JPWO2018225773A1 - 熱伝導性導電性接着剤組成物 - Google Patents
熱伝導性導電性接着剤組成物 Download PDFInfo
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- JPWO2018225773A1 JPWO2018225773A1 JP2019523937A JP2019523937A JPWO2018225773A1 JP WO2018225773 A1 JPWO2018225773 A1 JP WO2018225773A1 JP 2019523937 A JP2019523937 A JP 2019523937A JP 2019523937 A JP2019523937 A JP 2019523937A JP WO2018225773 A1 JPWO2018225773 A1 JP WO2018225773A1
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- Prior art keywords
- epoxy resin
- adhesive composition
- conductive
- acid
- conductive adhesive
- Prior art date
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Abstract
Description
[1](A)導電性フィラー、(B)エポキシ樹脂、(C)反応性希釈剤および(D)硬化剤を含む熱伝導性導電性接着剤組成物であって、
前記(A)導電性フィラーは、平均粒子径0.5〜4.8μm、タップ密度5.0〜8.0g/cm3の銀粉であり、
前記(B)エポキシ樹脂は、1分子内に2個以上のエポキシ官能基および芳香環を有し、且つ液状エポキシ樹脂または液状エポキシ樹脂と固体状エポキシ樹脂との混合物であり、
前記(C)反応性希釈剤は、脂肪族炭化水素鎖に1個以上のグリシジルエーテル官能基を有し、
前記(D)硬化剤は、1分子内に2個以上のフェノール官能基を有する化合物若しくは1分子内に1個以上のイミダゾール基を有する化合物またはこれらの混合物であることを特徴とする、熱伝導性導電性接着剤組成物。
[2]前記(B)エポキシ樹脂として、1分子内に2個以上のエポキシ官能基を有する化合物を1〜5質量%含む[1]に記載の熱伝導性導電性接着剤組成物。
[3]前記(B)エポキシ樹脂が、フルオレン型エポキシ樹脂を含む[1]または[2]に記載の熱伝導性導電性接着剤組成物。
[4]前記(C)反応性希釈剤が、脂肪族炭化水素鎖に2個のグリシジルエーテル官能基を有する化合物である[1]〜[3]のいずれか1に記載の熱伝導性導電性接着剤組成物。
[5]前記(D)硬化剤が2−フェニル−4,5−ジヒドロキシメチルイミダゾールである[1]〜[4]のいずれか1に記載の熱伝導性導電性接着剤組成物。
[6]液状である[1]〜[5]のいずれか1に記載の熱伝導性導電性接着剤組成物。
(A)導電性フィラーは銀粉であり、平均粒子径が0.5〜4.8μmであり、好ましくは0.5〜4.5μmであり、より好ましくは0.6〜4μm、更に好ましくは0.7〜4μm、最も好ましくは0.8〜4μmである。銀粉の平均粒子径が0.5μm未満であると、接着剤の硬化後の収縮が抑制されなくなるため被接着材料との密着性が低下してしまう。銀粉の平均粒子径が4.8μmを超えると銀粉の焼結が進みにくく被着材料との接合が不足し密着が低下してしまう。なお、銀粉の平均粒子径はレーザー回折法により測定された値を意味する。
(1)銀の純度を99%〜100%とし、電解法にて製造する。
(2)銀の純度を99%〜100%とし、化学還元法にて製造する。
(3)銀の純度を99%〜100%とし、アトマイズ法にて製造する。
(B)エポキシ樹脂は、1分子内に2個以上のエポキシ官能基および芳香環を有する化合物であり、液状エポキシ樹脂を含む。特に、硬化後の架橋密度の観点から、(B)エポキシ樹脂は1分子内に2個のエポキシ官能基を有する化合物であることが好ましい。液状エポキシ樹脂は、1種類だけ使用しても2種類以上を併用してもよい。
