CN115213158A - Dosing device for preparing flaked monocrystalline silicon wafer drop-feed cleaning agent - Google Patents
Dosing device for preparing flaked monocrystalline silicon wafer drop-feed cleaning agent Download PDFInfo
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- CN115213158A CN115213158A CN202210938828.6A CN202210938828A CN115213158A CN 115213158 A CN115213158 A CN 115213158A CN 202210938828 A CN202210938828 A CN 202210938828A CN 115213158 A CN115213158 A CN 115213158A
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 30
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 109
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 98
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 98
- 239000010703 silicon Substances 0.000 claims abstract description 98
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 76
- 238000002156 mixing Methods 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000003814 drug Substances 0.000 abstract description 30
- 239000012535 impurity Substances 0.000 abstract description 25
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000004064 recycling Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 93
- 229940079593 drug Drugs 0.000 description 13
- 238000007790 scraping Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000010408 sweeping Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 244000309464 bull Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 organic matters Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 206010012239 Delusion Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 231100000868 delusion Toxicity 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a dosing device for preparing a slice monocrystalline silicon slice drop-out cleaning agent, and particularly relates to the field of silicon slice preparation. According to the invention, when the medicine is added, the medicine is uniformly dispersed on the surface of the single silicon wafer, so that the uniform reaction on the surface of the single silicon wafer is accelerated, the impurities on the surface of the silicon wafer can be eliminated more conveniently, and the impurities are prevented from being mixed into the cleaning pool, so that the recycling rate of the cleaning agent is improved, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of silicon wafer preparation, in particular to a dosing device for preparing a slice monocrystalline silicon wafer drop-feed cleaning agent.
Background
Silicon wafers are subjected to rigorous cleaning in the production of semiconductor devices. Trace contamination can also lead to device failure. The cleaning is intended to remove surface contaminating impurities, including organic and inorganic substances. Some of these impurities exist in an atomic state or an ionic state, and some exist in a thin film form or a particle form on the surface of the silicon wafer. Various defects may result. The method for removing the pollution includes two methods of physical cleaning and chemical cleaning.
The invention provides a dosing device for preparing a thin slice monocrystalline silicon wafer deloading cleaning agent, which aims to remove impurities on the surface of a silicon wafer in the production of semiconductor devices, and generally puts the whole batch of silicon wafers into a cleaning tank for cleaning at present, however, the cleaning quality and efficiency of the silicon wafers are influenced by the fact that the cleaning agent content in the cleaning tank is reduced due to the fact that the impurities after cleaning are increased, so that the problems are solved.
Disclosure of Invention
In order to overcome the above defects in the prior art, embodiments of the present invention provide a dosing device for preparing a flaked monocrystalline silicon wafer delusion reduction cleaning agent, which can accelerate a uniform reaction on the surface of an individual silicon wafer by uniformly dispersing a drug on the surface of the individual silicon wafer when the drug is added, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the dosing device for preparing the thin monocrystalline silicon wafer drop-reducing cleaning agent comprises a main body mechanism, wherein a first cleaning mechanism is arranged on one side of the main body mechanism, an adjusting mechanism for adjusting the height of the first cleaning mechanism is fixedly installed at the top of the first cleaning mechanism, a silicon wafer limiting mechanism for fixing a silicon wafer is fixedly installed at the top of the first cleaning mechanism, a second cleaning mechanism for cleaning the surface of the silicon wafer is arranged at the top of the first cleaning mechanism, the main body mechanism comprises a mixing bin, a plurality of dosing pipes are communicated with the top of the mixing bin, a support frame is fixedly installed at the bottom of the mixing bin, a runner pipe is communicated with one side of the mixing bin, the outer wall of the runner pipe is communicated with a plurality of branch pipes in a linear sequential equidistant state, and a cleaning pool is arranged at the bottom of the branch pipes;
adjustment mechanism includes the fifth support of fixed mounting in mixing the storehouse bottom, a plurality of telescopic links that are linear equidistance state setting in proper order of bottom fixedly connected with of fifth support, first wiper mechanism includes the first support of fixed mounting in the telescopic link bottom, the bottom fixed mounting of first support has a plurality of second supports, one side fixed mounting of second support has the spacing ring corresponding with the bleeder, the bottom fixed mounting of second support has the third support, the bottom fixed mounting of third support has the fourth support, one side fixed mounting of fourth support has the tray, the bottom fixed mounting of tray has the filter plate, set up a plurality of on the filter plate and be the mesh that runs through the form and set up, just the centre of a circle of filter plate, tray, the centre of a circle with the centre of a circle of spacing ring sets up on same vertical line.
