JPWO2019031199A1 - Thermal print head and method for manufacturing thermal print head - Google Patents

Abstract

The thermal print head comprises a support, an electrode layer and a resistor layer (4). The support includes a substrate. The resistor layer (4) covers at least a part of the electrode layer. The resistor layer (4) includes a plurality of heat generating parts (40) arranged in the main scanning direction (x). The electrode layer includes a common electrode (33) having a plurality of common electrode strips (34) each extending in a first direction (N1) intersecting the main scanning direction (x), and a common electrode (33) each having the common scanning direction (x). a plurality of individual electrodes (36) having individual electrode strips (38) extending in the second direction (N2) intersecting x). The leading edge (341) of the plurality of common electrode strips (34) and the leading edge (381) of the plurality of individual electrode strips (38) are in the third direction (x) crossing the main scanning direction (x). N3) are spaced apart from each other and face each other. The resistor layer (4) is located between the tip edges (341) of the plurality of common electrode strips (34) and the tip edges (381) of the plurality of individual electrode strips (38). The plurality of heat generating portions (40) are formed by the portion of the resistor layer (4) including the portion.

Description

The present disclosure relates to a thermal printhead and a method for manufacturing a thermal printhead.

A conventional thermal printhead includes a substrate and an electrode layer and a resistor layer formed on the substrate. The electrode layer and the resistor layer are formed by firing a so-called thick film printed conductor paste. The electrode layer has a plurality of common electrode strips and a plurality of individual electrode strips, each extending in the sub-scanning direction. The plurality of common electrode strips and the plurality of individual electrode strips are alternately arranged in the main scanning direction. The resistor layer is formed in a strip shape extending in the main scanning direction so as to intersect with and cover the plurality of common electrode strip portions and the plurality of individual electrode strip portions.

The thermal printhead provided by the first aspect of the present disclosure includes a support, an electrode layer, and a resistor layer. The support includes a substrate. The resistor layer covers at least a part of the electrode layer. The resistor layer includes a plurality of heat generating parts arranged in the main scanning direction. The electrode layer includes a common electrode having a plurality of common electrode strips each extending in a first direction intersecting the main scanning direction and an individual electrode strip extending in a second direction each intersecting the main scanning direction. A plurality of individual electrodes having. The tip edges of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions are arranged so as to be spaced apart from each other in a third direction intersecting the main scanning direction. The resistor layer includes a portion located between the tip edges of the plurality of common electrode strips and the tip edges of the plurality of individual electrode strips, and the portion of the resistor layer allows the plurality of The heat generating part is formed.

A method of manufacturing a thermal print head provided by the second aspect of the present disclosure includes printing a conductive paste on a support including a substrate and forming an electrode layer by firing the conductive paste. The electrode layer includes a common electrode having a plurality of common electrode strips each extending in a first direction intersecting the main scanning direction, and an individual electrode extending in a second direction each intersecting the main scanning direction. A plurality of individual electrodes having strip-shaped portions, and the tip edges of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions are separated from each other in a third direction intersecting the main scanning direction. And facing each other, printing a resistor paste so as to cover the leading edges of the plurality of common electrode strips and the plurality of individual electrode strips of the electrode layer, and Forming a resistor layer by firing the body paste.

Other features and advantages of the present disclosure will become more apparent from the detailed description given below with reference to the accompanying drawings.

FIG. 3 is a plan view showing the thermal print head according to the first embodiment of the present disclosure. It is sectional drawing which follows the II-II line of FIG. FIG. 3 is a plan view of a main part showing the thermal print head according to the first embodiment of the present disclosure. FIG. 3 is an enlarged plan view of a main part showing the thermal print head according to the first embodiment of the present disclosure. FIG. 5 is a cross-sectional view of main parts taken along the line VV of FIG. 4. It is a principal part expanded sectional view which follows the VI-VI line of FIG. It is a principal part expanded sectional view which follows the VII-VII line of FIG. It is a principal part expanded sectional view which follows the VIII-VIII line of FIG. FIG. 3 is a plan view of a principal portion showing the method of manufacturing the thermal print head according to the first embodiment of the present disclosure. FIG. 3 is a plan view of a principal portion showing the method of manufacturing the thermal print head according to the first embodiment of the present disclosure. It is a principal part expanded sectional view which follows the XI-XI line of FIG. FIG. 6 is an enlarged cross-sectional view of a main part showing the method of manufacturing the thermal print head according to the first embodiment of the present disclosure. FIG. 9 is a main-portion cross-sectional view showing a modified example of the thermal print head according to the first embodiment of the present disclosure. FIG. 6 is an enlarged plan view of a main part showing a thermal print head according to a second embodiment of the present disclosure. FIG. 6 is an enlarged plan view of a main part showing a thermal print head according to a third embodiment of the present disclosure. FIG. 13 is an enlarged plan view of a main part showing a first modified example of the thermal print head according to the third embodiment of the present disclosure. FIG. 11 is an enlarged plan view of a main part showing a second modified example of the thermal print head according to the third embodiment of the present disclosure. FIG. 7 is an enlarged plan view of a main part showing a thermal print head according to a fourth embodiment of the present disclosure. It is a principal part enlarged plan view which shows the thermal print head which concerns on 5th Embodiment of this indication.

Hereinafter, preferred embodiments of the present disclosure will be specifically described with reference to the drawings.

