JPWO2018110123A1 - 静電容量式センサおよび機器 - Google Patents
静電容量式センサおよび機器 Download PDFInfo
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- JPWO2018110123A1 JPWO2018110123A1 JP2018556238A JP2018556238A JPWO2018110123A1 JP WO2018110123 A1 JPWO2018110123 A1 JP WO2018110123A1 JP 2018556238 A JP2018556238 A JP 2018556238A JP 2018556238 A JP2018556238 A JP 2018556238A JP WO2018110123 A1 JPWO2018110123 A1 JP WO2018110123A1
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- 239000000463 material Substances 0.000 claims abstract description 76
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000002070 nanowire Substances 0.000 claims abstract description 27
- 239000011787 zinc oxide Substances 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000002042 Silver nanowire Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 67
- 239000011241 protective layer Substances 0.000 description 17
- 238000012360 testing method Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Abstract
Description
図1は、本実施形態に係る静電容量式センサを表す平面図である。
図2は、図1に表した領域A1を拡大した平面図である。
図3は、図2に表した切断面C1−C1における断面図である。
図4は、図2に表した切断面C2−C2における断面図である。
なお、透明電極は透明なので本来は視認できないが、図1および図2では理解を容易にするため透明電極の外形を示している。
図8は、ケルビンパターンを模式的に例示する平面図である。図8に表したようなケルビンパターンを用いて、銀ナノワイヤを含む第1の試料5Sと酸化亜鉛からなる第2の試料10Sとを互いに交差させた。第1の試料5Sは、第2の透明電極5に相当する。第2の試料10Sは、ブリッジ配線部10における第1層101(101a,101b)に相当する。本試験では、接触部分P1のY1−Y2方向の寸法L11および接触部分P1のX1−X2方向の寸法L12のいずれか一方を100μmに固定し、寸法L11および寸法L12のいずれか他方を変化させることで、接触部分P1の接触面積を変化させた。こうして、接触部分P1の接触面積が異なる複数のケルビンパターンを用意した。
第2の試料10Sに代えて、製法が異なる2種類のインジウム錫酸化物(ITO)からなる比較用試料を用いて、実施例1と同様に接触部分P1の接触面積が異なる複数のケルビンパターンを用意した。
(測定例)8585信頼性試験後の電気抵抗値の測定
2 基材
2a 主面(おもて面)
3 保護層
3a 面
4 第1の透明電極
5 第2の透明電極
5S 第1の試料
6 配線部
7 連結部
8 第1の電極連結体
10 ブリッジ配線部
10A1,10A2 接触部分
10B ブリッジ部分
101,101a,101b 第1層
10a 遠位側面
102 第2層
10S 第2の試料
11 検出領域
12 第2の電極連結体
16 接続配線
20 絶縁層
20a 表面
25 非検出領域
27 外部接続部
30 光学透明粘着層
A1 領域
C1 切断面
C2 切断面
L11 寸法
L12 寸法
P1 接触部分
200 タッチパネル
210 表示パネル
211 駆動基板
212 対向基板
213 液晶層
220 タッチセンサ
300 電子機器
310 筐体
320 表示部
400 コンピュータ
410 ディスプレイ
420 キーボード
430 入力パッド
401 中央演算部
402 主記憶部
403 副記憶部
404 入力部
405 出力部
406 インタフェース
Claims (8)
- 透光性を有する基材と、
前記基材の一方の主面の検出領域において第1の方向に沿って並んで配置され、透光性を有する複数の第1の透明電極と、
前記検出領域において前記第1の方向と交差する第2の方向に沿って並んで配置され、透光性を有し、導電性ナノワイヤを含む複数の第2の透明電極と、
前記第1の透明電極に一体として設けられ、隣り合う2つの前記第1の透明電極を互いに電気的に接続する連結部と、
前記第2の透明電極とは別体として前記連結部に交差する部分に設けられ、隣り合う2つの前記第2の透明電極を互いに電気的に接続するブリッジ配線部とを備え、