By adopting the technical scheme, the medicine is uniformly dispersed on the surface of the single silicon wafer, so that the dispersing efficiency of the cleaning agent is improved, the uniform reaction on the surface of the single silicon wafer is improved, and the elimination of organic matters, metal impurities, mechanical damage layers and other impurities on the surface of the silicon wafer is facilitated.
In a preferred embodiment, the inner cavity of the mixing bin is rotatably provided with a stirring shaft, the outer wall of the stirring shaft is fixedly provided with a plurality of blades, and the top of the mixing bin is fixedly provided with a stirrer connected with the stirring shaft.
Adopt above-mentioned technical scheme for the medicament that adds the mixing bin inner chamber can mix more evenly, thereby can directly add the washing pond via flow tube and bleeder and wash the use.
In a preferred embodiment, silicon chip stop gear includes the concentration detection appearance of fixed mounting in the tray bottom, the surface of tray is the annular and has seted up a plurality of first spouts and second spout in proper order the equidistance state, the inner chamber slidable mounting of first spout has the gag lever post, the inner chamber slidable mounting of second spout has the slider.
By adopting the technical scheme, the silicon wafer can be placed on the first supporting plate according to the different sizes of the silicon wafer and is extruded by the sliding block to be clamped and fixed.
In a preferred embodiment, every two adjacent limiting rods are connected in a mutual sliding state, and the sliding block is sleeved on the outer wall of every two adjacent limiting rods.
By adopting the technical scheme, the two adjacent limiting rods mutually stagger and slide on the stacked surface, so that the distance between the sliding block and the central point of the tray is increased, and the silicon wafer stacking device is suitable for silicon wafers with different sizes.
In a preferred embodiment, a first supporting plate is fixedly mounted at the bottom of the sliding block, a second supporting plate is fixedly mounted on the outer wall of the tray, and a spring connected with the sliding block is fixedly mounted on one side of the second supporting plate.
By adopting the technical scheme, when the silicon wafer is placed on the first supporting plate, the sliding block can be extruded according to the size of the silicon wafer, so that the sliding block slides in the inner cavity of the second sliding groove to extrude the spring, and the silicon wafer is fixed by clamping force.
In a preferred embodiment, a plurality of abutting blocks are fixedly mounted on one side of the sliding block, the number of the abutting blocks is at least two, and the two abutting blocks are arranged in mirror symmetry with respect to the center line of the tray.
By adopting the technical scheme, when the silicon wafer is rectangular, the longer two sides of the silicon wafer can be clamped through the abutting blocks.
In a preferred embodiment, the second cleaning mechanism comprises a gear ring rotatably mounted on the outer wall of the limit ring, two engaging rods arranged in an inclined manner are fixedly mounted at the bottom of the gear ring, a first cleaning brush is hinged to the bottom of each engaging rod, and two second cleaning brushes arranged symmetrically are fixedly mounted at the bottom of the gear ring.
By adopting the technical scheme, the silicon wafer surface on the tray can be scraped, the first cleaning brush is used for scraping the surface of the center part of the silicon wafer, the second cleaning brush is used for sweeping the side part of the silicon wafer, and meanwhile, impurities falling from the surface of the silicon wafer are scraped and dropped into the filter plate.
In a preferred embodiment, the engaging rods are arranged in a one-to-one correspondence with the first cleaning brushes, and the two engaging rods are arranged symmetrically with respect to a center line of the gear ring.
By adopting the technical scheme, the scraping and sweeping work on the surface of the silicon wafer is more comprehensive.
In a preferred embodiment, the outer wall of the gear ring is engaged with a first gear block, a rotating rod penetrating through the second bracket is fixedly mounted at the top of the first gear block, and a motor for driving the rotating rod to rotate is fixedly mounted at the top of the second bracket.
By adopting the technical scheme, when the motor is started to drive the rotating rod to rotate, the gear ring can be driven to rotate by the first gear block, so that the first cleaning brush and the second cleaning brush at the bottom of the gear ring rotate on the surface of the silicon wafer to scrape and sweep the surface of the silicon wafer.
In a preferred embodiment, the rotating rods and the second supports are arranged in a one-to-one correspondence manner, a second gear block is fixedly connected to the top of each rotating rod, and a transmission chain is meshed with the outer wall of each second gear block.
