JPWO2019241082A5 - - Google Patents

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Publication number
JPWO2019241082A5
JPWO2019241082A5 JP2020564399A JP2020564399A JPWO2019241082A5 JP WO2019241082 A5 JPWO2019241082 A5 JP WO2019241082A5 JP 2020564399 A JP2020564399 A JP 2020564399A JP 2020564399 A JP2020564399 A JP 2020564399A JP WO2019241082 A5 JPWO2019241082 A5 JP WO2019241082A5
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JP
Japan
Prior art keywords
semiconductor
microstructured
semiconductor device
film
semiconductor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020564399A
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English (en)
Japanese (ja)
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JP2021527944A (ja
JP2021527944A5 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/036174 external-priority patent/WO2019241082A1/en
Publication of JP2021527944A publication Critical patent/JP2021527944A/ja
Publication of JPWO2019241082A5 publication Critical patent/JPWO2019241082A5/ja
Publication of JP2021527944A5 publication Critical patent/JP2021527944A5/ja
Pending legal-status Critical Current

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JP2020564399A 2018-06-13 2019-06-07 光電子デバイスにおけるひずみ制御 Pending JP2021527944A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862684720P 2018-06-13 2018-06-13
US62/684,720 2018-06-13
PCT/US2019/036174 WO2019241082A1 (en) 2018-06-13 2019-06-07 Strain control in optoelectronic devices

Publications (3)

Publication Number Publication Date
JP2021527944A JP2021527944A (ja) 2021-10-14
JPWO2019241082A5 true JPWO2019241082A5 (https=) 2022-06-10
JP2021527944A5 JP2021527944A5 (https=) 2022-06-10

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ID=68840425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020564399A Pending JP2021527944A (ja) 2018-06-13 2019-06-07 光電子デバイスにおけるひずみ制御

Country Status (5)

Country Link
US (1) US10992105B2 (https=)
EP (1) EP3807925A4 (https=)
JP (1) JP2021527944A (https=)
KR (1) KR102874774B1 (https=)
WO (1) WO2019241082A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112467514B (zh) * 2020-11-10 2022-04-12 华中科技大学 一种宽工作温度范围的分布反馈半导体激光器
CN115377240A (zh) * 2022-09-19 2022-11-22 中国科学院半导体研究所 光电探测器、应变锗基led及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5787104A (en) 1995-01-19 1998-07-28 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element and method for fabricating the same
GB2310316A (en) * 1996-02-15 1997-08-20 Sharp Kk Semiconductor laser
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
DE10245631B4 (de) * 2002-09-30 2022-01-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement
JP4160000B2 (ja) * 2004-02-13 2008-10-01 ドンゴク ユニバーシティ インダストリー アカデミック コーポレイション ファウンデイション 発光ダイオードおよびその製造方法
US7875522B2 (en) * 2007-03-30 2011-01-25 The Board Of Trustees Of The Leland Stanford Junior University Silicon compatible integrated light communicator
JP4978478B2 (ja) * 2008-01-11 2012-07-18 ソニー株式会社 電磁波抑制放熱シート及び電子機器
JP4575471B2 (ja) * 2008-03-28 2010-11-04 株式会社東芝 半導体装置および半導体装置の製造方法
JP5479765B2 (ja) * 2009-03-27 2014-04-23 古河電気工業株式会社 一次元アレイ素子の製造方法および一次元アレイ素子
US9065253B2 (en) * 2009-05-13 2015-06-23 University Of Washington Through Its Center For Commercialization Strain modulated nanostructures for optoelectronic devices and associated systems and methods
JP5121783B2 (ja) * 2009-06-30 2013-01-16 株式会社日立ハイテクノロジーズ Led光源およびその製造方法ならびにled光源を用いた露光装置及び露光方法
US9490318B2 (en) * 2012-06-15 2016-11-08 Lawrence Livermore National Security, Llc Three dimensional strained semiconductors
CN106098697B (zh) * 2016-06-15 2019-04-02 深圳市华星光电技术有限公司 微发光二极管显示面板及其制作方法

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