JPWO2019142571A1 - Resistance measuring device and substrate inspection device - Google Patents

Abstract

It has a first surface S1 and a second surface S2 that come into contact with the electrodes A1 and A2 of the substrate A, and the resistance value in the first direction orthogonal to the surface direction is smaller than the resistance value in the second direction along the surface direction. A resistor E1 and E2 that are in contact with the second surface S2 and are arranged so as to correspond to the arrangement of the electrodes A1 and A2, and a resistor having one end connected to the electrode E1. RC1, a resistor RC2 whose one end is connected to the electrode E2, a power supply unit 24 that supplies a current between the other end of the resistor RC1 and the other end of the resistor RC2, and a resistor with the other end of the resistor RC1. A resistance value including the resistance of the heteroconductive members 31 and 32 and the resistance between the electrodes A1 and A2 based on the detected current and the current meter 25 that detects the current between the other end of the device RC2. It is provided with a resistance acquisition unit 261 for acquiring R.

Description

The present invention relates to a resistance measuring device that measures resistance using an anisotropic conductive member, and a substrate inspection device using the resistance measuring device.

Conventionally, a conductive pin is arranged according to the arrangement of the conductive position set in the wiring pattern of the circuit board to be inspected, and a conductive rubber sheet is covered on the conductive pin so that the pressed portion becomes conductive. , A circuit board inspection device is known in which a wiring pattern of a circuit board and a conduction pin are made conductive by pressing a circuit board to be inspected on the conductive rubber sheet (see, for example, Patent Document 1).

Further, an anisotropic conductive sheet that conducts in the thickness direction of the sheet and does not conduct in the surface direction of the sheet without pressing is commercially available (for example, Shin-Etsu Polymer Co., Ltd. Shin-Etsu Interconnector MT series). Alternatively, by alternately laminating conductive and insulating silicone rubber layers, a quadrangular prism shape extending in the laminating direction is formed, which does not conduct in the laminating direction but conducts in a direction orthogonal to the laminating direction. The connector is commercially available (for example, Shin-Etsu Interconnector S type manufactured by Shin-Etsu Polymer Co., Ltd.).

In the present specification, a conductive rubber sheet in which the pressed portion becomes conductive as described above, an anisotropic conductive sheet in which the conduction direction is defined in a predetermined direction even if the pressed portion is not pressed, an anisotropic conductive connector, or the like. Are collectively referred to as anisotropic conductive members.

Jikkai Sho 57-37471

By the way, when the inspection device and the substrate to be inspected are made conductive by using the anisotropic conductive member as described above, since the anisotropic conductive member has elasticity, the anisotropic conductivity is caused by the pressing pressure. The resistance of the sex member itself and the contact resistance between the anisotropic conductive member and the substrate fluctuate greatly. (Hereinafter, for simplification of the description, the resistance and resistance value of the anisotropic conductive member including the resistance of the anisotropic conductive member itself and the contact resistance between the anisotropic conductive member and the substrate are simply referred to. )

Further, since the anisotropic conductive member is made of a soft material such as rubber, wear and deterioration are likely to occur due to repeated inspections. The resistance of the anisotropic conductive member also increases due to wear and deterioration. As described above, the anisotropic conductive member has a large variation in resistance due to usage conditions, wear, deterioration, and the like.

When the resistance of the substrate is measured by conducting a conductive connection to the substrate to be measured via the anisotropic conductive member, the resistance of the anisotropic conductive member having a large variation is included in the measurement result. Further, the resistance measurement path has a capacitance component, and the impedance ratio of the resistance measurement path may be capacitance component: resistance component = 1000: 1. Therefore, the capacitance component is larger than the resistance component, and the measured value of the resistance component tends to vary. Therefore, there is an inconvenience that the influence of the resistance variation of the anisotropic conductive member on the measurement result of the resistance value becomes large.

An object of the present invention is to provide a resistance measuring device and a substrate inspection device that can easily reduce the influence of resistance variation of an anisotropic conductive member on a measurement result of a resistance value.