By adopting the technical scheme, the rotating rods and the first gear blocks which can synchronously drive the tops of the plurality of second supports can rotate, so that the gear rings on the outer walls of the limiting rings on one sides of the plurality of second supports can rotate, and the silicon wafers on the surfaces of the plurality of trays can be scraped and cleaned.
The invention has the technical effects and advantages that:
1. when the medicine is added into the cleaning tank, the medicine is firstly correspondingly added to the top of the single silicon wafer, so that the medicine is uniformly dispersed on the surface of the single silicon wafer, on one hand, the dispersing efficiency of a cleaning agent is improved, on the other hand, the uniform reaction on the surface of the single silicon wafer is improved, and the elimination of impurities such as organic matters, metal impurities, mechanical damage layers and the like on the surface of the silicon wafer is more convenient, so that the situation that the medicine cannot play a cleaning effect on the silicon wafer due to insufficient concentration when the medicine is added into the cleaning tank is avoided;
2. according to the invention, the tray is used for cleaning the silicon wafer independently, and the filter plate is used for collecting and taking out the cleaned impurities, so that the situation that the concentration of the medicine is reduced due to the fact that the impurities are mixed into the cleaning tank can be avoided, the recycling rate of the cleaning agent is improved, and the cost is reduced.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a partial structural schematic diagram of the present invention.
FIG. 3 is an enlarged view of the portion A of FIG. 2 according to the present invention.
Fig. 4 is a schematic structural view of the first cleaning mechanism and the adjusting mechanism of the present invention.
FIG. 5 is an enlarged view of the portion B of FIG. 4 according to the present invention.
FIG. 6 is an enlarged view of the structure of the portion C of FIG. 4 according to the present invention.
Fig. 7 is a partial structural sectional view of the main body mechanism of the present invention.
FIG. 8 is an enlarged view of the structure of the portion D in FIG. 7 according to the present invention.
FIG. 9 is an enlarged view of the structure of the portion E in FIG. 7 according to the present invention.
Fig. 10 is a schematic axial side view of the present invention.
The reference signs are: 1 main body mechanism, 101 mixing bin, 102 circulating pipe, 103 branching pipe, 104 support frame, 105 cleaning pool, 106 dosing pipe, 107 stirring shaft, 108 blades, 109 stirrer, 2 first cleaning mechanism, 21 first support, 22 second support, 23 spacing ring, 24 third support, 25 fourth support, 26 tray, 27 filter plate, 3 adjusting mechanism, 31 fifth support, 32 telescopic rod, 4 silicon chip spacing mechanism, 41 concentration detector, 42 first chute, 43 second chute, 44 spacing rod, 45 slide block, 46 first supporting plate, 47 second supporting plate, 48 spring, 49 abutting block, 5 second cleaning mechanism, 51 gear ring, 52 first gear block, 53 rotating rod, 54 motor, 55 engaging rod, 56 first cleaning brush, 57 second cleaning brush, 58 second gear block, 59 conveying chain.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to the attached drawings 1-10 in the specification, the dosing device for preparing the reduced-dose cleaning agent for the flaked monocrystalline silicon wafer according to the embodiment of the invention comprises a main body mechanism 1, wherein a first cleaning mechanism 2 is arranged on one side of the main body mechanism 1, the first cleaning mechanism 2 is used for loading and unloading the silicon wafer independently and collecting and taking out impurities falling in the silicon wafer cleaning process, so that the impurities are prevented from being mixed into the main body mechanism 1 and affecting the purity of the cleaning agent in the main body mechanism 1, the reuse rate of the cleaning agent is improved and the dosing of the cleaning agent is reduced, an adjusting mechanism 3 for adjusting the height of the first cleaning mechanism 2 is fixedly arranged at the top of the first cleaning mechanism 2, the adjusting mechanism 3 is used for adjusting the height of the first cleaning mechanism 2, when the adjusting mechanism 3 controls the first cleaning mechanism 2 to be lifted to the highest position, the first cleaning mechanism 2 is separated from the main body mechanism 1 for soaking, at the moment, the cleaning device can be used for placing and fixing a silicon wafer, when the adjusting mechanism 3 controls the first cleaning mechanism 2 to the lowest position, the first cleaning mechanism 2 can be moved to the inside of the main body mechanism 1 for soaking use, the top of the first cleaning mechanism 2 is fixedly provided with a silicon wafer limiting mechanism 4 for fixing the silicon wafer, the top of the first cleaning mechanism 2 is provided with a second cleaning mechanism 5 for cleaning the surface