<First Embodiment>
1 to 8 show an example of the thermal print head according to the first embodiment of the present disclosure. The thermal print head A1 of the present embodiment includes a support 1, an electrode layer 3, a resistor layer 4, a protective layer 5, a drive IC 71, a sealing resin 72, a connector 73, a wiring board 74, and a heat dissipation member 75. The thermal print head A1 is incorporated in a printer that prints on the thermal paper 82 pressed by the platen roller 81 to create a barcode sheet or a receipt, for example. For convenience of understanding, the protective layer 5 is omitted in FIGS. 1, 3, and 4. In these drawings, the main scanning direction x and the sub-scanning direction y and the thickness direction z of the substrate 11 are used as the coordinate reference. Further, in FIG. 4, the support 1 is omitted for convenience of understanding.

FIG. 1 is a plan view showing the thermal print head A1. FIG. 2 is a sectional view taken along the line II-II of FIG. FIG. 3 is a plan view of a main part showing the thermal print head A1. FIG. 4 is an enlarged plan view of an essential part showing the thermal print head A1. FIG. 5 is a cross-sectional view of the main part taken along the line VV of FIG. FIG. 6 is an enlarged cross-sectional view of essential parts taken along the line VI-VI of FIG. FIG. 7 is an enlarged cross-sectional view of main parts taken along the line VII-VII of FIG. FIG. 8 is an enlarged cross-sectional view of the main part taken along the line VIII-VIII of FIG.

The support 1 supports the electrode layer 3, the resistor layer 4, and the protective layer 5. The support 1 is composed of a substrate 11 and a glaze layer 12.

The substrate 11 is made of ceramics such as AlN and Al ₂ O _3, and has a thickness of, for example, about 0.6 to 1.0 mm. As shown in FIG. 1, the substrate 11 has an oblong shape that extends in the main scanning direction x. As shown in FIG. 2, a wiring board 74 in which a base layer made of glass epoxy resin and a wiring layer made of Cu or the like are laminated may be provided adjacent to the support 1. A heat dissipation member 75 made of a metal such as Al is provided on the lower surface of the substrate 11. In the configuration including the wiring board 74, for example, the board 11 and the wiring board 74 are arranged adjacent to each other on the heat dissipation member 75, and the wiring of the electrode layer 3 on the board 11 and the wiring board 74 (or an IC connected to this wiring). ) And are connected by wire bonding or the like. Further, the wiring board 74 may be provided with the connector 73 shown in FIG.

Glaze layer 12 is formed on substrate 11, and is made of a glass material such as amorphous glass. The softening point of this glass material is, for example, 800 to 850°C. The glaze layer 12 is formed by printing a glass paste on a thick film and then firing it. In this embodiment, the entire upper surface of the substrate 11 in the figure is covered with the glaze layer 12. In addition, in the present embodiment, the glaze layer 12 has a bulging portion 121 and an auxiliary portion 122.

The bulging portion 121 has a strip shape extending in the main scanning direction x, and has an arcuate cross-section that slightly bulges upward in the drawing. The resistor layer 4 is formed on the bulging portion 121. The bulging portion 121 is for suppressing the heat generated from the heat generating portion 40 of the resistor layer 4 from being excessively transferred to the substrate 11.

The auxiliary portion 122 is formed so as to cover a portion of the substrate 11 exposed from the bulging portion 121. The bulging portion 121 is for forming a smooth surface suitable for forming the electrode layer 3 by covering the surface of the substrate 11 which is a relatively rough surface.

The bulging portion 121 and the auxiliary portion 122 are made of glass, for example. The specific selection of such glass is made in view of sufficiently exhibiting the heat storage function of the bulging portion 121 and the smoothing function of the auxiliary portion 122. In addition, as the material of the auxiliary portion 122, it is preferable to use a glass paste having a viscosity lower than that of the glass paste used as the material of the bulging portion 121.

The electrode layer 3 serves to form a path for energizing the resistor layer 4, and is made of a conductive material. The material of the electrode layer 3 is not particularly limited, and is made of, for example, Au or Pt to which rhodium, vanadium, bismuth, silicon or the like is added as an additive element. In the present embodiment, the main component of the electrode layer 3 is Au. The electrode layer 3 is formed by thick-film printing a resinate Au paste containing an organic compound and then firing the paste. The electrode layer 3 may include glass particles through a firing process. The electrode layer 3 may be formed by stacking a plurality of Au layers. The thickness of the electrode layer 3 is, for example, about 0.4 μm to 1.0 μm.

As shown in FIGS. 3 and 4, the electrode layer 3 has a common electrode 33 and a plurality of individual electrodes 36.

The common electrode 33 has a plurality of common electrode strip portions 34 and a common electrode connecting portion 35. The common electrode connecting portion 35 is arranged near the downstream side end of the support 1 in the sub scanning direction y and has a strip shape extending in the main scanning direction x. Each of the plurality of common electrode strip portions 34 extends from the common electrode connecting portion 35 along the first direction N1 shown in FIG. 4, and is arranged at equal pitches in the main scanning direction x. The first direction N1 is a direction that intersects the main scanning direction x. The common electrode strip portion 34 has a leading edge 341. The tip edge 341 is an edge located at the tip of the common electrode strip portion 34. Further, in the present embodiment, as shown in FIG. 3, an Ag layer 351 is laminated on the common electrode connecting portion 35. The Ag layer 351 is for reducing the resistance value of the common electrode connecting portion 35.

The plurality of individual electrodes 36 are for partially energizing the resistor layer 4 and are portions having opposite polarities with respect to the common electrode 33. The individual electrode 36 extends from the resistor layer 4 toward the drive IC 71. The plurality of individual electrodes 36 are arranged in the main scanning direction x, and each has an individual electrode connecting portion 37 and an individual electrode strip portion 38. Further, the plurality of individual electrodes 36 may each have a bonding portion (not shown) for bonding the wire 61 connected to the drive IC 71.

