JPWO2019177895A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2019177895A5 JPWO2019177895A5 JP2020571333A JP2020571333A JPWO2019177895A5 JP WO2019177895 A5 JPWO2019177895 A5 JP WO2019177895A5 JP 2020571333 A JP2020571333 A JP 2020571333A JP 2020571333 A JP2020571333 A JP 2020571333A JP WO2019177895 A5 JPWO2019177895 A5 JP WO2019177895A5
- Authority
- JP
- Japan
- Prior art keywords
- dies
- map
- deviation
- die
- die comparison
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007689 inspection Methods 0.000 claims description 6
- 238000010192 crystallographic characterization Methods 0.000 claims description 5
- 230000000875 corresponding Effects 0.000 claims 4
- 238000001914 filtration Methods 0.000 claims 3
- 230000000052 comparative effect Effects 0.000 claims 1
- 238000007405 data analysis Methods 0.000 claims 1
- 238000011156 evaluation Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862641297P | 2018-03-10 | 2018-03-10 | |
| US62/641,297 | 2018-03-10 | ||
| US16/273,876 | 2019-02-12 | ||
| US16/273,876 US10585049B2 (en) | 2018-03-10 | 2019-02-12 | Process-induced excursion characterization |
| PCT/US2019/021389 WO2019177895A1 (en) | 2018-03-10 | 2019-03-08 | Process-induced excursion characterization |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021515993A JP2021515993A (ja) | 2021-06-24 |
| JPWO2019177895A5 true JPWO2019177895A5 (ko) | 2022-03-10 |
| JP7097466B2 JP7097466B2 (ja) | 2022-07-07 |
Family
ID=67843829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020571333A Active JP7097466B2 (ja) | 2018-03-10 | 2019-03-08 | プロセス誘起逸脱特性評価 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10585049B2 (ko) |
| JP (1) | JP7097466B2 (ko) |
| KR (1) | KR102443351B1 (ko) |
| CN (1) | CN111937129B (ko) |
| IL (1) | IL277250B2 (ko) |
| SG (1) | SG11202008760WA (ko) |
| TW (1) | TWI797271B (ko) |
| WO (1) | WO2019177895A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11656274B2 (en) * | 2021-02-15 | 2023-05-23 | Kla Corporation | Systems and methods for evaluating the reliability of semiconductor die packages |
| US20230128335A1 (en) * | 2021-10-22 | 2023-04-27 | Nanya Technology Corporation | Manufacturing and measuring system for semiconductor structures |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3698075B2 (ja) * | 2001-06-20 | 2005-09-21 | 株式会社日立製作所 | 半導体基板の検査方法およびその装置 |
| US6885977B2 (en) | 2002-12-20 | 2005-04-26 | Applied Materials, Inc. | System to identify a wafer manufacturing problem and method therefor |
| JP3896996B2 (ja) * | 2003-06-27 | 2007-03-22 | 株式会社日立製作所 | 回路パターンの検査装置および検査方法 |
| US7394534B1 (en) | 2003-11-19 | 2008-07-01 | Kla-Tencor Corporation | Process excursion detection |
| KR100909474B1 (ko) * | 2005-08-10 | 2009-07-28 | 삼성전자주식회사 | 웨이퍼 결함지수를 사용하여 국부성 불량 모드를 갖는결함성 반도체 웨이퍼의 검출 방법들 및 이에 사용되는장비들 |
| US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| KR101789004B1 (ko) | 2005-11-18 | 2017-10-20 | 케이엘에이-텐코 코포레이션 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| EP1982160A4 (en) | 2006-02-09 | 2016-02-17 | Kla Tencor Tech Corp | METHOD AND SYSTEMS FOR DETERMINING A WAFER FEATURE |
| US8611639B2 (en) * | 2007-07-30 | 2013-12-17 | Kla-Tencor Technologies Corp | Semiconductor device property extraction, generation, visualization, and monitoring methods |
