JPWO2019065942A1 - プリプレグ、並びに、それを用いた金属張積層板及び配線基板 - Google Patents
プリプレグ、並びに、それを用いた金属張積層板及び配線基板 Download PDFInfo
- Publication number
- JPWO2019065942A1 JPWO2019065942A1 JP2019545666A JP2019545666A JPWO2019065942A1 JP WO2019065942 A1 JPWO2019065942 A1 JP WO2019065942A1 JP 2019545666 A JP2019545666 A JP 2019545666A JP 2019545666 A JP2019545666 A JP 2019545666A JP WO2019065942 A1 JPWO2019065942 A1 JP WO2019065942A1
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- prepreg
- group
- polyphenylene ether
- mass
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 61
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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Abstract
Description
本実施形態で用いる熱硬化性樹脂組成物は、(A)変性ポリフェニレンエーテル化合物を含む熱硬化性樹脂を含有する。本実施形態で使用する変性ポリフェニレンエーテル化合物は、末端変性された変性ポリフェニレンエーテル化合物であればよく、例えば、ポリフェニレンエーテル鎖を分子中に有し、後述するような置換基Xにより末端変性された変性ポリフェニレンエーテル化合物等が挙げられる。具体的には、例えば、下記式(1)または(2)で表される変性ポリフェニレンエーテルである。
本実施形態において用いられる(B)成分、すなわち、表面の少なくとも一部にモリブデン化合物が存在する第1の無機充填剤について説明する。
本実施形態の樹脂組成物は、上述した第1の無機充填剤以外に、第2の無機充填剤を、熱硬化性樹脂100質量部に対し、200質量部以下で含む。第2の無機充填剤の含有量が200質量部以下であれば、十分な成形性と加工性が得られると考えられる。
本実施形態の熱硬化性樹脂組成物には、上記した成分以外に、本発明の効果を損なわない範囲で、その他の成分を含めることもできる。
次に、本実施形態のプリプレグについて説明する。
・Qガラス Dk:3.3超〜3.8以下、Df:0.0017以下
・QLガラス Dk:3.8超〜4.3以下、Df:0.0023超〜0.0033以下
・Lガラス Dk:4.2超〜4.7以下、Df:0.0033超〜0.0043以下
次に、本実施形態のプリプレグを得る方法について説明する。
図2に示すように、本実施形態の金属張積層板11は、上述のプリプレグの硬化物を含む絶縁層12と、金属箔13とを有することを特徴とする。
図3に示すように、本実施形態の配線基板21は、上述のプリプレグの硬化物を含む絶縁層12と、配線14とを有する。
(ポリフェニレンエーテル化合物)
・変性PPE−1:ポリフェニレンエーテルの末端水酸基をメタクリル基で変性した変性ポリフェニレンエーテル(上記式(2)で表され、式(2)中のXがメタクリル基であり、式(2)の中のYがジメチルメチレン基(式(3)で表され、式(3)中のR17及びR18がメチル基である基)である変性ポリフェニレンエーテル化合物、SABICイノベーティブプラスチックス社製のSA9000、重量平均分子量Mw2000、末端官能基数2個)
・変性PPE−2:ポリフェニレンエーテルとクロロメチルスチレンとを反応させて得られた変性ポリフェニレンエーテルである。
・TAIC:トリアリルイソシアヌレート(日本化成株式会社製のTAIC、分子量249、末端二重結合数3個)
・DCP:トリシクロデカンジメタノールジメタクリレート(新中村化学株式会社製のDCP、末端二重結合数2個)
・エポキシ樹脂:ジシクロペンタジエン型エポキシ樹脂(DIC株式会社製のエピクロンHP7200、平均エポキシ基数2.3個)
(第1の無機充填剤)
・KG−911C:モリブデン酸亜鉛処理タルク(Huber社製)
・KG−911A:モリブデン酸カルシウム処理タルク(Huber社製)
(第2の無機充填剤)
・SC−2300SVJ:球状シリカ(株式会社アドマテックス製)
(その他)
・モリブデン酸亜鉛(和光純薬工業株式会社製)
・過酸化物:「パーブチルP(PBP)」(日本油脂株式会社製)
・イミダゾール系反応開始剤:「2E4MZ」(四国化成製、2エチル4メチルイミダゾール)