As shown in FIG. 4, each individual electrode strip portion 38 is a strip portion extending along the second direction N2. The second direction N2 is a direction that intersects the main scanning direction x. The individual electrode strip portion 38 has a leading edge 381. The tip edge 381 is an edge located at the tip of the individual electrode strip portion 38.

The individual electrode connecting portion 37 is a portion extending from the individual electrode strip portion 38 toward the drive IC 71, and most of the individual electrode connecting portion 37 has a portion along the sub-scanning direction y and a portion inclined with respect to the sub-scanning direction y. .. The distance between the adjacent individual electrode connecting portions 37 may be smaller than the distance between the adjacent individual electrode strip portions 38. In this case, the width of the individual electrode connecting portion 37 is larger than the width of the individual electrode strip portion 38.

The tip edges 341 of the plurality of common electrode strip portions 34 and the tip edges 381 of the plurality of individual electrode strip portions 38 are arranged so as to be separated and opposed to each other in the third direction N3. The third direction N3 is a direction that intersects the main scanning direction x. In the present embodiment, the leading edges 341 of the plurality of common electrode strips 34 and the leading edges 381 of the plurality of individual electrode strips 38 are located on the bulging portion 121 of the glaze layer 12. Further, in the present embodiment, the tip edges 341 of the plurality of common electrode strip portions 34 and the tip edges 381 of the plurality of individual electrode strip portions 38 are both perpendicular to the third direction N3.

In the present embodiment, the first direction N1 forms an angle α1 with the sub-scanning direction y. The second direction N2 forms an angle α2 with the sub-scanning direction y. The third direction N3 forms an angle α3 with the sub-scanning direction y. The first direction N1 and the second direction N2 are the same direction, and the first direction N1 and the second direction N2 are the same direction N3. That is, the angle α1, the angle α2, and the angle α3 are the same angle. The angles α1, α2, and α3 are not particularly limited, and are preferably 15° to 30°.

In the present embodiment, the common electrode strip portion 34 has a first side edge 342, a second side edge 343, and a third side edge 344. The first lateral edge 342 makes an angle β1 with the common electrode connecting portion 35 (main scanning direction x). The angle β1 is an acute angle and is, for example, 60° to 75° in the present embodiment. The second side edge 343 is located on the opposite side of the first side edge 342 and forms an angle β2 with the common electrode connecting portion 35 (main scanning direction x). The angle β2 is an obtuse angle and is, for example, 105° to 120° in the present embodiment. The third side edge 344 is interposed between the first side edge 342 and the common electrode connecting portion 35 and forms an angle β3 with the common electrode connecting portion 35 (main scanning direction x). There is. The angle β3 is larger than the angle β1, and is 90° in the present embodiment, for example.

The distance between the adjacent common electrode strip portions 34 and the distance between the adjacent individual electrode strip portions 38 are not particularly limited, and are, for example, 15 μm to 30 μm, for example, about 20 μm. In this case, if the center distance between the adjacent common electrode strip portions 34 and the center distance between the adjacent individual electrode strip portions 38 is 42.3 μm, a so-called 600 dpi printing resolution is obtained.

The resistor layer 4 is made of, for example, ruthenium oxide having a higher resistivity than the material forming the electrode layer 3, and is formed in a strip shape extending in the main scanning direction x. As shown in FIG. 5, in the present embodiment, the resistor layer 4 has a cross-sectional shape that is perpendicular to the main scanning direction x and bulges toward the side separated from the support 1 in the thickness direction z. .. The resistor layer 4 is laminated on the side opposite to the support 1 with respect to the electrode layer 3 so as to partially cover the electrode layer 3. The resistor layer 4 covers the leading edges 341 of the plurality of common electrode strips 34 of the common electrode 33 and the leading edges 381 of the individual electrode strips 38 of the plurality of individual electrodes 36. A portion of the resistor layer 4 sandwiched between the leading edges 341 of the plurality of common electrode strip portions 34 and the leading edges 381 of the individual electrode strip portions 38 of the plurality of individual electrodes 36 serves as a plurality of heat generating portions 40. .. The plurality of heat generating parts 40 selectively generate heat by being partially energized by the electrode layer 3. The print dots are formed by the heat generated by the heat generating section 40. The thickness of the resistor layer 4 is, for example, 4 μm to 10 μm.

As shown in FIGS. 4 and 6 to 8, in the present embodiment, the resistor layer 4 has a plurality of slits 41. The slit 41 is located between the adjacent heat generating parts 40 and penetrates the resistor layer 4 in the thickness direction z. The slit 41 is provided between the common electrode strip portion 34 and the individual electrode strip portion 38 which are adjacent to each other when viewed in the thickness direction z. In the present embodiment, the slit 41 is provided at a position that does not overlap the common electrode strip portion 34 and the individual electrode strip portion 38. Further, in the illustrated example, the slits 41 reach both end edges of the resistor layer 4 in the sub-scanning direction y. As a result, the plurality of heat generating portions 40 are separated from each other. In addition, in the illustrated example, the slit 41 has a shape along the third direction N3.

As shown in FIGS. 4 and 6 to 8, a portion of the resistor layer 4 that constitutes one heat generating portion 40 has a pair of resistor side surfaces 411 and a pair of resistor inclined surfaces 412.

