JPWO2020040003A1 - 薬液、薬液収容体 - Google Patents

薬液、薬液収容体 Download PDF

Info

Publication number
JPWO2020040003A1
JPWO2020040003A1 JP2020538330A JP2020538330A JPWO2020040003A1 JP WO2020040003 A1 JPWO2020040003 A1 JP WO2020040003A1 JP 2020538330 A JP2020538330 A JP 2020538330A JP 2020538330 A JP2020538330 A JP 2020538330A JP WO2020040003 A1 JPWO2020040003 A1 JP WO2020040003A1
Authority
JP
Japan
Prior art keywords
chemical solution
content
mass
oxide particles
metal component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020538330A
Other languages
English (en)
Japanese (ja)
Inventor
上村　哲也
上村　　哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2020040003A1 publication Critical patent/JPWO2020040003A1/ja
Priority to JP2022171671A priority Critical patent/JP7836256B2/ja
Priority to JP2024166177A priority patent/JP2024169664A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • G03F7/063—Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Detergent Compositions (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2020538330A 2018-08-21 2019-08-13 薬液、薬液収容体 Pending JPWO2020040003A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022171671A JP7836256B2 (ja) 2018-08-21 2022-10-26 薬液、薬液収容体
JP2024166177A JP2024169664A (ja) 2018-08-21 2024-09-25 薬液、薬液収容体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018154496 2018-08-21
JP2018154496 2018-08-21
PCT/JP2019/031855 WO2020040003A1 (ja) 2018-08-21 2019-08-13 薬液、薬液収容体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022171671A Division JP7836256B2 (ja) 2018-08-21 2022-10-26 薬液、薬液収容体

Publications (1)

Publication Number Publication Date
JPWO2020040003A1 true JPWO2020040003A1 (ja) 2021-08-26

Family

ID=69592604

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020538330A Pending JPWO2020040003A1 (ja) 2018-08-21 2019-08-13 薬液、薬液収容体
JP2022171671A Active JP7836256B2 (ja) 2018-08-21 2022-10-26 薬液、薬液収容体
JP2024166177A Pending JP2024169664A (ja) 2018-08-21 2024-09-25 薬液、薬液収容体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022171671A Active JP7836256B2 (ja) 2018-08-21 2022-10-26 薬液、薬液収容体
JP2024166177A Pending JP2024169664A (ja) 2018-08-21 2024-09-25 薬液、薬液収容体

Country Status (4)

Country Link
JP (3) JPWO2020040003A1 (https=)
KR (2) KR102901692B1 (https=)
TW (1) TWI875707B (https=)
WO (1) WO2020040003A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7691260B2 (ja) * 2021-04-01 2025-06-11 富士フイルム株式会社 収容体の製造方法、及び、樹脂組成物の保管方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017079449A1 (en) * 2015-11-04 2017-05-11 Clarvista Medical, Inc. Modular intraocular lens designs, tools and methods
WO2017169833A1 (ja) * 2016-03-31 2017-10-05 富士フイルム株式会社 半導体製造用処理液、その製造方法、パターン形成方法及び電子デバイスの製造方法
WO2018142888A1 (ja) * 2017-02-01 2018-08-09 富士フイルム株式会社 薬液の製造方法、及び、薬液の製造装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188333A (ja) * 2008-02-08 2009-08-20 Tokyo Electron Ltd パーティクル検出方法及び処理装置
US20160066581A1 (en) * 2014-09-08 2016-03-10 Michael N. Young Silver ion solution agricultural formulations
JP2015084122A (ja) 2015-01-08 2015-04-30 富士フイルム株式会社 化学増幅型レジスト膜のパターニング用有機系処理液
WO2017169569A1 (ja) * 2016-03-30 2017-10-05 富士フイルム株式会社 保護膜形成用組成物、保護膜形成用組成物の製造方法、パターン形成方法、および、電子デバイスの製造方法
TWI725162B (zh) * 2016-04-08 2021-04-21 日商富士軟片股份有限公司 處理液、其製造方法、圖案形成方法及電子器件的製造方法
JPWO2018079449A1 (ja) * 2016-10-27 2019-09-19 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017079449A1 (en) * 2015-11-04 2017-05-11 Clarvista Medical, Inc. Modular intraocular lens designs, tools and methods
WO2017169833A1 (ja) * 2016-03-31 2017-10-05 富士フイルム株式会社 半導体製造用処理液、その製造方法、パターン形成方法及び電子デバイスの製造方法
WO2018142888A1 (ja) * 2017-02-01 2018-08-09 富士フイルム株式会社 薬液の製造方法、及び、薬液の製造装置

Also Published As

Publication number Publication date
TW202522140A (zh) 2025-06-01
JP2024169664A (ja) 2024-12-05
WO2020040003A1 (ja) 2020-02-27
KR20210031940A (ko) 2021-03-23
JP2023001193A (ja) 2023-01-04
KR102640614B1 (ko) 2024-02-27
KR20240027880A (ko) 2024-03-04
JP7836256B2 (ja) 2026-03-26
TW202018437A (zh) 2020-05-16
TWI875707B (zh) 2025-03-11
KR102901692B1 (ko) 2025-12-18

Similar Documents

Publication Publication Date Title
JP2022043055A (ja) 薬液の精製方法
JP7789852B2 (ja) 薬液、薬液収容体、キット、半導体チップの製造方法
JPWO2020170742A1 (ja) 薬液、レジストパターン形成方法、半導体チップの製造方法、薬液収容体、薬液の製造方法
JPWO2019139062A1 (ja) 薬液、薬液の製造方法、及び、被検液の分析方法
JP7629083B2 (ja) 薬液、薬液収容体
JP2024169664A (ja) 薬液、薬液収容体
JP7764352B2 (ja) 薬液、薬液収容体
TWI916188B (zh) 光阻圖案的形成方法及半導體裝置的製造方法
JPWO2019138959A1 (ja) 薬液、及び、薬液の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211214

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220310

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220726