of the silicon wafer, when the cleaning device is used, the silicon wafer limiting mechanism 4 is used for processing the silicon wafer placed on the first cleaning mechanism 2 for limiting and fixing to avoid dropping during cleaning, and simultaneously the surface of the silicon wafer is scrubbed by combining the second cleaning mechanism 5 to accelerate the separation of stubborn impurities, and simultaneously the second cleaning mechanism 5 is used for scraping and rotating on the surface of the silicon wafer, so that cleaning medicines on the surface of the silicon wafer can be uniformly dispersed, and the efficiency and the quality of cleaning the silicon wafer are improved, when the cleaning agent is added for use during cleaning of the silicon wafer, the cleaning agent can be added into the main body mechanism 1, the medicament is firstly correspondingly added to the top of the single silicon wafer, so that the medicament is uniformly dispersed on the surface of the single silicon wafer, the dispersing efficiency of the cleaning agent is improved, the uniform reaction on the surface of the single silicon wafer is improved, and the elimination of impurities such as organic matters, metal impurities and mechanical damage layers on the surface of the silicon wafer is facilitated, so that the condition that the cleaning effect on the silicon wafer cannot be achieved due to insufficient concentration of the medicament in a cleaning pool is avoided, meanwhile, the cleaned impurities are collected and taken out by the first cleaning mechanism 2, the condition that the concentration of the medicament is reduced due to the fact that the impurities are mixed into the cleaning pool is avoided, the recycling rate of the cleaning agent is improved, and the cost is reduced.
As shown in fig. 7, the main body mechanism 1 includes a mixing bin 101, a plurality of dosing pipes 106 are provided at the top of the mixing bin 101 for connecting and taking an external dosing tank, a supporting frame 104 is fixedly installed at the bottom of the mixing bin 101, a flow pipe 102 is provided at one side of the mixing bin 101, a plurality of branch pipes 103 are provided at the outer wall of the flow pipe 102 in a linear, sequential and equidistant state, a cleaning pool 105 is provided at the bottom of the branch pipe 103, when the concentration of the drugs in the cleaning water in the inner cavity of the cleaning pool 105 is insufficient, the corresponding drugs are pumped into the inner cavity of the mixing bin 101 through the dosing pipes 106 to be mixed, and then are dispersed and added into the cleaning pool 105 from the branch pipes 103 through the flow pipe 102;
referring to fig. 6, the adjusting mechanism 3 includes a fifth support 31 fixedly installed at the bottom of the mixing bin 101, the bottom of the fifth support 31 is fixedly connected with a plurality of linear telescopic rods 32 arranged in a sequential equidistant state, the telescopic rods 32 are XDFA-12 series electric push rod devices, the first cleaning mechanism 2 includes a first support 21 fixedly installed at the bottom of the telescopic rods 32, a plurality of second supports 22 are fixedly installed at the bottom of the first support 21, a limiting ring 23 corresponding to the branch pipe 103 is fixedly installed at one side of the second support 22, a third support 24 is fixedly installed at the bottom of the second support 22, a fourth support 25 is fixedly installed at the bottom of the third support 24, a tray 26 is fixedly installed at one side of the fourth support 25, a filter plate 27 is fixedly installed at the bottom of the tray 26, a plurality of mesh holes arranged in a penetrating manner are formed in the filter plate 27, and the circle centers of the tray 26 and the filter plate 27 and the circle center of the limiting ring 23 are arranged on the same vertical line, the tray 26 is used for placing single silicon wafers, the filter plate 27 is used for collecting impurities falling from the surfaces of the silicon wafers placed on the tray 26, when the telescopic rod 32 is shortest, the first cleaning mechanism 2 is integrally lifted to the top of the cleaning tank 105, meanwhile, the limiting ring 23 is sleeved on the outer wall of the branch pipe 103, when the silicon wafers are placed on the tray 26, the telescopic rod 32 is stretched to be in the longest state, so that the first cleaning mechanism 2 integrally drives the silicon wafers to be soaked in the cleaning tank 105, when a medicament is added to the branch pipe 103, the medicament can fall onto the surfaces of the silicon wafers placed on the tray 26 along the limiting ring 23, and meanwhile, the surfaces of the silicon wafers are scrubbed by combining the second cleaning mechanism 5, separation of stubborn impurities is accelerated, and cleaning medicaments on the surfaces of the silicon wafers are uniformly dispersed by combining scraping and sweeping rotation of the second cleaning mechanism 5 on the surfaces of the silicon wafers, thereby improving the efficiency and quality of cleaning the silicon wafer.