The pair of resistor side surfaces 411 are located on both sides of the heat generating portion 40 in the main scanning direction x (strictly, a direction perpendicular to the third direction N3), and with respect to the direction in which the substrate 11 spreads (xy plane). It is a surface that stands up. The upright surface in this specification is a surface whose angle with the reference plane is typically 90°, but is intended not to include at least a surface that is smoothly connected to the reference plane. For example, an example of the resistor side surface 411 is a surface having an angle γ of about 80° to 90° shown in FIGS. 6 to 8.

The pair of resistor inclined surfaces 412 are connected to the support 1 side with respect to the pair of resistor side surfaces 411, and are interposed between the pair of resistor side surfaces 411 and the support 1. The resistor inclined surface 412 is a surface that is located outward in the main scanning direction x (strictly, a direction that is perpendicular to the third direction N3) as it approaches the support 1 in the thickness direction z. In the illustrated example, the resistor inclined surface 412 is a concave curved surface. The radius of curvature of the resistor inclined surface 412 is 0.5 μm to 2 μm, for example, about 1 μm. The dimension of the resistor inclined surface 412 in the thickness direction z is smaller than the dimension of the resistor side surface 411 in the thickness direction z.

In the present embodiment, the resistor side surface 411 is provided at a position that does not overlap the common electrode strip portion 34 and the individual electrode strip portion 38 when viewed in the thickness direction z, in other words, the common electrode strip portion 34 and the individual electrode strip portion. It is located outside the portion 38. Further, the resistor inclined surface 412 is provided at a position that does not overlap the common electrode strip portion 34 and the individual electrode strip portion 38 in the thickness direction z view, in other words, the common electrode strip portion 34 and the individual electrode strip portion 38. It is located outside.

The protective layer 5 is for protecting the electrode layer 3 and the resistor layer 4. The protective layer 5 is made of, for example, amorphous glass.

The drive IC 71 has a function of causing the heating portion 40 of the corresponding resistor layer 4 to generate heat by selectively energizing the plurality of individual electrodes 36. The drive IC 71 is provided with a plurality of pads. The pad of the drive IC 71 and the plurality of individual electrodes 36 are connected to each other via a plurality of wires 61 bonded to each pad. The wire 61 is made of Au. As shown in FIGS. 1 and 2, the drive IC 71 and the wire 61 are covered with a sealing resin 72. The sealing resin 72 is made of, for example, black soft resin. The drive IC 71 and the connector 73 are connected by a signal line (not shown).

Next, an example of a method of manufacturing the thermal print head A1 will be described below with reference to FIGS.

First, as shown in FIG. 9, a substrate 11 made of, for example, Al ₂ O ₃ is prepared. Next, the glass paste is thick-film printed on the substrate 11 and then baked to form the glaze layer 12 having the bulged portion 121 and the auxiliary portion 122. Next, a conductive paste printing step of thick-film printing the resinate Au paste is performed. Then, an electrode forming step is performed. In this step, the conductive paste is fired to form a metal film. The thick film printing and firing steps may be repeated a plurality of times. Next, the electrode layer 3 is formed by patterning the metal film using, for example, etching. The electrode layer 3 has a common electrode 33 and a plurality of individual electrodes 36. Further, the Ag layer 351 is formed by printing and firing Ag paste, for example, after or simultaneously with the formation of the electrode layer 3.

Next, as shown in FIGS. 10 and 11, a resistor paste printing step of thick-film printing a resistor paste 4A containing a resistor such as ruthenium oxide is performed. In this step, the resistor paste 4A is printed in a strip shape extending in the main scanning direction x so as to cover the leading edges 341 of the plurality of common electrode strip portions 34 and the leading edges 381 of the plurality of individual electrode strip portions 38. The surface of the thick-film printed resistor paste 4A is a curved surface that swells gently in the thickness direction z.

Then, a drying process is performed. In this step, the resistor paste 4A is dried in an environment in which the electrode layer 3 and the resistor paste 4A do not undergo unintentional alteration or the like. This drying reduces the solvent contained in the resistor paste 4A. Although such a dried resistor paste 4A maintains the above-described cross-sectional shape, it has a significantly brittle property as compared with before drying.

Next, as shown in FIG. 12, a removing step of partially removing the dried resistor paste 4A is performed. The removing method in the removing step is not particularly limited, and shot blasting is used in the present embodiment. The mask 91 is made to face the support 1. The mask 91 is provided with a plurality of penetrating portions 92. Each of the plurality of penetrating portions 92 is a penetrating hole that penetrates the mask 91 in the thickness direction z. Each of the plurality of penetrating portions 92 is a slit along the third direction N3 and is arranged in the main scanning direction x. In the present embodiment, the y dimension of the penetrating portion 92 in the sub scanning direction is larger than the y dimension of the resistor paste 4A. The plurality of penetrating portions 92 are arranged between the common electrode strip-shaped portions 34 adjacent to each other and the individual electrode strip-shaped portions 38 adjacent to each other.

The projection material is sprayed from the plurality of penetrating portions 92 onto the resistor paste 4A in a state in which the plurality of penetrating portions 92 are located between the adjacent common electrode belt-shaped portions 34 and the adjacent individual electrode belt-shaped portions 38 when viewed in the thickness direction z. .. The projection material is a granular material that is appropriately selected, and in the present embodiment, a material that has a hardness that does not damage the electrode layer 3 or the glaze layer 12 while appropriately removing the dried resistor paste 4A is selected. Is preferred. Examples of the material of such a shot material include silica. By this spraying, the resistor paste 4A is partially and sequentially removed, and a plurality of slits 41 are formed.

