silicon wafer is placed on the first supporting plate 46, the sliding block 45 can be extruded according to the size of the silicon wafer, the silicon wafer can slide in the inner cavity of the second sliding groove 43, and accordingly the spring 48 is extruded, the silicon wafer is placed on the first supporting plate 46 by combining the sliding block 45 with the spring 48, the abutting blocks 49 are fixedly installed on one side of the sliding block 45, the number of the abutting blocks 49 is at least two, the two abutting blocks 49 are arranged in mirror symmetry with respect to the center line of the tray 26, and when the silicon wafer is rectangular, the two longer sides of the silicon wafer can be clamped through the abutting blocks 49.
As shown in fig. 5, the second cleaning mechanism 5 includes a gear ring 51 rotatably mounted on the outer wall of the limiting ring 23, two connecting rods 55 disposed in an inclined manner are fixedly mounted at the bottom of the gear ring 51, a first cleaning brush 56 is hinged to the bottom of the connecting rod 55, two second cleaning brushes 57 disposed symmetrically are fixedly mounted at the bottom of the gear ring 51, the connecting rods 55 are disposed in one-to-one correspondence with the first cleaning brushes 56, and the two connecting rods 55 are disposed symmetrically with respect to the center line of the gear ring 51, wherein when the gear ring 51 rotates, the first cleaning brushes 56 and the second cleaning brushes 57 are disposed, the surface of a silicon wafer on the tray 26 can be scraped and swept, the first cleaning brushes 56 are used for scraping and sweeping the surface of the center part of the silicon wafer, and the second cleaning brushes 57 are used for scraping and sweeping the impurities separated from the surface of the silicon wafer into the filter plate 27.
In order to control the gear ring 51 to rotate, a first gear block 52 is meshed with the outer wall of the gear ring 51, a rotating rod 53 penetrating through the second support 22 is fixedly arranged at the top of the first gear block 52, a motor 54 for driving the rotating rod 53 to rotate is fixedly arranged at the top of the second support 22, when the motor 54 is started to drive the rotating rod 53 to rotate, the gear ring 51 is driven to rotate through the first gear block 52, and then a first cleaning brush 56 and a second cleaning brush 57 at the bottom of the gear ring 51 rotate on the surface of a silicon wafer to scrape the surface of the silicon wafer.
The rotating rods 53 and the second brackets 22 are in one-to-one correspondence, the top of the rotating rods 53 is fixedly connected with a second gear block 58, the outer walls of the second gear blocks 58 are meshed with a conveying chain 59, the rotating rods 53 at the tops of the second brackets 22 can synchronously drive the first gear blocks 52 to rotate through the arrangement of the conveying chain 59, then the gear rings 51 on the outer walls of the limiting rings 23 on one sides of the second brackets 22 are enabled to rotate, and then silicon wafers on the surfaces of the trays 26 can be scraped and cleaned.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally: the foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the application are intended to be included within the scope of the application.
Claims (6)
1. The utility model provides a preparation flaked monocrystalline silicon piece subtracts charge device of cleaning agent, includes main body mechanism (1), one side of main body mechanism (1) is equipped with first wiper mechanism (2), the top fixed mounting of first wiper mechanism (2) has adjustment mechanism (3) that are used for adjusting its height, the top fixed mounting of first wiper mechanism (2) has silicon chip stop gear (4) that are used for fixed silicon chip, the top of first wiper mechanism (2) is equipped with second wiper mechanism (5) that are used for wasing the silicon chip surface, main body mechanism (1) includes mixing bin (101), the top intercommunication of mixing bin (101) is equipped with a plurality of dosing pipes (106), the bottom fixed mounting of mixing bin (101) has support frame (104), one side intercommunication of mixing bin (101) is equipped with runner pipe (102), the outer wall of runner pipe (102) is the equidistant state intercommunication in proper order of linearity has a plurality of bleeder (103), the bottom of bleeder (103) is equipped with washs pond (105);
it is characterized in that the method comprises the steps of,