前記ブリッジ配線部は、前記隣り合う2つの第2の透明電極のそれぞれに接する2つの接触部分と、前記接触部分に連設され前記隣り合う2つの第2の透明電極から離間するブリッジ部分とからなり、
前記接触部分は積層構造を有し、前記第2の透明電極に接する部分を有する層が亜鉛酸化物系材料からなり、
前記ブリッジ部分における前記基材に対して遠位側に位置する面は、アモルファス酸化物系材料からなること
を特徴とする静電容量式センサ。 - 前記接触部分における前記第2の透明電極に最遠位な層は、アモルファス酸化物系材料からなる、請求項1に記載の静電容量式センサ。
- 前記ブリッジ部分は前記アモルファス酸化物系材料からなる、請求項1または2に記載の静電容量式センサ。
- 前記ブリッジ部分は積層構造を有し、前記第2の透明電極に最近位な層から連設される亜鉛酸化物系材料からなる層が、前記アモルファス酸化物系材料からなる層よりも前記基材に対して近位に配置される、請求項1、乃至、請求項3の何れかに記載の静電容量式センサ。
- 前記亜鉛酸化物系材料は、酸化亜鉛およびインジウム酸化亜鉛の少なくとも一方を含む、請求項1に記載の静電容量式センサ。
- 前記導電性ナノワイヤは、金ナノワイヤ、銀ナノワイヤ、および銅ナノワイヤよりなる群から選択された少なくとも1つであることを特徴とする請求項1記載の静電容量式センサ。
- 前記アモルファス酸化物系材料は、アモルファスITO、アモルファスGZO、アモルファスAZO、およびアモルファスFTOよりなる群から選択された少なくとも1つであることを特徴とする請求項1または2に記載の静電容量式センサ。
- 請求項1から7のいずれか一項に記載される静電容量式センサを備える機器。
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PCT/JP2017/039153 WO2018110123A1 (ja) | 2016-12-12 | 2017-10-30 | 静電容量式センサおよび機器 |
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WO2021075304A1 (ja) * | 2019-10-18 | 2021-04-22 | 富士フイルム株式会社 | 透明積層体、画像表示装置 |
TWI770800B (zh) * | 2021-02-02 | 2022-07-11 | 大陸商宸美(廈門)光電有限公司 | 電子裝置 |
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JP2013178738A (ja) * | 2012-02-10 | 2013-09-09 | Alps Electric Co Ltd | 入力装置 |
JP2014010516A (ja) * | 2012-06-28 | 2014-01-20 | Hitachi Chemical Co Ltd | 静電容量結合方式タッチパネルおよびその製造方法 |
JP2015118537A (ja) * | 2013-12-18 | 2015-06-25 | 大日本印刷株式会社 | タッチパネルセンサおよびタッチ位置検出機能付き表示装置 |
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CN102243553B (zh) * | 2010-05-16 | 2015-06-10 | 宸鸿科技(厦门)有限公司 | 电容式触控面板及降低其金属导体可见度的方法 |
CN104699285B (zh) * | 2013-12-09 | 2017-11-21 | 宸鸿科技(厦门)有限公司 | 触控感测结构及其形成方法 |
KR102263975B1 (ko) * | 2014-12-16 | 2021-06-11 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조방법 |
CN106919278A (zh) * | 2015-12-28 | 2017-07-04 | 宸鸿科技(厦门)有限公司 | 触控面板 |
WO2018066214A1 (ja) * | 2016-10-06 | 2018-04-12 | アルプス電気株式会社 | 静電容量式センサ |
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JP2013178738A (ja) * | 2012-02-10 | 2013-09-09 | Alps Electric Co Ltd | 入力装置 |
JP2014010516A (ja) * | 2012-06-28 | 2014-01-20 | Hitachi Chemical Co Ltd | 静電容量結合方式タッチパネルおよびその製造方法 |
JP2015118537A (ja) * | 2013-12-18 | 2015-06-25 | 大日本印刷株式会社 | タッチパネルセンサおよびタッチ位置検出機能付き表示装置 |
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CN110023892A (zh) | 2019-07-16 |
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