The projection material, which is a granular material, has a predetermined average particle diameter. As an example of the size of the shot material, in the case of a spherical shot material, the diameter is, for example, 1 μm to 4 μm, for example, about 2 μm. Therefore, in the portion of the resistor paste 4A remaining after the removal step, which should become the heat generating portion 40, the resistor side surface 411 located above the thickness direction z and the resistor slope located below the thickness direction z. A surface 412 is formed. The resistor inclined surface 412 is a concave curved surface having a radius of curvature corresponding to the average particle diameter of the shot material. The radius of curvature of the resistor inclined surface 412 is 0.5 μm to 2 μm, for example, about 1 μm.

Then, a resistor layer forming step is performed. In this step, the dried resistor paste 4A is fired at a predetermined temperature. As a result, the resistor layer 4 having the above-described configuration is obtained.

After that, for example, a thick film of glass paste is printed, and this is baked to form the protective layer 5. The thermal print head A1 is obtained by mounting the drive IC 71, bonding the wires 61, and attaching the support 1 and the wiring board 74 to the heat dissipation member 75.

Next, the operation of the thermal print head A1 and the method of manufacturing the thermal print head A1 will be described.

According to the present embodiment, as shown in FIG. 4, the plurality of common electrode strip portions 34 of the common electrode 33 and the plurality of individual electrode strip portions 38 of the individual electrode 36 do not overlap in the main scanning direction x view. The heat generating portion 40 of the resistor layer 4 is a portion between the leading edge 341 of the common electrode strip portion 34 and the leading edge 381 of the individual electrode strip portion 38, which are separated in the third direction N3. Therefore, the size of one heat generating portion 40 in the main scanning direction x can be reduced as compared with the configuration in which the plurality of common electrode strip portions 34 and the plurality of individual electrode strip portions 38 are alternately arranged in the main scanning direction x. Is possible. Therefore, high-definition printing of the thermal print head A1 can be achieved.

Further, the thermal print head A1 which is a so-called thick film type thermal print head in which the electrode layer 3 and the resistor layer 4 which covers a part of the electrode layer 3 are formed by thick film printing is There is an advantage that it is less susceptible to deterioration due to friction with the print target. Therefore, high-definition printing can be achieved while avoiding shortening of product life.

A plurality of slits 41 are formed in the resistor layer 4, as shown in FIGS. 4 and 6 to 8. In the present embodiment, the slits 41 reach both ends of the resistor layer 4 in the sub-scanning direction y and completely separate the adjacent heat generating portions 40 from each other. As a result, when a certain individual electrode 36 is energized, a current flows through the individual electrode strip portion 38 of this individual electrode 36 and only one heat generating portion 40. Therefore, it is possible to concentrate the electric current in the heat generating portion 40 that should generate heat, which is preferable for high definition printing.

As shown in FIG. 12, the resistor paste 4A printed in the resistor paste printing step is dried in the drying step. Then, the resistor paste 4A which has become brittle after the drying step is partially removed by the removing step. Therefore, in the removal step, the desired removal target portion of the resistor paste 4A can be easily removed. Further, in order to remove the resistor paste 4A, it is not necessary to adopt a removing method that exerts a particularly strong removing function. Therefore, there is an advantage that the electrode layer 3 and the glaze layer 12 are less likely to be unduly damaged in the removing step. Further, the dimensional accuracy of the plurality of slits 41 of the resistor layer 4 can be improved. Further, if shot blasting is used in the removing step, it is possible to reliably remove a desired portion of the resistor paste 4A.

Further, in the present embodiment, as shown in FIG. 4, the first direction N1, the second direction N2, and the third direction N3 are inclined with respect to the sub-scanning direction y. For this reason, the print dots formed on the print medium by the heat generation of the heat generating unit 40 are likely to have a shape inclined with respect to the sub-scanning direction y along the third direction N3. Although the adjacent heating units 40 are partitioned by the slits 41, the third scanning direction N3 is the sub-scanning direction in the main scanning direction x distance between the downstream end of the adjacent printing dots in the sub-scanning direction y and the upstream end of the sub-scanning direction y. It is reduced by tilting with respect to the direction y. Therefore, it is possible to make the gap between the adjacent print dots hard to be recognized by the naked eye, and it is possible to perform clearer printing with high contrast.

In the present embodiment, both the leading edge 341 of the common electrode strip portion 34 and the leading edge 381 of the individual electrode strip portion 38 are perpendicular to the third direction N3. As a result, the distance between the leading edge 341 and the leading edge 381 is uniform. Therefore, when the common electrode strip-shaped portion 34 and the individual electrode strip-shaped portion 38 are energized to cause a current to flow through the heat generating portion 40, between the leading edge 341 and the leading edge 381 in the third direction N3. A current can flow along it. If the distances between the leading edge 341 and the leading edge 381 in the third direction N3 are non-uniform, a current flows so as to intersect with the third direction N3, or the current is biased to a portion in the width direction of the heat generating portion 40. There is a risk of flow, which hinders uniform heat generation and reduces heat generation efficiency. According to this embodiment, more uniform heat generation is possible, and heat generation efficiency can be improved.

The resistor layer 4 has a resistor inclined surface 412 as shown in FIGS. 4 and 6 to 8. The resistor inclined surface 412 expands the joint area at the joint between the resistor layer 4 and the glaze layer 12. Therefore, it is preferable for improving the bonding strength of the resistor layer 4. In addition, when stress is generated at the joint between the resistor layer 4 and the glaze layer 12 due to heat generation of the heat generating portion 40 of the resistor layer 4 when the thermal print head A1 is used, this stress is relaxed. Can be expected.