The resistance measuring device according to an example of the present invention is a resistance measuring device for measuring resistance between a pair of conductive pattern portions formed on one surface of a substrate, and is for contacting the pair of pattern portions. The resistance value in the first direction orthogonal to the first surface has a first surface and a second surface facing the first surface, and the resistance value in the second direction along the surface direction of the first surface is With respect to the anisotropic conductive member which can be smaller than the value, the first and second electrodes which are in contact with the second surface and are arranged so as to correspond to the arrangement of the pair of pattern portions, and the first electrode. Between the first resistor to which one end is connected, the second resistor to which one end is connected to the second electrode, and the other end of the first resistor and the other end of the second resistor. The power supply unit that supplies current to the resistor, the detection unit that detects at least one of the voltage and current between the other end of the first resistor and the other end of the second resistor, and the detection unit that detects at least one of them. A resistance acquisition unit that acquires a resistance value including the resistance of the idiosyncratic conductive member and the resistance between the pair of pattern portions is provided based on at least one of the above.

Further, the substrate inspection device according to an example of the present invention includes the above-mentioned resistance measuring device and a substrate inspection unit that inspects the substrate based on the resistance measured by the resistance measuring device.

FIG. 1 is a perspective view showing an example of the configuration of a substrate inspection device using the resistance measuring device according to the embodiment of the present invention. It shows a state in which the substrate to be inspected is attached to the substrate inspection apparatus shown in FIG. The state in which the substrate attached to the substrate inspection apparatus shown in FIG. 1 is pressed by the pressing mechanism is shown. It is a partial cross-sectional view conceptually showing the state in which a substrate is pressed by an anisotropic conductive member by a pressing plate. It is a block diagram which shows an example of the electric structure of the substrate inspection apparatus shown in FIG. It is explanatory drawing of the tabular form for demonstrating the effect by having a resistor in a substrate inspection apparatus.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. It should be noted that the configurations with the same reference numerals in each figure indicate that they are the same configurations, and the description thereof will be omitted. FIG. 1 is a perspective view showing an example of the configuration of a substrate inspection device 1 using the resistance measuring device according to the embodiment of the present invention. FIG. 2 shows a state in which the substrate A to be inspected is attached to the substrate inspection device 1 shown in FIG. FIG. 3 shows a state in which the substrate A attached to the substrate inspection device 1 shown in FIG. 1 is pressed by the pressing mechanism 4 described later. For convenience of explanation, the directions of up, down, left, right, front and back may be shown in each figure, but the directions are merely examples and are not limited thereto.

The substrate inspection device 1 shown in FIG. 1 includes a device main body portion 2 having a substantially rectangular parallelepiped housing 21, a jig board 3 (jig portion) arranged on the upper surface of the housing 21, and a housing 21. It is provided with a pressing mechanism 4 (pressing portion) erected behind the upper surface. The upper surface of the housing 21 is a flat mounting surface 22. The substrate A to be inspected can be mounted on the mounting surface 22.

The substrate A to be inspected may be, for example, a display such as a liquid crystal display or an EL (Electro-Luminescence) display, a touch panel display, an electrode plate for these displays, a transparent conductive plate for a touch panel, etc., and a package for a semiconductor package. It may be a substrate such as a substrate, an interposer substrate, a film carrier, a printed wiring board, a glass epoxy substrate, a flexible substrate, a ceramic multilayer wiring board, a semiconductor wafer, a semiconductor chip, a semiconductor substrate such as a CSP (Chip size package), and the like. It may be a substrate of.

Further, the substrate A to be inspected may be a component-embedded substrate (embedded substrate) in which electronic components such as semiconductor chips are embedded. Further, the inspection target is not limited to the substrate, and may be an electronic component such as a semiconductor chip. Inspection points such as wiring patterns, pads, lands, solder bumps, and terminals are formed on the substrate and electronic components to be inspected.

The substrate A shown in FIG. 2 is, for example, a touch panel display having a substantially rectangular shape, and a plurality of pairs of electrodes A1 and A2 for connecting the substrate A to the outside are formed near the end of one surface thereof. ing. The paired electrodes A1 and A2 are electrically connected by, for example, transparent wiring (not shown). The paired electrodes A1 and A2 correspond to an example of a pair of pattern portions. The resistance value Rd of the transparent wiring is, for example, about 100Ω to 9kΩ.