(C)反応性希釈剤は、室温で液体のものであり、25℃における粘度が0.1Pa・s未満のものである。また反応性希釈剤は、脂肪族炭化水素鎖に1個以上のグリシジル官能基を有する化合物である。なおグリシジル官能基以外にも、他の重合性官能基、例えば、ビニルおよびアリル等のアルケニル基、並びにアクリロイルおよびメタクリロイル等の不飽和基を有していてもよい。
(D)硬化剤は、1分子内に2個以上のフェノール官能基を有する化合物若しくは1分子内に1個以上のイミダゾール基を有する化合物またはこれらの混合物である。
本発明の接着剤組成物には硬化促進剤を配合することもできる。硬化促進剤としては、例えば、第3級アミン類、トリフェニルフォスフィン類、尿素系化合物、フェノール類、アルコール類、カルボン酸類等が挙げられる。硬化促進剤は1種類だけ使用しても2種類以上を併用してもよい。
表1に記載された各材料を三本ロールにて混練し、表1に示す組成の接着剤組成物を作製した(各材料の数値は接着剤組成物の総質量に対する質量%を表す)。使用した材料は下記の通りである。なお、混練の順番は、(A)成分および(E)成分の混練を最初に行い、続いて、その他の各種成分を混合し各成分が均一分散されるように混練を行った。200℃で1時間加熱後に室温まで放冷し接着剤組成物の硬化体を得た。
・銀粉(1):平均粒子径4μm、タップ密度6.7g/cm3、フレーク状(田中貴金属工業社製)
・銀粉(2):平均粒子径2μm、タップ密度6.3g/cm3、フレーク状(田中貴金属工業社製)
・銀粉(3):平均粒子径0.8μm、タップ密度5.5g/cm3、フレーク状(田中貴金属工業社製)
・銀粉(4):平均粒子径5μm、タップ密度7.0g/cm3、フレーク状(田中貴金属工業社製)
・銀粉(5):平均粒子径1.0μm、タップ密度3.5g/cm3、フレーク状(田中貴金属工業社製)
・エポキシ樹脂(1):ビスフェノールF型(EPICRON EXA−830CRP、DIC社製、室温で液状)
・エポキシ樹脂(2):ビスフェノールA型−ポリエチレンオキサイド型エポキシ樹脂(EP−4000S,ADEKA製、室温で液状)
・エポキシ樹脂(3):ジシクロペンタジエン型エポキシ樹脂(EP−4088S、ADEKA製、室温で液状)
・エポキシ樹脂(4):フルオレン型エポキシ樹脂(OGSOL EG−280、大阪ガスケミカル製、室温で液状)
・エポキシ樹脂(5):グリシジルアミン型エポキシ樹脂(JER630、三菱化学株社製、室温で液状)
・エポキシ樹脂(6):フェノールノボラック型エポキシ樹脂(Epalloy 8330、PTIジャパン社製、室温で液状)
・反応性希釈剤(1):脂肪族炭化水素鎖に2個のグリシジルエーテル官能基を有する反応希釈剤、1、4シクロヘキサンジメタノールジグリシジルエーテル(分子量256)
・反応性希釈剤(2):脂肪族炭化水素鎖に2個のグリシジルエーテル官能基を有する反応性希釈剤、ネオペンチルグリコールジグリシジルエーテル(分子量216)
・反応性希釈剤(3):脂肪族炭化水素鎖に1個のグリシジルエステル官能基を有する反応性希釈剤、ネオデカン酸グリシジルエステル(分子量228)
・硬化剤(1):1分子内に2個以上のフェノール官能基を有する化合物(MEH8000H、明和化成社製)
・硬化剤(2):2−フェニル−4,5−ジヒドロキシメチルイミダゾール(2PHZ)(反応温度領域145〜175℃)
・硬化剤(3):2−フェニル−4―メチル−5−ヒドロキシメチルイミダゾール(2P4MHZ)(反応温度領域130〜150℃)
・硬化剤(4):2−フェニル−4−メチルイミダゾール(2P4MZ)(反応温度領域95〜125℃)
・ブチルカルビトールアセテート(BCA)
1.熱伝導率の測定
前記接着剤組成物の熱伝導特性を評価するため、該接着剤組成物の熱伝導率を測定した。熱伝導率λ(W/m・K)は、レーザーフラッシュ法熱定数測定装置(TC−7000、ULVAC−RIKO社製)を用いてASTM−E1461に準拠して熱拡散aを測定し、ピクノメーター法により室温での比重dを算出し、示差走査熱量測定装置(DSC7020、セイコー電子工業社製)を用いてJIS−K7123(2012年)に準拠して室温での比熱Cpを測定して以下の式により算出した。
λ=a×d×Cp