As shown in FIGS. 4 and 6 to 8, the plurality of slits 41 are formed at positions that do not overlap the plurality of common electrode strip portions 34 and the plurality of individual electrode strip portions 38 when viewed in the thickness direction z. Accordingly, there is an advantage that it is possible to prevent the common electrode strip portion 34 and the individual electrode strip portion 38 from being damaged in the removing step for forming the slit 41. Further, the resistor inclined surface 412 is located outside the plurality of common electrode strip portions 34 and the plurality of individual electrode strip portions 38 in the z direction of the thickness direction, and is provided at a position not overlapping these. This has an advantage that the common electrode strip portion 34 and the individual electrode strip portion 38 can be prevented from being damaged, and the bonding strength of the resistor layer 4 can be further increased.

As shown in FIG. 4, the common electrode strip portion 34 is provided with a third lateral edge 344. As a result, even if the common electrode strip portion 34 is tilted along the first direction N1 with respect to the sub-scanning direction y, at the coupling portion of the common electrode strip portion 34 and the common electrode coupling portion 35, the current is the third. It is possible to flow a shorter path along the lateral edge 344. This is different from the present embodiment in that when the common electrode strip portion 34 does not have the third lateral edge 344, the current flowing through the coupling portion between the common electrode strip portion 34 and the common electrode connecting portion 35 is diverted. This is advantageous in increasing the energization efficiency as compared with the case where the route is inevitable.

13 to 19 show modifications and other embodiments of the present disclosure. In these figures, the same or similar elements as those in the above embodiment are designated by the same reference numerals as in the above embodiment.

<Modification of First Embodiment>
FIG. 13 shows a modification of the thermal print head A1. In this modification, the glaze layer 12 of the support 1 does not have the bulging portion 121 in the above-described example, but is formed only by the portion corresponding to the auxiliary portion 122. Therefore, the glaze layer 12 has a flat shape as a whole. High-definition printing can be achieved also by this modification. Further, as understood from this modification, the configuration of the glaze layer 12 of the support 1 is not particularly limited, and the support 1 may not have the glaze layer 12. This point is the same in the following embodiments.

<Second Embodiment>
FIG. 14 shows a thermal print head according to the second embodiment of the present disclosure. The thermal print head A2 of the present embodiment differs from the above-described embodiments in the configuration of the leading edges 341 of the plurality of common electrode strips 34 and the leading edges 381 of the plurality of individual electrode strips 38. In the present embodiment, the leading edges 341 of the plurality of common electrode strips 34 and the leading edges 381 of the plurality of individual electrode strips 38 are both arranged in the main scanning direction x. High-definition printing can be achieved also by such an embodiment. Further, as understood from the present embodiment, the angles of the leading edge 341 and the leading edge 381 can be changed and set as appropriate.

<Third Embodiment>
FIG. 15 shows a thermal print head according to the third embodiment of the present disclosure. The thermal print head A3 of the present embodiment differs from the above-described embodiments in the configuration of the plurality of slits 41 of the resistor layer 4.

In the present embodiment, the slit 41 does not reach either end edge of the resistor layer 4 in the sub-scanning direction y. That is, the slit 41 is in the form of an elongated through hole. Also in this embodiment, the slit 41 extends along the third direction N3. The dimension of the slit 41 in the third direction N3 is larger than the dimension of the resistor layer 4 located on both sides of the slit 41 in the third direction N3. In addition, in the third direction N3 direction, the slit 41 overlaps the leading edge 341 and the leading edge 381. In other words, both ends of the slit 41 in the third direction N3 are located closer to both ends of the resistor layer 4 in the sub-scanning direction y than the leading edge 341 and the leading edge 381.

Even with such an embodiment, high definition printing can be achieved. Further, as understood from this modification, the resistor layer 4 is not limited to the configuration in which the plurality of heat generating portions 40 are completely partitioned. According to the present modification, both ends of the slit 41 in the third direction N3 are located closer to both ends of the resistor layer 4 in the sub scanning direction y than the leading edge 341 and the leading edge 381. When the individual electrode 36 is energized, a current flows from the leading edge 381 of the individual electrode strip portion 38 of the individual electrode 36 to the common electrode strip portion 34 other than the common electrode strip portion 34 facing in the third direction N3. Can be suppressed.

<Third Embodiment First Modification>
FIG. 16 shows a first modified example of the thermal print head according to the third embodiment of the present disclosure. In the thermal print head A31 of this modified example, the slit 41 reaches the lower edge (upstream edge) in the sub-scanning direction y in the figure, and the upper edge (downstream) in the sub-scanning direction y in the figure. Side edge) has not been reached. In addition, in the third direction N3 direction, the slit 41 overlaps the leading edge 341 and the leading edge 381. The upper end (downstream side end) of the slit 41 in the third direction N3 is located closer to the upper edge (downstream side edge) of the resistor layer 4 in the sub-scanning direction y than the leading edge 341.

<Third Embodiment Second Modification>
FIG. 17 shows a second modification example of the thermal print head according to the third embodiment of the present disclosure. In the thermal print head A32 of this modification, the slit 41 reaches the upper edge (downstream edge) in the sub-scanning direction y in the drawing, and the lower edge in the sub-scanning direction y (upstream end). Side edge) has not been reached. In addition, in the third direction N3 direction, the slit 41 overlaps the leading edge 341 and the leading edge 381. The lower end (upstream side end) of the slit 41 in the third direction N3 is located closer to the lower edge (upstream side edge) of the resistor layer 4 in the sub-scanning direction y than the leading edge 381.