| US7937234B2 (en) | 2008-08-29 | 2011-05-03 | Intel Corporation | Classification of spatial patterns on wafer maps |
| US8275564B2 (en) * | 2009-02-03 | 2012-09-25 | Qcept Technologies, Inc. | Patterned wafer inspection system using a non-vibrating contact potential difference sensor |
| US10192303B2 (en) * | 2012-11-12 | 2019-01-29 | Kla Tencor Corporation | Method and system for mixed mode wafer inspection |
| US10101386B2 (en) | 2014-02-14 | 2018-10-16 | Texas Instruments Incorporated | Real time semiconductor process excursion monitor |
| KR102574171B1 (ko) * | 2014-08-29 | 2023-09-06 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법, 타겟 및 기판 |
| US9401313B2 (en) * | 2014-11-19 | 2016-07-26 | Deca Technologies, Inc. | Automated optical inspection of unit specific patterning |
| US10747830B2 (en) * | 2014-11-21 | 2020-08-18 | Mesh Labs Inc. | Method and system for displaying electronic information |
| US9779202B2 (en) * | 2015-06-22 | 2017-10-03 | Kla-Tencor Corporation | Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements |
-
2019
- 2019-02-12 US US16/273,876 patent/US10585049B2/en active Active
- 2019-03-08 TW TW108107779A patent/TWI797271B/zh active
- 2019-03-08 JP JP2020571333A patent/JP7097466B2/ja active Active
- 2019-03-08 SG SG11202008760WA patent/SG11202008760WA/en unknown
- 2019-03-08 CN CN201980023479.1A patent/CN111937129B/zh active Active
- 2019-03-08 WO PCT/US2019/021389 patent/WO2019177895A1/en active Application Filing
- 2019-03-08 KR KR1020207028815A patent/KR102443351B1/ko active IP Right Grant
-
2020
- 2020-09-09 IL IL277250A patent/IL277250B2/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101565748B1 (ko) | 이미지에서 반복 패턴을 검출하는 방법 및 장치 | |
| US9633888B2 (en) | Semiconductor manufacturing device and method of manufacturing semiconductor chip | |
| JP5254681B2 (ja) | エッジ検出装置、切削装置およびエッジ検出プログラム | |
| JP2005508090A5 (ko) | ||
| US10160021B2 (en) | Deep-drawing of a work piece | |
| JP2023145545A5 (ko) | ||
| CN114463314A (zh) | 一种基于色彩差影模型的晶圆缺陷检测方法及系统 | |
| CN115953397A (zh) | 一种圆锥轴承保持器的工艺制备流程的监测方法及设备 | |
| JP6180662B1 (ja) | 加工制御装置、ワイヤ放電加工装置およびワイヤ放電加工方法 | |
| US10522427B2 (en) | Techniques providing semiconductor wafer grouping in a feed forward process | |
| WO2010044358A1 (ja) | ウェハのパターン検査方法及び装置 | |
| JPWO2019177895A5 (ko) | ||
| US9573243B2 (en) | Method for adaptive feedback controlled polishing | |
| US10957033B2 (en) | Repeater defect detection | |
| US7923265B2 (en) | Method and system for improving critical dimension proximity control of patterns on a mask or wafer | |
| JP3713156B2 (ja) | テンプレートの作成方法 | |
| CN109978801B (zh) | 一种图像处理方法及图像处理装置 | |
| KR20240101589A (ko) | 반도체 전자빔 결함 모니터링을 위한 이미지 처리 방법, 장치 및 시스템 | |
| CN110033470B (zh) | 一种晶圆边缘管芯判定方法及系统 | |
| Gilfanovich et al. | Improving the Efficiency of the Method of Stochastic Gradient Identification of Objects in Binary and Grayscale Images Using Their Preprocessing | |
| US11806877B2 (en) | Method and apparatus for adjusting robot motion path | |
| KR102287796B1 (ko) | 디포커스 검출 방법 | |
| US20200148484A1 (en) | Automated teaching of pick and place workflow locations on an automated programming system | |
| JP2013516067A5 (ko) | ||
| KR20180002726A (ko) | 자동화된 이미지 기반 프로세스 모니터링 및 제어 |