前記接着剤組成物の高温環境における被接着材料に対する接着性を評価するため、該接着剤組成物のダイシェア強度を測定した。2mm×2mm、厚み220mmの接合面が銀スパッタされたチップを銀めっき表面の銅リードフレーム上にダイボンディングした。加熱硬化条件は230℃にて1時間とした。これを用いてダイシェア強度をDAGE4000(ノードソン・アドバンスト・テクノロジー社製)により測定した。
(A)導電性フィラーを除いて接着剤組成物を調製し、その粘度を測定した。粘度は、回転式粘度計としてコーンプレート型粘度計により、3°×R14コーンプレートを用いて回転数5ppm、温度25℃にて測定した。
Cuフレーム(Ni−Agで表面処理、4mm×4mmのダイパット)に2mm×2mm×220μmのシリコンチップ(Ti−Ni−Agで表面処理されたチップ)を、接着剤組成物を用いて接着し、窒素雰囲気中230℃に調節したオーブン中に60分間放置して、接着剤組成物を乾燥又は硬化させた。信頼性試験用サンプルとして10個ずつ作製した。試験用サンプルを用いて下記条件により信頼性試験を行い、二値化による画像解析にて接着剤組成物の乾燥物層または硬化物層の剥離面積の割合(%)を測定した。
・温度サイクル試験条件:+150℃〜−55で2000サイクル
・PCT条件:温度121℃、湿度100%、0.2MPa、192時間
Claims (6)
- (A)導電性フィラー、(B)エポキシ樹脂、(C)反応性希釈剤および(D)硬化剤を含む熱伝導性導電性接着剤組成物であって、
前記(A)導電性フィラーは、平均粒子径0.5〜4.8μm、タップ密度5.0〜8.0g/cm3の銀粉であり、
前記(B)エポキシ樹脂は、1分子内に2個以上のエポキシ官能基および芳香環を有し、且つ液状エポキシ樹脂または液状エポキシ樹脂と固体状エポキシ樹脂との混合物であり、
前記(C)反応性希釈剤は、脂肪族炭化水素鎖に1個以上のグリシジル官能基を有し、
前記(D)硬化剤は、1分子内に2個以上のフェノール官能基を有する化合物若しくは1分子内に1個以上のイミダゾール基を有する化合物またはこれらの混合物であることを特徴とする、熱伝導性導電性接着剤組成物。 - 前記(B)エポキシ樹脂として、1分子内に2個以上のエポキシ官能基を有する化合物を1〜5質量%含む請求項1に記載の熱伝導性導電性接着剤組成物。
- 前記(B)エポキシ樹脂が、フルオレン型エポキシ樹脂を含む請求項1または2に記載の熱伝導性導電性接着剤組成物。
- 前記(C)反応性希釈剤が、脂肪族炭化水素鎖に2個のグリシジルエーテル官能基を有する化合物である請求項1〜3のいずれか1項に記載の熱伝導性導電性接着剤組成物。
- 前記(D)硬化剤が2−フェニル−4,5−ジヒドロキシメチルイミダゾールである請求項1〜4のいずれか1項に記載の熱伝導性導電性接着剤組成物。
- 液状である請求項1〜5のいずれか1項に記載の熱伝導性導電性接着剤組成物。
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JP2015224329A (ja) * | 2014-05-29 | 2015-12-14 | 田中貴金属工業株式会社 | 熱伝導性導電性接着剤組成物 |
JP2015229699A (ja) * | 2014-06-03 | 2015-12-21 | 太陽インキ製造株式会社 | 導電性接着剤およびそれを用いた電子部品 |
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US20200157388A1 (en) | 2020-05-21 |
CN110709487A (zh) | 2020-01-17 |
JP7032398B2 (ja) | 2022-03-08 |
KR102387641B1 (ko) | 2022-04-18 |
DE112018002911T5 (de) | 2020-02-20 |
CN110709487B (zh) | 2022-01-14 |
WO2018225773A1 (ja) | 2018-12-13 |
KR20200003887A (ko) | 2020-01-10 |
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