Also with these modified examples, high-definition printing can be achieved. Further, as understood from these modified examples, the configuration of the slit 41 of the resistor layer 4 can be variously changed.

<Fourth Embodiment>
FIG. 18 shows a thermal print head according to the fourth embodiment of the present disclosure. In the thermal print head A4 of this embodiment, the first direction N1, the second direction N2, and the third direction N3 are different from each other. In the illustrated example, the second direction N2 is the same as the sub-scanning direction y. An angle α1 formed by the first direction N1 and the sub-scanning direction y is smaller than an angle α3 formed by the third direction N3 and the sub-scanning direction y.

Also according to this embodiment, high definition printing can be achieved. Further, as understood from the present embodiment, the angle formed by the first direction N1, the second direction N2, and the third direction N3 with the sub-scanning direction y can be appropriately changed and set.

<Fifth Embodiment>
FIG. 19 shows a thermal print head according to the fifth embodiment of the present disclosure. In the thermal print head A5 of this embodiment, the first direction N1, the second direction N2, and the third direction N3 are all the same as the sub-scanning direction y. Also according to this embodiment, high definition printing can be achieved.

The thermal print head and the method for manufacturing the thermal print head according to the present disclosure are not limited to the above-described embodiments. The specific configuration of the thermal print head and the method for manufacturing the thermal print head according to the present disclosure can be modified in various ways.

The present disclosure may include the embodiments according to the following supplementary notes.
[Appendix 1]
A support including a substrate,
An electrode layer,
A resistor layer covering at least a part of the electrode layer, the resistor layer including a plurality of heat generating portions arranged in the main scanning direction,
The electrode layer is
A common electrode having a plurality of common electrode strips each extending in a first direction intersecting the main scanning direction;
A plurality of individual electrodes each having an individual electrode strip portion extending in a second direction intersecting the main scanning direction,
The tip edges of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions are arranged so as to be spaced apart from each other in a third direction intersecting the main scanning direction,
The resistor layer includes a portion located between the tip edges of the plurality of common electrode strips and the tip edges of the plurality of individual electrode strips, and the portion of the resistor layer allows the plurality of The thermal print head in which the heat generating part of is formed.
[Appendix 2]
2. The thermal print head according to appendix 1, wherein the first direction and the second direction are the same direction.
[Appendix 3]
3. The thermal print head according to appendix 2, wherein the first direction, the second direction, and the third direction are the same direction.
[Appendix 4]
4. The thermal print head according to any one of appendices 1 to 3, wherein an angle formed by the first direction, the second direction, and the third direction with respect to the sub-scanning direction is 15° to 30°.
[Appendix 5]
A plurality of slits are formed in the resistor layer, and any one of the plurality of slits is located between two adjacent heat generating parts among the plurality of heat generating parts. 4. The thermal print head according to any one of 4 above.
[Appendix 6]
6. The thermal print head according to appendix 5, wherein the slit reaches both ends of the resistor layer in the sub scanning direction.
[Appendix 7]
7. The supplementary note 5 or 6, wherein the plurality of slits are formed at positions that do not overlap with any of the plurality of common electrode strips and the plurality of individual electrode strips when viewed in the thickness direction of the support. Thermal print head.
[Appendix 8]
Any one of the plurality of heat generating portions of the resistor layer is
Two resistor side surfaces respectively located on both sides in the main scanning direction,
8. The thermal print head according to appendix 7, comprising: two resistor side surfaces and two resistor inclined surfaces interposed between the support and the support.
[Appendix 9]
9. The thermal print according to appendix 8, wherein any one of the two resistor inclined surfaces is located outside the common electrode strip and the individual electrode strip in the thickness direction of the support. head.
[Appendix 10]
The size in the thickness direction of the substrate of any one of the two resistor inclined surfaces is smaller than the size of any one of the two resistor side surfaces in the thickness direction. The thermal print head described.
[Appendix 11]
11. The thermal print head according to any one of appendices 1 to 10, wherein the leading edges of the plurality of common electrode strips and the leading edges of the plurality of individual electrode strips are perpendicular to the third direction. ..
[Appendix 12]
Any one of appendices 1 to 11, wherein the common electrode has a common electrode connecting portion that is connected to the opposite side of the resistor layer in the sub-scanning direction with respect to the plurality of common electrode strips and extends in the main scanning direction. The thermal print head described in.
[Appendix 13]
The common electrode strip is
A first lateral edge along the first direction and forming an acute angle with the common electrode connecting portion;
A second lateral edge along the first direction and forming an obtuse angle with the common electrode connecting portion;
A third side edge which is interposed between the first side edge and the common electrode connecting section and whose angle formed with the common electrode connecting section is larger than the angle formed by the first side edge. 13. The thermal print head according to appendix 12, comprising:
[Appendix 14]
14. The thermal print head according to any one of appendices 1 to 13, wherein the resistor layer has a cross-sectional shape that is perpendicular to the main scanning direction and bulges toward the side away from the support.
[Appendix 15]
15. The thermal print head according to any one of appendices 1 to 14, wherein the support further includes a glaze layer interposed between the substrate and the electrode layer and between the substrate and the resistor layer.
[Appendix 16]
The glaze layer includes a bulge portion, and the bulge portion is interposed between the tip edge of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions and the substrate, and 16. The thermal print head according to appendix 15, which bulges toward the side away from the substrate.
[Appendix 17]
Printing a conductive paste on a support including the substrate,
Forming an electrode layer by firing the conductive paste, the electrode layer,
A common electrode having a plurality of common electrode strips each extending in a first direction intersecting the main scanning direction;
A plurality of individual electrodes each having an individual electrode strip portion extending in a second direction intersecting with the main scanning direction, and a leading edge of the plurality of common electrode strip portions and a leading edge of the plurality of individual electrode strip portions. And are arranged so as to be separated from each other in a third direction intersecting the main scanning direction, and
Printing a resistor paste so as to cover the leading edges of the plurality of common electrode strips of the electrode layer and the leading edges of the plurality of individual electrode strips;
A method of manufacturing a thermal print head, comprising: forming a resistor layer by firing the resistor paste.
[Appendix 18]
After printing the resistor paste and before forming the resistor layer,
Drying the resistor paste,
In the dried resistor paste, to form a slit between the adjacent common electrode strip portion and the individual electrode strip portion,
17. The method for manufacturing a thermal print head according to appendix 17, further comprising:
[Appendix 19]
19. The method for manufacturing a thermal print head according to appendix 18, wherein shot blasting is used to form the slits.