The jig board 3 is arranged near the rear end of the mounting surface 22. The jig board 3 includes a jig board 30 composed of, for example, a printed wiring board, heterogeneous conductive members 31 and 32 arranged on the upper surface of the jig board 30, and a resistor RC1 (first resistor, FIG. 5), a resistor RC2 (second resistor, see FIG. 5), and connectors CN1 and CN2 (see FIG. 5) for electrically connecting to the device main body 2. The jig substrate 30 has a substantially rectangular plate shape that is long in the left-right direction.

The anisotropic conductive members 31 and 32 have a substantially rectangular plate shape that is long in the left-right direction. The jig substrate 30 and the anisotropic conductive members 31 and 32 are arranged so as to correspond to the arrangement of the electrodes A1 and A2 on the substrate A. It should be noted that the anisotropic conductive member does not need to be provided in a plurality of anisotropic conductive members 31 and 32, and may be one or three or more. Further, the anisotropic conductive members 31 and 32 do not necessarily have to be plate-shaped, and may have a rectangular parallelepiped shape, a columnar shape, or the like.

On the mounting surface 22, a substantially L-shaped guide member 23 for positioning the mounting position of the substrate A is convexly provided. By arranging the substrate A on the mounting surface 22 so that the two sides of the substrate A are in contact with the guide member 23, the substrate A is mounted at a preset inspection position. The inspection position of the guide member 23 can be changed according to the substrate A by an adjustment mechanism (not shown).

By placing the substrate A in the inspection position with the electrodes A1 and A2 facing down, the anisotropic conductive member 31, A2, so that the electrodes A1 and A2 come into contact with the upper surfaces of the anisotropic conductive members 31, 32. The size, shape, arrangement, etc. of 32 are set.

The pressing mechanism 4 is roughly horizontal above the jig board 3 by a total of four columns 41 erected on the mounting surface 22 on each side of the jig board 3 and four columns 41. It is provided with a top plate 42 supported by the top plate 42, a pressing plate 43 that can be raised and lowered between the top plate 42 and the mounting surface 22, and a cylinder mechanism 46 that moves the pressing plate 43 up and down.

The pressing plate 43 is formed with four guide holes 431 through which the four columns 41 penetrate. The four columns 41 penetrating the guide hole 431 guide the raising and lowering of the pressing plate 43. The pressing plate 43 is formed by laminating a base plate 44 made of a highly rigid material such as a metal plate and an elastic plate 45 made of a material such as elastic rubber. The elastic plate 45 is fixed to the lower surface of the base plate 44. As a result, when the pressing plate 43 is lowered, the elastic plate 45 is brought into contact with the substrate A.

The cylinder mechanism 46 is an actuator such as an air cylinder. The cylinder mechanism 46 is fixed to the top plate 42. The cylinder mechanism 46 raises and lowers the pressing plate 43 by expanding and contracting the rod 47, which extends in the vertical direction and whose tip is fixed to the base plate 44, in the vertical direction. In the cylinder mechanism 46, when the substrate A is placed at the inspection position, for example, when the user operates an operation switch (not shown), the pressing plate 43 is lowered and the electrodes A1 and A2 of the substrate A are anisotropically conductive members. Press on 31 and 32 (see FIG. 3).

FIG. 4 is a partial cross-sectional view conceptually showing a state in which the substrate A is pressed by the anisotropic conductive members 31 and 32 by the pressing plate 43. A plurality of electrodes E1 (first electrode) and a plurality of electrodes E2 (second electrode) are arranged on the upper surface of the jig substrate 30 so as to correspond to the arrangement of the electrodes A1 and A2 on the substrate A. There is. Then, when the substrate A positioned at the inspection position is pressed by the anisotropic conductive members 31 and 32, as shown in FIG. 4, the electrodes A1 and A2 and the electrodes E1 and E2 are formed by the anisotropic conductive members. They are arranged so as to face each other with 31 and 32 in between.

The anisotropic conductive members 31 and 32 have a first surface S1 for contacting the electrodes A1 and A2, and a second surface S2 facing the first surface S1. The resistance of the anisotropic conductive members 31 and 32 is such that the resistance value with respect to the thickness direction of the anisotropic conductive members 31 and 32 in the first direction orthogonal to the first surface S1 is along the surface direction of the first surface S1. It can be smaller than the resistance value in two directions.

"The resistance value in the first direction (thickness direction) can be smaller than the resistance value in the second direction" means that the anisotropic conductive members 31 and 32 are conductive in the thickness direction even if they are not pressed. It means that it may be conductive in the thickness direction when pressed.