When the silicon wafer cleaning device is specifically implemented, the telescopic rod 32 is firstly pulled to be shortest, then the silicon wafer is placed on the tops of the trays 26, then the telescopic rod 32 is stretched to be longest, the trays 26 and the filter plates 27 are moved to clean water inside the cleaning pool 105 to be soaked, meanwhile, the surfaces of the silicon wafers are scrubbed by combining the second cleaning mechanism 5, so that separation of stubborn impurities is accelerated, cleaning medicines on the surfaces of the silicon wafers are dispersed uniformly, and therefore the efficiency and the quality of cleaning the impurities on the surfaces of the silicon wafers are improved.
Referring to fig. 7-8, an agitating shaft 107 is rotatably installed in the inner cavity of the mixing bin 101, a plurality of blades 108 are fixedly installed on the outer wall of the agitating shaft 107, and an agitator 109 connected to the agitating shaft 107 is fixedly installed on the top of the mixing bin 101, and the agitator 109 is configured to drive the agitating shaft 107 to rotate so as to rotate the blades 108, so that the chemicals added into the inner cavity of the mixing bin 101 are mixed more uniformly, and can be directly added into the cleaning tank 105 through the flow pipe 102 and the branch pipe 103 for cleaning.
Referring to fig. 3 and 5, the silicon wafer limiting mechanism 4 includes a concentration detector 41 fixedly installed at the bottom of the tray 26, the concentration detector 41 is used for detecting the concentration of the drug in the cleaning tank 105, the concentration detector 41 is connected with an external controller, the controller is connected with a water pump between the drug feeding pipe 106 and an external drug feeding tank, when the content of the drug in the cleaning tank 105 is detected to be low, the external controller controls the water pump to feed the drug in the external drug feeding tank into the inner cavity of the mixing bin 101, the drug is stirred and mixed by the blades 108 and then is dispersedly fed into the inner cavity of the cleaning tank 105 through the flow pipe 102 and the branch pipes 103, the surface of the tray 26 is annularly provided with a plurality of first chutes 42 and second chutes 43 at equal intervals, the inner cavity of the first chute 42 is slidably provided with a limiting rod 44, the inner cavity of the second chute 43 is slidably provided with a slider 45, and every two adjacent limiting rods 44 are connected in a mutually sliding state, and the sliding block 45 is sleeved on the outer wall of every two adjacent limiting rods 44, according to the difference of the sizes of the silicon wafers, after the silicon wafers are placed on the first supporting plate 46, the sliding block 45 is extruded, so that the sliding block 45 slides in the inner cavity of the second sliding chute 43, meanwhile, under the influence of the displacement of the sliding block 45, the limiting rods 44 are pushed to slide in the inner cavity of the second sliding chute 43, so that the two adjacent limiting rods 44 slide on the stacked surface in a staggered manner, so that the distance between the sliding block 45 and the center point of the circle of the tray 26 is increased, and the silicon wafers are applicable to different sizes, the bottom of the sliding block 45 is fixedly provided with the first supporting plate 46, the first supporting plate 46 is used for lifting the silicon wafers, the sliding block 45 is used for pressing against the side edge of the silicon wafers, the outer wall of the tray 26 is fixedly provided with the second supporting plate 47, one side of the second supporting plate 47 is fixedly provided with the spring 48 connected with the sliding block 45, when in a normal state, the spring 48 is in an expansion state, the slide block 45 is pushed to be supported towards the linear direction close to the tray 26, when a silicon wafer is placed on the first supporting plate 46, the slide block 45 can be extruded according to the difference of the sizes of the silicon wafer, the slide block can slide in the inner cavity of the second sliding groove 43, and the spring 48 is extruded, so that the silicon wafer is placed on the first supporting plate 46 in a manner of combining the slide block 45 with the spring 48 in a clamping manner, aiming at the silicon wafers with different shapes, the abutting blocks 49 are fixedly installed on one side of the slide block 45, the number of the abutting blocks 49 is at least two, the two abutting blocks 49 are arranged in a mirror symmetry manner relative to the central line of the tray 26, when the silicon wafer is rectangular, the longer two sides of the silicon wafer can be clamped through the abutting blocks 49.