Claims (19)

A support including a substrate,
An electrode layer,
A resistor layer covering at least a part of the electrode layer, the resistor layer including a plurality of heat generating portions arranged in the main scanning direction,
The electrode layer is
A common electrode having a plurality of common electrode strips each extending in a first direction intersecting the main scanning direction;
A plurality of individual electrodes each having an individual electrode strip portion extending in a second direction intersecting the main scanning direction,
The tip edges of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions are arranged so as to be spaced apart from each other in a third direction intersecting the main scanning direction,
The resistor layer includes a portion located between the tip edges of the plurality of common electrode strips and the tip edges of the plurality of individual electrode strips, and the portion of the resistor layer allows the plurality of The thermal print head in which the heat generating part of is formed. The thermal print head according to claim 1, wherein the first direction and the second direction are the same direction. The thermal print head according to claim 2, wherein the first direction, the second direction, and the third direction are the same direction. The thermal print head according to claim 1, wherein an angle formed by the first direction, the second direction, and the third direction with respect to the sub-scanning direction is 15° to 30°. A plurality of slits are formed in the resistor layer, and any one of the plurality of slits is located between two adjacent heat generating portions of the plurality of heat generating portions. 5. The thermal print head according to any one of 1 to 4. The thermal print head according to claim 5, wherein the slit reaches both end edges of the resistor layer in the sub-scanning direction. 7. The plurality of slits are formed at positions that do not overlap with any of the plurality of common electrode strip portions and the plurality of individual electrode strip portions when viewed in the thickness direction of the support. The thermal print head described. Any one of the plurality of heat generating portions of the resistor layer is
Two resistor side surfaces respectively located on both sides in the main scanning direction,
The thermal print head according to claim 7, further comprising: two resistor inclined surfaces interposed between the two resistor side surfaces and the support. 9. The thermal according to claim 8, wherein any one of the two resistor inclined surfaces is located outside the common electrode strip and the individual electrode strip in the thickness direction of the support. Print head. 10. The dimension in the thickness direction of the substrate of any one of the two resistor inclined surfaces is smaller than the dimension of any one of the two resistor side surfaces in the thickness direction. The thermal print head described in. The thermal print according to claim 1, wherein the tip edges of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions are perpendicular to the third direction. head. 12. The common electrode according to claim 1, wherein the common electrode has a common electrode connecting portion that is connected to the plurality of common electrode strip-shaped portions on the opposite side to the resistor layer in the sub-scanning direction and extends in the main scanning direction. The thermal print head described in 1. The common electrode strip is
A first lateral edge along the first direction and forming an acute angle with the common electrode connecting portion;
A second lateral edge along the first direction and forming an obtuse angle with the common electrode connecting portion;
A third side edge which is interposed between the first side edge and the common electrode connecting section and whose angle formed with the common electrode connecting section is larger than the angle formed by the first side edge. The thermal print head according to claim 12, comprising: 14. The thermal print head according to claim 1, wherein the resistor layer has a cross-sectional shape that is perpendicular to the main scanning direction and bulges toward the side away from the support. 15. The thermal printhead according to claim 1, wherein the support further includes a glaze layer interposed between the substrate and the electrode layer and between the substrate and the resistor layer. .. The glaze layer includes a bulge portion, and the bulge portion is interposed between the tip edge of the plurality of common electrode strip portions and the tip edges of the plurality of individual electrode strip portions and the substrate, and The thermal print head according to claim 15, which bulges toward a side separated from the substrate. Printing a conductive paste on a support including the substrate,
Forming an electrode layer by firing the conductive paste, the electrode layer,
A common electrode having a plurality of common electrode strips each extending in a first direction intersecting the main scanning direction;
A plurality of individual electrodes each having an individual electrode strip portion extending in a second direction intersecting with the main scanning direction, and a leading edge of the plurality of common electrode strip portions and a leading edge of the plurality of individual electrode strip portions. And are arranged so as to be separated from each other in a third direction intersecting the main scanning direction, and
Printing a resistor paste so as to cover the leading edges of the plurality of common electrode strips of the electrode layer and the leading edges of the plurality of individual electrode strips;
A method of manufacturing a thermal print head, comprising: forming a resistor layer by firing the resistor paste. After printing the resistor paste and before forming the resistor layer,
Drying the resistor paste,
In the dried resistor paste, to form a slit between the adjacent common electrode strip portion and the individual electrode strip portion,
The method for manufacturing a thermal print head according to claim 17, further comprising: The method for manufacturing a thermal print head according to claim 18, wherein shot blasting is used in forming the slits.

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