JPWO2019239484A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JPWO2019239484A1 JPWO2019239484A1 JP2020524981A JP2020524981A JPWO2019239484A1 JP WO2019239484 A1 JPWO2019239484 A1 JP WO2019239484A1 JP 2020524981 A JP2020524981 A JP 2020524981A JP 2020524981 A JP2020524981 A JP 2020524981A JP WO2019239484 A1 JPWO2019239484 A1 JP WO2019239484A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000001816 cooling Methods 0.000 claims abstract description 57
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000020169 heat generation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
- H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
- H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/21—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/217—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Ceramic Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Abstract
Description
図1の例では、3つのレグ回路3U,3V,3Wに対応して、3つの半導体モジュール5U,5V,5Wが配置されている。各相の半導体モジュールの構成は同一であるため、図2では、U相の半導体モジュール5Uの構成を説明する。
図5は、本実施の形態に係る電力変換装置10の断面図であり、図4と対比される図である。本実施の形態に係る電力変換装置10および半導体モジュール5の概略平面図は、図1および図2とそれぞれ同じであるため詳細な説明は繰返さない。
θhは次式(1)で与えられる。
また、Z方向における熱抵抗をθv[K/W]とすると、θvは次式(2)で与えられる。
式(1),(2)から分かるように、伝熱部材12の厚みbを大きくすれば、X方向の熱抵抗θhを下げることができるが、その一方で、Z方向における熱抵抗θvが大きくなる。すなわち、伝熱部材12は、Z方向(第2の方向)における厚みbを大きくするに従って、X−Y平面に平行な方向(第1の方向)における熱抵抗θhが小さくなる一方で、第2の方向における熱抵抗θvが大きくなるというトレードオフ関係を有している。
図10を参照して、最初に、ステップS10により、伝熱部材12の熱回路網モデル(図8)を生成する。ステップS10では、伝熱部材12に固有の抵抗値Rh,Rvおよび冷却フィン20に固有の抵抗値Rfを取得する。伝熱部材12の搭載面の形状に基づいて、抵抗値Rh,Rv,Rfからなる抵抗ラダー回路を形成する。
Claims (6)
- 互いに逆並列に接続されたスイッチング素子およびダイオードを有する半導体モジュールと、
前記半導体モジュールを冷却する冷却部材と、
前記半導体モジュールおよび前記冷却部材の間に配置され、前記スイッチング素子および前記ダイオードが発生する熱を前記冷却部材に伝達する伝熱部材とを備え、
前記伝熱部材は、前記スイッチング素子および前記ダイオードが並んで搭載される搭載面を有し、前記搭載面と反対側の面が前記冷却部材に接しており、
前記伝熱部材において、前記搭載面に平行な第1の方向における熱伝導率は、前記搭載面に垂直な第2の方向における熱伝導率よりも高い、半導体装置。 - 前記伝熱部材は、前記第2の方向における厚みを大きくするに従って、前記第1の方向における熱抵抗が小さくなる一方で、前記第2の方向における熱抵抗が大きくなるという関係を有する、請求項1に記載の半導体装置。
- 前記伝熱部材の前記第2の方向における厚みは、前記第1の方向における熱抵抗および前記第2の方向における熱抵抗を有する抵抗ラダーによる熱回路網モデルから導出される、前記伝熱部材の前記搭載面の温度および前記冷却部材の表面温度間の温度差と前記厚みとの関係に基づいて設定される、請求項1または2に記載の半導体装置。
- 前記伝熱部材の前記第2の方向における厚みは、導出された前記関係において、前記伝熱部材の前記搭載面の温度および前記冷却部材の表面温度間の温度差が最小となる厚みに設定される、請求項3に記載の半導体装置。
- 前記半導体装置は、前記スイッチング素子をオンオフさせることにより直流電力および交流電力の間で電力変換を行なう電力変換器である、請求項1から4のいずれか1項に記載の半導体装置。
- 前記伝熱部材は、グラファイトシートである、請求項1から5のいずれか1項に記載の半導体装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2018/022420 WO2019239484A1 (ja) | 2018-06-12 | 2018-06-12 | 半導体装置 |
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JPWO2019239484A1 true JPWO2019239484A1 (ja) | 2020-12-17 |
JP6912665B2 JP6912665B2 (ja) | 2021-08-04 |
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US (1) | US11540426B2 (ja) |
JP (1) | JP6912665B2 (ja) |
KR (1) | KR102455677B1 (ja) |
CN (1) | CN112236929B (ja) |
WO (1) | WO2019239484A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004031485A (ja) * | 2002-06-24 | 2004-01-29 | Nissan Motor Co Ltd | 半導体装置 |
JP2014049516A (ja) * | 2012-08-30 | 2014-03-17 | Mitsubishi Electric Corp | シャント抵抗器の冷却構造及びそれを用いたインバータ装置 |
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JP5557441B2 (ja) * | 2008-10-31 | 2014-07-23 | 日立オートモティブシステムズ株式会社 | 電力変換装置および電動車両 |
JP2012005194A (ja) | 2010-06-15 | 2012-01-05 | Nissan Motor Co Ltd | 電力変換器 |
JP5397340B2 (ja) * | 2010-07-22 | 2014-01-22 | 株式会社デンソー | 半導体冷却装置 |
JP5663450B2 (ja) * | 2011-10-18 | 2015-02-04 | 株式会社日立製作所 | 電力変換装置 |
CN103999343B (zh) * | 2012-01-13 | 2017-05-10 | 富士电机株式会社 | 功率转换装置 |
JP2015015351A (ja) | 2013-07-04 | 2015-01-22 | 株式会社ジェイテクト | 半導体装置 |
US11153966B2 (en) * | 2017-11-08 | 2021-10-19 | Sumitomo Electric Industries, Ltd. | Electronic circuit device |
JP7183594B2 (ja) * | 2018-07-04 | 2022-12-06 | 富士電機株式会社 | 半導体装置 |
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2018
- 2018-06-12 CN CN201880094327.6A patent/CN112236929B/zh active Active
- 2018-06-12 WO PCT/JP2018/022420 patent/WO2019239484A1/ja active Application Filing
- 2018-06-12 KR KR1020217000727A patent/KR102455677B1/ko active IP Right Grant
- 2018-06-12 JP JP2020524981A patent/JP6912665B2/ja active Active
- 2018-06-12 US US16/973,992 patent/US11540426B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004031485A (ja) * | 2002-06-24 | 2004-01-29 | Nissan Motor Co Ltd | 半導体装置 |
JP2014049516A (ja) * | 2012-08-30 | 2014-03-17 | Mitsubishi Electric Corp | シャント抵抗器の冷却構造及びそれを用いたインバータ装置 |
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Publication number | Publication date |
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US11540426B2 (en) | 2022-12-27 |
KR20210018487A (ko) | 2021-02-17 |
US20210112688A1 (en) | 2021-04-15 |
WO2019239484A1 (ja) | 2019-12-19 |
CN112236929B (zh) | 2024-01-16 |
CN112236929A (zh) | 2021-01-15 |
JP6912665B2 (ja) | 2021-08-04 |
KR102455677B1 (ko) | 2022-10-17 |
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