As shown in fig. 5, the second cleaning mechanism 5 includes a gear ring 51 rotatably mounted on the outer wall of the limiting ring 23, two engaging rods 55 are fixedly mounted at the bottom of the gear ring 51, the engaging rods 55 are disposed in an inclined manner, the bottom of the engaging rods 55 are hinged to a first cleaning brush 56, two second cleaning brushes 57 are symmetrically mounted at the bottom of the gear ring 51, the engaging rods 55 are disposed in a one-to-one correspondence with the first cleaning brushes 56, and the two engaging rods 55 are symmetrically disposed about the center line of the gear ring 51, wherein when the gear ring 51 rotates, the first cleaning brush 56 and the second cleaning brush 57 are disposed to scrape the surface of the silicon wafer on the tray 26, the first cleaning brush 56 is used for scraping the surface of the center portion of the silicon wafer, and the second cleaning brush 57 is used for sweeping the edge portion of the silicon wafer, and simultaneously scraping and dropping impurities separated from the surface of the silicon wafer into the filter plate 27.
In order to facilitate the control of the rotation of the gear ring 51, a first gear block 52 is engaged with the outer wall of the gear ring 51, a rotating rod 53 penetrating through the second support 22 is fixedly mounted at the top of the first gear block 52, a motor 54 for driving the rotating rod 53 to rotate is fixedly mounted at the top of the second support 22, when the motor 54 is started to drive the rotating rod 53 to rotate, the gear ring 51 can be driven to rotate by the first gear block 52, and then the first cleaning brush 56 and the second cleaning brush 57 at the bottom of the gear ring 51 rotate on the surface of the silicon wafer to scrape the surface of the silicon wafer.
Wherein, bull stick 53 is the one-to-one setting with second support 22, the top fixedly connected with second gear piece 58 of bull stick 53, and the outer wall meshing of second gear piece 58 has transfer chain 59, through the setting of transfer chain 59, make the bull stick 53 at a plurality of second support 22 tops can drive first gear piece 52 in step and rotate, and then make the ring gear 51 of the spacing ring 23 outer wall of a plurality of second supports 22 one side rotate, and then make the silicon chip on a plurality of trays 26 surfaces can be scraped the clean.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The dosing device for preparing the flaked monocrystalline silicon wafer drop-reducing cleaning agent comprises a main body mechanism (1), wherein a first cleaning mechanism (2) is arranged on one side of the main body mechanism (1), an adjusting mechanism (3) for adjusting the height of the first cleaning mechanism (2) is fixedly installed at the top of the first cleaning mechanism (2), a silicon wafer limiting mechanism (4) for fixing a silicon wafer is fixedly installed at the top of the first cleaning mechanism (2), a second cleaning mechanism (5) for cleaning the surface of the silicon wafer is arranged at the top of the first cleaning mechanism (2), the main body mechanism (1) comprises a mixing bin (101), a plurality of dosing pipes (106) are communicated with the top of the mixing bin (101), a support frame (104) is fixedly installed at the bottom of the mixing bin (101), a flow pipe (102) is communicated with one side of the mixing bin (101), the outer wall of the flow pipe (102) is communicated with a plurality of branch pipes (103) in a linear sequential equidistant state, and a cleaning pool (105) is arranged at the bottom of the branch pipes (103);
it is characterized in that the preparation method is characterized in that,
adjustment mechanism (3) include fifth support (31) of fixed mounting in mixed storehouse (101) bottom, the bottom fixedly connected with of fifth support (31) is a plurality of telescopic link (32) that are the linear equidistance state setting in proper order, first wiper mechanism (2) include first support (21) of fixed mounting in telescopic link (32) bottom, the bottom fixed mounting of first support (21) has a plurality of second support (22), one side fixed mounting of second support (22) has spacing ring (23) corresponding with bleeder (103), the bottom fixed mounting of second support (22) has third support (24), the bottom fixed mounting of third support (24) has fourth support (25), one side fixed mounting of fourth support (25) has tray (26), the bottom fixed mounting of tray (26) has filter plate (27), set up on filter plate (27) a plurality of be the mesh that the form that runs through set up, just the centre of a circle of tray (26), filter plate (27) with the centre of a circle of spacing ring (23) sets up on same vertical line.