By conducting the electrodes A1 and A2 with the electrodes E1 and E2 via the elastic anisotropic conductive members 31 and 32, damage to the electrodes A1 and A2 is prevented.

In FIG. 4, the resistance between the electrode A1 and the electrode E1 is indicated by the resistor RR1, and the resistance between the electrode A2 and the electrode E2 is indicated by the resistor RR2. The resistors RR1 and RR2 include the resistance of the anisotropic conductive members 31 and 32 themselves, the contact resistance between the anisotropic conductive members 31 and 32 and the electrodes A1 and A2, and the anisotropic conductive members 31 and 32 and the electrodes. It is assumed that the contact resistance with E1 and E2 is included.

FIG. 5 is a block diagram showing an example of the electrical configuration of the substrate inspection device 1 shown in FIG. FIG. 5 shows a state in which the substrate A to be inspected is attached to the substrate inspection device 1. The transparent wiring of the substrate A and the like are indicated by the resistance RD, and the internal resistance of the wiring and the like of the jig board 3 are indicated by RJ1 and RJ2. In FIG. 5, the electrodes A1 and A2 and the electrodes E1 and E2 are described in pairs, and the description of the electrodes is omitted.

In the jig board 3, one end of the resistor RC1 is connected to the electrode E1, the other end of the resistor RC1 is connected to the connector CN1 via the internal resistance RJ1, and one end of the resistor RC2 is connected to the electrode E2. The other end of the device RC2 is connected to the connector CN2 via the internal resistor RJ2. The internal resistances RJ1 and RJ2 are connected in series with the resistors RC1 and RC2 and are distributed before and after the internal resistances RJ1 and RJ2. However, in FIG. 5, for convenience, between the resistors RC1 and RC2 and the connectors CN1 and CN2. The internal resistances RJ1 and RJ2 are described.

The device main body 2 includes a power supply unit 24, an ammeter 25 (detection unit), a control unit 26, and connectors CN1 and CN2. One of the device main body 2 and the jig board 3 has a male side of the connectors CN1 and CN2, and the other has a female side of the connectors CN1 and CN2. As a result, the jig board 3 can be attached to and detached from the device main body 2.

When the arrangement of the electrodes A1 and A2 of the substrate A changes, it becomes necessary to change the arrangement of the electrodes E1 and E2 and the size and shape of the anisotropic conductive members 31 and 32. However, since the jig board 3 is removable from the device main body 2, the new board A can be supported by simply replacing the jig board 3 without changing the device main body 2. Is made possible. Further, since the jig board 3 is provided with a resistor RC1, RC2, by exchanging the jig board 3, resistors RC1, RC2 resistance _RC 1, RC ₂ the suitable new substrate A value of Can be changed to.

The power supply unit 24 is, for example, an AC voltage source, and outputs a preset AC measurement voltage Vs. The ammeter 25 measures the current output from the power supply unit 24, and outputs the measured current value Is to the control unit 26. The ammeter 25 is configured by using, for example, a shunt resistor, a Hall element, an analog-digital converter, or the like.

Then, when the substrate A is attached to the substrate inspection device 1, the connector CN1, the internal resistance RJ1, the resistor RC1, the electrode E1, the resistance RR1, the electrode A1, the resistance RD, the electrode A2, the resistance RR2, the electrode E2, A current path for resistance measurement is formed to return to the power supply unit 24 via the resistor RC2, the internal resistance RJ2, the connector CN2, and the ammeter 25.

The control unit 26 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, a non-volatile storage device that stores a predetermined control program, and the like in advance. It is a microcomputer equipped with these peripheral circuits and the like. By executing the above program, the control unit 26 functions as a resistance acquisition unit 261 and a substrate inspection unit 262.

The resistance acquisition unit 261 calculates the resistance value R of the resistance measurement current path based on the measurement voltage Vs and the measurement current value Is based on the following equation (1).
Resistance value R = Vs / Is ... (1)

Here, the resistance value of the internal resistance _{RJ1, RJ2 RJ 1, RJ 2} , resistors RC1, _RC 1 the resistance value of RC2, RC _2, resistors RR1, _RR 1 the resistance value of RR2, RR _2, resistor RD Assuming that the resistance value is Rd, the resistance value is R = RJ ₁ + RC ₁ + RR ₁ + Rd + RR ₂ + RC ₂ + RJ ₂ . Therefore, the resistance value R includes the resistance value Rd of the resistance RD of the substrate A, the resistance values RR ₁ and RR _{2 of the} anisotropic conductive members 31 and 32, and the resistance values RC ₁ and RC ₂ of the resistors RC ₁ and RC _2. And the internal resistance values RJ ₁ and RJ _{2 of} the jig board 3 are included.

