JPWO2020040143A1 - 紫外線素子パッケージ - Google Patents
紫外線素子パッケージ Download PDFInfo
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- JPWO2020040143A1 JPWO2020040143A1 JP2020538408A JP2020538408A JPWO2020040143A1 JP WO2020040143 A1 JPWO2020040143 A1 JP WO2020040143A1 JP 2020538408 A JP2020538408 A JP 2020538408A JP 2020538408 A JP2020538408 A JP 2020538408A JP WO2020040143 A1 JPWO2020040143 A1 JP WO2020040143A1
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- optical member
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- light emitting
- ultraviolet
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- 230000003287 optical effect Effects 0.000 claims abstract description 100
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 75
- 239000011521 glass Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 238000002834 transmittance Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 abstract description 7
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 18
- 239000008188 pellet Substances 0.000 description 14
- 238000005304 joining Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000011282 treatment Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000001954 sterilising effect Effects 0.000 description 3
- 238000004659 sterilization and disinfection Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004887 air purification Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
2 発光素子
3 基板
33 メタライズ部
4 光学部材(ドームレンズ、フラットレンズ)
42 光出射面
5 台座
51 上面開口部
52 下面開口部
53 保持部
6 金属プリフォーム
Claims (7)
- 紫外線を発光する発光素子と、前記発光素子が実装される基板と、前記発光素子と対向する位置に設けられる光学部材と、を備えた紫外線素子パッケージであって、
前記光学部材は、軟化点が1000℃以下で波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、前記光学部材と封止接合された金属製の台座を介して前記基板と接合され、
前記台座は、前記光学部材が嵌装される平面視円形の上面開口部と、前記発光素子が収容される底面視略矩形の下面開口部と、を有することを特徴とする紫外線素子パッケージ。 - 前記台座は、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成されていることを特徴とする請求項1に記載の紫外線素子パッケージ。
- 前記台座は、その表面に形成された酸化膜により前記光学部材と封止接合されていることを特徴とする請求項1又は請求項2に記載の紫外線素子パッケージ。
- 前記基板のうち前記台座との接合部には、メタライズ処理が施されたメタライズ部が形成されており、
前記台座と前記メタライズ部とが金属プリフォームにより接合されることを特徴とする請求項1乃至請求項3のいずれか一項に記載の紫外線素子パッケージ。 - 前記下面開口部の上面側周縁と前記上面開口部の底面側周縁との間には、前記台座の上面及び底面と平行な平面から成り、前記光学部材を保持する保持部が形成されていることを特徴とする請求項1乃至請求項4のいずれか一項に記載の紫外線素子パッケージ。
- 前記光学部材は、光出射面が突出したドームレンズであることを特徴とする請求項1乃至請求項5のいずれか一項に記載の紫外線素子パッケージ。
- 前記光学部材は、光出射面が平坦なフラットレンズであることを特徴とする請求項1乃至請求項5のいずれか一項に記載の紫外線素子パッケージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018155798 | 2018-08-22 | ||
JP2018155798 | 2018-08-22 | ||
PCT/JP2019/032460 WO2020040143A1 (ja) | 2018-08-22 | 2019-08-20 | 紫外線素子パッケージ |
Publications (2)
Publication Number | Publication Date |
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JPWO2020040143A1 true JPWO2020040143A1 (ja) | 2021-08-26 |
JP7356983B2 JP7356983B2 (ja) | 2023-10-05 |
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JP2020538408A Active JP7356983B2 (ja) | 2018-08-22 | 2019-08-20 | 紫外線素子パッケージ |
Country Status (3)
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JP (1) | JP7356983B2 (ja) |
TW (1) | TWI840397B (ja) |
WO (1) | WO2020040143A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111244250A (zh) * | 2020-03-13 | 2020-06-05 | 桑尼维尔新材料科技(南京)有限公司 | 一种紫外led灯珠、封装套筒及封装方法 |
CN112018219B (zh) * | 2020-09-04 | 2022-06-07 | 广东省科学院半导体研究所 | 紫外发光芯片、其制备方法及应用 |
CN113410373B (zh) * | 2021-06-02 | 2023-04-25 | 麦科勒(滁州)新材料科技有限公司 | 一种聚光型紫外led灯珠 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008300664A (ja) * | 2007-05-31 | 2008-12-11 | Shinko Electric Ind Co Ltd | パッケージ用キャップ及び光学素子搭載用パッケージ |
JP2014036226A (ja) * | 2012-08-09 | 2014-02-24 | Lg Innotek Co Ltd | 発光パッケージ |
WO2016185675A1 (ja) * | 2015-05-15 | 2016-11-24 | パナソニックIpマネジメント株式会社 | インタポーザ |
JP2017147406A (ja) * | 2016-02-19 | 2017-08-24 | 日機装株式会社 | 発光装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4670251B2 (ja) * | 2004-04-13 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
US7906794B2 (en) * | 2006-07-05 | 2011-03-15 | Koninklijke Philips Electronics N.V. | Light emitting device package with frame and optically transmissive element |
JP2018049991A (ja) * | 2016-09-23 | 2018-03-29 | 日本電気硝子株式会社 | 発光素子搭載用基板及びその製造方法、並びに発光素子搭載パッケージ |
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2019
- 2019-08-20 WO PCT/JP2019/032460 patent/WO2020040143A1/ja active Application Filing
- 2019-08-20 JP JP2020538408A patent/JP7356983B2/ja active Active
- 2019-08-20 TW TW108129643A patent/TWI840397B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008300664A (ja) * | 2007-05-31 | 2008-12-11 | Shinko Electric Ind Co Ltd | パッケージ用キャップ及び光学素子搭載用パッケージ |
JP2014036226A (ja) * | 2012-08-09 | 2014-02-24 | Lg Innotek Co Ltd | 発光パッケージ |
WO2016185675A1 (ja) * | 2015-05-15 | 2016-11-24 | パナソニックIpマネジメント株式会社 | インタポーザ |
JP2017147406A (ja) * | 2016-02-19 | 2017-08-24 | 日機装株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7356983B2 (ja) | 2023-10-05 |
TW202013773A (zh) | 2020-04-01 |
WO2020040143A1 (ja) | 2020-02-27 |
TWI840397B (zh) | 2024-05-01 |
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