2. The dosing device for the flaked monocrystalline silicon piece drop-feed cleaning agent as claimed in claim 1, wherein a stirring shaft (107) is rotatably mounted in the inner cavity of the mixing bin (101), a plurality of blades (108) are fixedly mounted on the outer wall of the stirring shaft (107), and a stirrer (109) connected with the stirring shaft (107) is fixedly mounted at the top of the mixing bin (101).
3. The dosing device for the flaked monocrystalline silicon piece drop-feed cleaning agent as claimed in claim 1, wherein the silicon piece limiting mechanism (4) comprises a concentration detector (41) fixedly mounted at the bottom of a tray (26), the surface of the tray (26) is provided with a plurality of first chutes (42) and second chutes (43) in an annular shape in sequence at equal intervals, a limiting rod (44) is slidably mounted in an inner cavity of the first chute (42), and a sliding block (45) is slidably mounted in an inner cavity of the second chute (43).
4. The dosing device for the flaked monocrystalline silicon piece drop-feed cleaning agent according to claim 3, wherein every two adjacent limiting rods (44) are connected in a mutually sliding state, and the sliding block (45) is sleeved on the outer walls of every two adjacent limiting rods (44).
5. The dosing device for the thinning monocrystalline silicon piece deloading cleaning agent for the preparation according to claim 3, wherein a first supporting plate (46) is fixedly installed at the bottom of the sliding block (45), a second supporting plate (47) is fixedly installed on the outer wall of the tray (26), and a spring (48) connected with the sliding block (45) is fixedly installed on one side of the second supporting plate (47).
6. The dosing device for the flaked monocrystalline silicon piece drop-feed cleaning agent as claimed in claim 3, wherein one side of the sliding block (45) is fixedly provided with at least two abutting blocks (49), and the two abutting blocks (49) are arranged in mirror symmetry with respect to the center line of the tray (26).
7. The dosing device for the flaked monocrystalline silicon piece drop-throw cleaning agent according to claim 1, wherein the second cleaning mechanism (5) comprises a gear ring (51) rotatably mounted on the outer wall of the limiting ring (23), two obliquely arranged connecting rods (55) are fixedly mounted at the bottom of the gear ring (51), a first cleaning brush (56) is hinged to the bottom of each connecting rod (55), and two symmetrically arranged second cleaning brushes (57) are fixedly mounted at the bottom of the gear ring (51).
8. The dosing device for the abatement of cleaning agent for preparing the flaked monocrystalline silicon wafer according to claim 7, wherein the connecting rods (55) are arranged in one-to-one correspondence with the first cleaning brushes (56), and the two connecting rods (55) are symmetrically arranged about the center line of the gear ring (51).
9. The dosing device for the flaked monocrystalline silicon piece drop-throw cleaning agent according to claim 7, wherein a first gear block (52) is meshed with the outer wall of the gear ring (51), a rotating rod (53) penetrating through the second bracket (22) is fixedly installed at the top of the first gear block (52), and a motor (54) for driving the rotating rod (53) to rotate is fixedly installed at the top of the second bracket (22).
10. The dosing device for the flaked monocrystalline silicon piece drop-throw cleaning agent according to claim 9, wherein the rotating rods (53) are arranged in one-to-one correspondence with the second supports (22), a second gear block (58) is fixedly connected to the top of the rotating rods (53), and a conveying chain (59) is engaged with the outer wall of the second gear block (58).