The device main body 2 further includes a voltage measuring unit for measuring the voltage between the connectors CN1 and CN2, and the resistance acquisition unit 261 has a resistance value R from the equation (1) with the voltage measured by the voltage measuring unit as Vs. May be calculated. Alternatively, as the power supply unit 24, a constant current circuit that outputs a current with a preset current value Is is used, and instead of the ammeter 25, a voltage measuring unit that measures the voltage between the connectors CN1 and CN2 is provided, and a resistance acquisition unit is provided. For 261, the resistance value R may be calculated using the equation (1) from the preset current value Is and the voltage Vs measured by the voltage measuring unit. Further, the power supply unit 24 may output a DC voltage or a DC current.

If the voltage or current output from the power supply unit 24 is a constant fixed value, the measured current value Is or voltage value detected by the detection unit and the resistance value R are in a proportional relationship of 1: 1. Correspond. Therefore, the resistance acquisition unit 261 may acquire the measured current value Is or the voltage value detected by the detection unit as information indicating the resistance value R as it is.

The substrate inspection unit 262 inspects the substrate A based on the resistance value R acquired by the resistance acquisition unit 261. Specifically, the substrate inspection unit 262 compares the resistance value R with the preset reference value, and considers it good when the resistance value R is equal to or less than the reference value and defective when the resistance value R exceeds the reference value. You may judge. In addition to the resistance value Rd of the substrate A, the resistance value R includes the resistance values RR ₁ and RR _{2 of the} heteroconductive members 31 and 32 and the internal resistance values RJ ₁ and RJ _{2 of the} jig board 3. However, even when the resistance value R includes the resistance values RR ₁ and RR ₂ and the internal resistance values RJ ₁ and RJ ₂ , the quality of the substrate A is roughly determined based on the resistance value R. May be possible.

Before measuring the resistance value Rd of the substrate A, for example, the resistance value is measured by the resistance acquisition unit 261 using a test substrate in which the electrodes A1 and A2 are short-circuited, and the obtained resistance value Rx is stored in the storage device. I will do it. After that, the substrate A to be measured is attached to the substrate inspection device 1, and the resistance value R is measured by the resistance acquisition unit 261. Then, the resistance acquisition unit 261 may calculate the resistance value Rd of the substrate A based on the following equation (2).
Resistance value Rd = R-Rx ... (2)

Further, the substrate inspection unit 262 may inspect the substrate A using the resistance value Rd obtained based on the resistance value R acquired by the resistance acquisition unit 261. Specifically, the substrate inspection unit 262 compares the resistance value Rd with the preset reference value, and considers it good when the resistance value Rd is equal to or less than the reference value and defective when the resistance value Rd exceeds the reference value. You may judge. By making a judgment using the resistance value Rd, the inspection accuracy of the substrate A is improved as compared with the case where the judgment is made using the resistance value R.

FIG. 6 is a tabular explanatory view for explaining the effect of the substrate inspection device 1 including the resistors RC1 and RC2. The table shown in FIG. 6, (Example) corresponds to the substrate inspection apparatus 1, (Comparative Example) When removing the resistor RC1, RC2 from the substrate inspection device 1, i.e. the resistance value _RC 1, RC ₂ is zero The case of Ω is shown.

First, since the internal resistance values RJ ₁ and RJ ₂ of the jig substrate 30 are wiring resistance and the like, they are usually extremely low resistance, and RJ ₁ + RJ ₂ = 1Ω. For the resistors RC1 and RC2, for example, the total resistance value RC ₁ + RC ₂ is substantially equal to the ideal design resistance value Rd of the substrate A to be measured, for example, the ideal resistance value Rd. When is 100Ω, RC ₁ = RC ₂ = 50Ω, and the resistance value RC ₁ + RC ₂ is 100Ω. The value of the resistance value RC ₁ + RC ₂ is preferably substantially equal to the ideal resistance value Rd or equal to or higher than the ideal resistance value Rd.