the adjusting mechanism (3) comprises a fifth bracket (31) fixedly arranged at the bottom of the mixing bin (101), a plurality of telescopic rods (32) which are arranged in a linear and sequentially equidistant state are fixedly connected to the bottom of the fifth bracket (31), the first cleaning mechanism (2) comprises a first bracket (21) fixedly arranged at the bottom of the telescopic rods (32), a plurality of second brackets (22) are fixedly arranged at the bottom of the first bracket (21), a limiting ring (23) corresponding to the branch pipe (103) is fixedly arranged at one side of the second bracket (22), a third bracket (24) is fixedly arranged at the bottom of the second bracket (22), a fourth bracket (25) is fixedly arranged at the bottom of the third bracket (24), a tray (26) is fixedly arranged at one side of the fourth bracket (25), a plurality of holes which are arranged in a penetrating mode are formed in the bottom of the tray (26), and the circle centers of the tray (26) and the filter plate (27) and the limiting ring (23) are arranged on the same vertical line;
the silicon wafer limiting mechanism (4) comprises a concentration detector (41) fixedly arranged at the bottom of the tray (26), a plurality of first sliding grooves (42) and second sliding grooves (43) are formed in the surface of the tray (26) in an annular sequentially equidistant state, a limiting rod (44) is slidably arranged in an inner cavity of the first sliding groove (42), and a sliding block (45) is slidably arranged in an inner cavity of the second sliding groove (43);
every two adjacent limiting rods (44) are connected in a mutually sliding state, and the sliding blocks (45) are sleeved on the outer walls of every two adjacent limiting rods (44); the bottom of the sliding block (45) is fixedly provided with a first supporting plate (46), the outer wall of the tray (26) is fixedly provided with a second supporting plate (47), and one side of the second supporting plate (47) is fixedly provided with a spring (48) connected with the sliding block (45); one side of the sliding block (45) is fixedly provided with abutting blocks (49), the number of the abutting blocks (49) is at least two, and the two abutting blocks (49) are arranged in mirror symmetry with respect to the central line of the tray (26);
the second cleaning mechanism (5) comprises a gear ring (51) rotatably arranged on the outer wall of the limiting ring (23).
2. The dosing device for preparing the thinned monocrystalline silicon piece reduced-throw cleaning agent according to claim 1, wherein the inner cavity of the mixing bin (101) is rotatably provided with a stirring shaft (107), the outer wall of the stirring shaft (107) is fixedly provided with a plurality of blades (108), and the top of the mixing bin (101) is fixedly provided with a stirrer (109) connected with the stirring shaft (107).
3. The dosing device for preparing the thinned monocrystalline silicon piece drop-in cleaning agent according to claim 1, characterized in that two connecting rods (55) which are obliquely arranged are fixedly arranged at the bottom of the gear ring (51), a first cleaning brush (56) is hinged at the bottom of the connecting rods (55), and two second cleaning brushes (57) which are symmetrically arranged are fixedly arranged at the bottom of the gear ring (51).
4. The dosing device for preparing the thinned monocrystalline silicon piece reduced-throw cleaning agent as set forth in claim 3, wherein the engagement bars (55) are disposed in one-to-one correspondence with the first cleaning brushes (56), and the two engagement bars (55) are disposed symmetrically about a center line of the gear ring (51).
5. A dosing device for preparing a thinned monocrystalline silicon piece reduced-dose cleaning agent as set forth in claim 3, characterized in that the outer wall of the gear ring (51) is meshed with a first gear block (52), a rotating rod (53) penetrating through the second bracket (22) is fixedly installed at the top of the first gear block (52), and a motor (54) for driving the rotating rod (53) to rotate is fixedly installed at the top of the second bracket (22).
6. The dosing device for preparing the thinned monocrystalline silicon piece reduced-throw cleaning agent of claim 5, characterized in that the rotating rods (53) are arranged in one-to-one correspondence with the second brackets (22), the top of the rotating rods (53) is fixedly connected with a second gear block (58), and the outer wall of the second gear block (58) is meshed with a conveying chain (59).
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| CN116779495B (en) * | 2023-08-21 | 2023-11-14 | 无锡荣能半导体材料有限公司 | Degumming and inserting piece cleaning integrated machine for monocrystalline silicon piece production |
| CN117160984B (en) * | 2023-09-08 | 2024-04-12 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing system of coming unstuck |
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