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| CN202210938828.6A CN115213158B (en) | 2022-08-05 | 2022-08-05 | Medicine adding device for preparing flaked monocrystalline silicon slice drop-down cleaning agent |
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| CN202210938828.6A CN115213158B (en) | 2022-08-05 | 2022-08-05 | Medicine adding device for preparing flaked monocrystalline silicon slice drop-down cleaning agent |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779495A (en) * | 2023-08-21 | 2023-09-19 | 无锡荣能半导体材料有限公司 | Degumming and inserting piece cleaning integrated machine for monocrystalline silicon piece production |
| CN117160984A (en) * | 2023-09-08 | 2023-12-05 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing degumming system and degumming process thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111652A (en) * | 1997-09-30 | 1999-04-23 | Arakawa Chem Ind Co Ltd | Method for cleaning wafer-like work, cleaning basket used therefor, and cleaning housing |
| US20050051200A1 (en) * | 2003-09-05 | 2005-03-10 | Chih-Kun Chen | Wafer cleaning apparatus with multiple wash-heads |
| CN206210751U (en) * | 2016-11-30 | 2017-05-31 | 乐山新天源太阳能科技有限公司 | It is suitable for the cleaning device of different size single silicon chip |
| CN207365040U (en) * | 2017-10-26 | 2018-05-15 | 寇芙嘉 | A kind of boiler cleaning device |
| WO2020094053A1 (en) * | 2018-11-08 | 2020-05-14 | 北京北方华创微电子装备有限公司 | Spraying apparatus and cleaning device |
| CN212168370U (en) * | 2020-03-23 | 2020-12-18 | 厦门健康伦自动仪器有限公司 | Silicon chip cleaning tool |
| CN214378342U (en) * | 2021-01-20 | 2021-10-08 | 浙江众晶电子有限公司 | Silicon chip surface cleaning device |
| CN214976101U (en) * | 2021-03-18 | 2021-12-03 | 安徽英发睿能科技股份有限公司 | Even sculpture water film spray set of going out water |
| WO2021248482A1 (en) * | 2020-06-12 | 2021-12-16 | 南京唐壹信息科技有限公司 | Automatic cleaning apparatus for 5g base station solar photovoltaic panel |
| CN215278728U (en) * | 2021-06-03 | 2021-12-24 | 四川晶美硅业科技有限公司 | Monocrystalline silicon abrasive disc section surface cleaning device |
| CN114522918A (en) * | 2021-11-11 | 2022-05-24 | 无锡上机数控股份有限公司 | Comprehensive cleaning device for monocrystalline silicon piece surface adhesive and using method thereof |
-
2022
- 2022-08-05 CN CN202210938828.6A patent/CN115213158B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111652A (en) * | 1997-09-30 | 1999-04-23 | Arakawa Chem Ind Co Ltd | Method for cleaning wafer-like work, cleaning basket used therefor, and cleaning housing |
| US20050051200A1 (en) * | 2003-09-05 | 2005-03-10 | Chih-Kun Chen | Wafer cleaning apparatus with multiple wash-heads |
| CN206210751U (en) * | 2016-11-30 | 2017-05-31 | 乐山新天源太阳能科技有限公司 | It is suitable for the cleaning device of different size single silicon chip |
| CN207365040U (en) * | 2017-10-26 | 2018-05-15 | 寇芙嘉 | A kind of boiler cleaning device |
| WO2020094053A1 (en) * | 2018-11-08 | 2020-05-14 | 北京北方华创微电子装备有限公司 | Spraying apparatus and cleaning device |
| CN212168370U (en) * | 2020-03-23 | 2020-12-18 | 厦门健康伦自动仪器有限公司 | Silicon chip cleaning tool |
| WO2021248482A1 (en) * | 2020-06-12 | 2021-12-16 | 南京唐壹信息科技有限公司 | Automatic cleaning apparatus for 5g base station solar photovoltaic panel |
| CN214378342U (en) * | 2021-01-20 | 2021-10-08 | 浙江众晶电子有限公司 | Silicon chip surface cleaning device |
| CN214976101U (en) * | 2021-03-18 | 2021-12-03 | 安徽英发睿能科技股份有限公司 | Even sculpture water film spray set of going out water |
| CN215278728U (en) * | 2021-06-03 | 2021-12-24 | 四川晶美硅业科技有限公司 | Monocrystalline silicon abrasive disc section surface cleaning device |
| CN114522918A (en) * | 2021-11-11 | 2022-05-24 | 无锡上机数控股份有限公司 | Comprehensive cleaning device for monocrystalline silicon piece surface adhesive and using method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779495A (en) * | 2023-08-21 | 2023-09-19 | 无锡荣能半导体材料有限公司 | Degumming and inserting piece cleaning integrated machine for monocrystalline silicon piece production |
| CN116779495B (en) * | 2023-08-21 | 2023-11-14 | 无锡荣能半导体材料有限公司 | Degumming and inserting piece cleaning integrated machine for monocrystalline silicon piece production |
| CN117160984A (en) * | 2023-09-08 | 2023-12-05 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing degumming system and degumming process thereof |
| CN117160984B (en) * | 2023-09-08 | 2024-04-12 | 无锡中环应用材料有限公司 | Monocrystalline silicon wafer washing system of coming unstuck |
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| CN115213158B (en) | 2023-08-11 |
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