In the anisotropic conductive members 31 and 32, the resistance value of the anisotropic conductive members 31 and 32 themselves and the contact resistance with the electrodes A1, A2, E1 and E2 change according to the pressing pressure by the pressing mechanism 4. Therefore, the fluctuation range of the resistance values RR ₁ + RR ₂ due to the variation in the pressing pressure is large. Further, since the anisotropic conductive members 31 and 32 are made of a soft material such as rubber, the anisotropic conductive members 31 and 32 are likely to be worn and deteriorated in the process of repeating the resistance measurement. Therefore, wear, increases the resistance value _RR 1 + RR ₂ due to degradation, greater changes over time in the resistance value _RR 1 + _{RR 2.}

As a result, the resistance values RR ₁ + RR ₂ vary (variate) in the range of, for example, 1Ω to 500Ω.

The resistance value Rd of the substrate A to be measured varies depending on the type of the substrate A and the like. For example, when measuring the resistance value of the transparent wiring of the touch panel substrate, the general resistance value Rd is 100Ω. The degree is assumed.

According to the above conditions, in the substrate inspection device 1 provided with the resistors RC1 and RC2 (Example), the resistance value R = RJ ₁ + RJ ₂ + RC ₁ + RC ₂ + RR ₁ + RR ₂ + Rd = 202Ω to 702Ω. In this case, 702/202 = 3.46, and the resistance value R has a fluctuation factor of about 3.5 times.

On the other hand, in the case where the resistors RC1 and RC2 are not provided (comparative example), the resistance value is R = RJ ₁ + RJ ₂ + RR ₁ + RR ₂ + Rd = 102Ω to 602Ω. In this case, 602/102 = 5.90, and the resistance value R has a fluctuation factor of about 6 times.

As described above, the fluctuation ratio of the resistance value R is smaller in the case where the resistors RC1 and RC2 are provided and in the case where the resistors RC1 and RC2 are not provided. Therefore, by providing the resistors RC1 and RC2, it is possible to reduce the influence of the resistance variation of the anisotropic conductive member on the measurement result of the resistance value and improve the stability of the measurement.

The substrate inspection device 1 may be configured as a resistance measuring device without the substrate inspection unit 262. Further, the jig board 3 is not necessarily limited to the example in which the jig board 3 is detachable from the device main body 2, and the jig board 3 and the device main body 2 may be integrally configured. Further, the substrate inspection device 1 does not have to include the pressing mechanism 4.

That is, the resistance measuring device according to an example of the present invention is a resistance measuring device for measuring resistance between a pair of conductive pattern portions formed on one surface of a substrate, and is in contact with the pair of pattern portions. A second surface having a first surface and a second surface facing the first surface, and a resistance value with respect to a first direction orthogonal to the first surface is a second direction along the surface direction of the first surface. An anisotropic conductive member that can be smaller than the resistance value with respect to the first and second electrodes that are in contact with the second surface and are arranged so as to correspond to the arrangement of the pair of pattern portions, and the first electrode. A first resistor having one end connected to the second resistor, a second resistor having one end connected to the second electrode, the other end of the first resistor, and the other end of the second resistor. A power supply unit that supplies a current between the two, a detection unit that detects at least one of the voltage and current between the other end of the first resistor and the other end of the second resistor, and the detection unit. A resistance acquisition unit that acquires a resistance value including the resistance of the idiosyncratic conductive member and the resistance between the pair of pattern units based on the detected at least one is provided.

According to this configuration, the current supplied from the power supply unit is the first resistor, the first electrode, the anisotropic conductive member, one pattern portion, the other pattern portion, the anisotropic conductive member, the second electrode, and the like. And it flows through the current path for resistance measurement returning to the power supply unit via the second resistor. Therefore, the resistance value acquired by the resistance acquisition unit based on at least one of the voltage and current detected by the detection unit includes the resistance between the pair of pattern units to be measured and the first resistor. And the resistance value of the second resistor will be included. As a result, even if the resistance value of the anisotropic conductive member varies, the magnification between when the variation resistance value is small and when it is large does not include the first resistor and the second resistor. It becomes smaller than. Therefore, since the magnification of the measurement result of the resistance value with respect to the resistance variation of the anisotropic conductive member becomes small, it is easy to reduce the influence of the resistance variation of the anisotropic conductive member on the measurement result of the resistance value.