・Qガラス:石英ガラスクロス(信越石英株式会社製のSQF2116AC−04、#1078タイプ)を、分子中にメタクリル基を有するシランカップリング剤で表面処理したガラスクロス(通気度:25cm3/cm2/秒、Dk:3.5、Df:0.0015)
・QLガラス:QガラスとLガラスのハイブリッドガラス(旭化成株式会社製のQLガラス、#1078タイプ)(通気度:20cm3/cm2/秒、Dk:4.0、Df:0.0028)
・Lガラス:Lガラスクロス(汎用低誘電ガラスクロス、旭化成株式会社製のL1078、#1078タイプ)(通気度:20cm3/cm2/秒、Dk:4.5、Df:0.0038)
[調製方法]
(樹脂ワニス)
まず、無機充填材以外の各成分を表1に記載の配合割合(質量部)で、固形分濃度が60質量%となるように、トルエンに添加し、混合させた。その混合物を、室温で60分間攪拌した。その後、得られた液体に無機充填材を添加し、ビーズミルで無機充填材を分散させた。そうすることによって、ワニス状の樹脂組成物(ワニス)が得られた。
次に、得られたワニスを、表1に示す繊維質基材(ガラスクロス)に含浸させた後、130℃で約3〜8分間加熱乾燥することによりプリプレグを作製した。その際、プリプレグの重量に対する樹脂組成物の含有量(レジンコンテント)が約55質量%となるように調整した。
上記のように調製された各プリプレグ及び評価積層板を、以下に示す方法により評価を行った。
10GHzにおけるそれぞれの評価基板(上記で得られたプリプレグの硬化物)の誘電正接を、空洞共振器摂動法で測定した。具体的には、ネットワーク・アナライザ(アジレント・テクノロジー株式会社製の「N5230A」)を用い、10GHzにおける評価基板の誘電正接を測定した。評価基準としては、Dfが0.002以下を合格ラインとする。
評価基板(上記で得られた銅張積層板)を用いて、図4に示すように基板を設置して、下記ドリル加工条件で5000hit後の穴位置精度を測定した。
エントリーボード:Al 0.15mm
重ね枚数:0.75 mm×2枚重ね
穴径:0.3φ×5.5
ビット品番:NHUL020
回転数:160Krpm
送り速度:20μ/rev
Hit数:5000hit
評価基準としては、穴位置精度が50μm以下であれば合格とした。
評価基板(上記で得られた銅張積層板)を用いて、JIS C 6481 の規格に準じて耐熱性を評価した。所定の大きさに切り出した銅張積層板を280℃に設定した恒温槽に1時間放置した後、取り出した。そして熱処理された試験片を目視で観察し、フクレが発生しなかったときを○、フクレが発生したときを×として評価した。
成形後のサンプルにおいて、銅箔をエッチングにて除去したサンプルに対して、以下の基準で顕微鏡観察(SEM)により成形性を評価した。
成形性評価基準:
○:成型品の表面および断面にボイド、カスレの発生なし
×:成型品の表面、断面観察の結果ボイド、カスレの発生あり
表1の結果から、本発明により、非常に優れた誘電特性と、耐熱性と成形性を有し、さらにドリル加工性に優れるプリプレグおよび積層板を提供できることができることが示された。それに対し、本発明の構成と異なるプリプレグを使用した比較例においては、少なくともいずれかの評価項目において実施例よりも劣る結果となった。
Claims (6)
- 熱硬化性樹脂組成物又は熱硬化性樹脂組成物の半硬化物と、繊維質基材とを有するプリプレグであって、
前記熱硬化性樹脂組成物が、(A)変性ポリフェニレンエーテル化合物を含む熱硬化性樹脂と、(B)表面の少なくとも一部にモリブデン化合物が存在する第1の無機充填剤と、(C)第2の無機充填剤とを含み、
前記(A)熱硬化性樹脂100質量部に対し、前記(B)第1の無機充填剤の含有量が0.1質量部以上15質量部以下であり、かつ、前記(C)第2の無機充填剤の含有量が200質量部以下であり、
前記繊維質基材が、石英ガラスヤーンを含むガラスクロスである、プリプレグ。 - 前記(A)熱硬化性樹脂がさらに架橋剤を含む、請求項1に記載のプリプレグ。
- 前記(B)第1の無機充填剤において、前記モリブデン化合物が、モリブデン酸亜鉛、モリブデン酸カルシウム、モリブデン酸マグネシウムから選択される少なくとも1つ以上の金属塩からなる化合物である、請求項1又は2に記載のプリプレグ。
- 前記(C)第2の無機充填剤の含有量が、前記(A)熱硬化性樹脂100質量部に対し、50質量部以上である、請求項1〜3のいずれかに記載のプリプレグ。
- 請求項1〜4のいずれかに記載のプリプレグの硬化物を含む絶縁層と、金属箔とを有する、金属張積層板。
- 請求項1〜4のいずれかに記載のプリプレグの硬化物を含む絶縁層と、配線とを有する、配線基板。
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