Further, it is preferable to further include a pressing portion that presses the substrate in contact with the first surface toward the first surface.

According to this configuration, the pressing portion can press the pair of pattern portions formed on one surface of the substrate against the anisotropic conductive member, so that the pair of pattern portions come into contact with the anisotropic conductive member. Can be stabilized.

Further, the resistance measuring device includes a device main body and a jig portion that can be attached to and detached from the device main body, and the power supply unit, the detection unit, and the resistance acquisition unit are provided in the device main body. It is preferable that the heteroelectric member, the first electrode, the second electrode, the first resistor, and the second resistor are provided in the jig portion.

According to this configuration, it is possible to replace the heteroelectric member, the first electrode, the second electrode, the first resistor, and the second resistor according to the substrate to be measured by simply replacing the jig part. Therefore, the flexibility of the resistance measuring device with respect to the measurement target is improved.

Further, the substrate inspection device according to an example of the present invention includes the above-mentioned resistance measuring device and a substrate inspection unit that inspects the substrate based on the resistance measured by the resistance measuring device.

According to this configuration, the substrate to be measured for resistance can be inspected.

The resistance measuring device and the substrate inspection device having such a configuration can easily reduce the influence of the resistance variation of the anisotropic conductive member on the measurement result of the resistance value.

This application is based on Japanese Patent Application No. 2018-007463 filed on January 19, 2018, the contents of which are included in the present application. In addition, the specific embodiment or example made in the section of the mode for carrying out the invention merely clarifies the technical content of the present invention, and the present invention is described in such a specific example. It should not be construed in a narrow sense.

1 Board inspection device 2 Device body 3 Jig board (jig)
4 Pressing mechanism (pressing part)
21 Housing 22 Mounting surface 23 Guide member 24 Power supply unit 25 Ammeter (detection unit)
26 Control unit 30 Jig substrate 31, 32 Heteroconductive member 41 Strut 42 Top plate 43 Press plate 44 Base plate 45 Elastic plate 46 Cylinder mechanism 47 Rod 261 Resistance acquisition unit 262 Board inspection unit 431 Guide hole A Substrate A1, A2 Electrode (pattern part)
CN1, CN2 connector E1 electrode (first electrode)
E2 electrode (second electrode)
Is current value R resistance value RC1 resistor (first resistor)
RC2 resistor (second resistor)
RD, RR1, RR2 resistance RJ1, RJ2 internal resistance _RJ 1, RJ ₂ internal resistance _{RC 1, RC 2, Rd,} RR 1, RR 2, Rx resistance value S1 first surface S2 second face Vs voltage

Claims (4)

A resistance measuring device that measures the resistance between a pair of conductive pattern portions formed on one surface of a substrate.
It has a first surface for contacting the pair of pattern portions and a second surface facing the first surface, and the resistance value in the first direction orthogonal to the first surface is the resistance value of the first surface. An anisotropic conductive member that can be smaller than the resistance value in the second direction along the plane direction,
The first and second electrodes which are in contact with the second surface and are arranged so as to correspond to the arrangement of the pair of pattern portions,
A first resistor with one end connected to the first electrode,
A second resistor with one end connected to the second electrode,
A power supply unit that supplies a current between the other end of the first resistor and the other end of the second resistor.
A detector that detects at least one of the voltage and current between the other end of the first resistor and the other end of the second resistor.
A resistance measuring device including a resistance acquisition unit that acquires a resistance value including the resistance of the anisotropic conductive member and the resistance between the pair of pattern units based on at least one of the detection units detected by the detection unit. The resistance measuring device according to claim 1, further comprising a pressing portion that presses the substrate in contact with the first surface toward the first surface. The resistance measuring device is
The main body of the device and
A jig part that can be attached to and detached from the device body is provided.
The power supply unit, the detection unit, and the resistance acquisition unit are provided in the device main body unit.
The resistance measuring device according to claim 1 or 2, wherein the anisotropic conductive member, the first electrode, the second electrode, the first resistor, and the second resistor are provided in the jig portion. .. The resistance measuring device according to any one of claims 1 to 3.
A substrate inspection apparatus including a substrate inspection unit that inspects the substrate based on the resistance measured by the resistance measuring apparatus.

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