JPWO2018062508A1 - 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法 - Google Patents

物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法 Download PDF

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Publication number
JPWO2018062508A1
JPWO2018062508A1 JP2018542946A JP2018542946A JPWO2018062508A1 JP WO2018062508 A1 JPWO2018062508 A1 JP WO2018062508A1 JP 2018542946 A JP2018542946 A JP 2018542946A JP 2018542946 A JP2018542946 A JP 2018542946A JP WO2018062508 A1 JPWO2018062508 A1 JP WO2018062508A1
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Japan
Prior art keywords
holding
chuck
substrate
movement stage
base
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JP2018542946A
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English (en)
Japanese (ja)
Inventor
青木　保夫
保夫 青木
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Nikon Corp
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Nikon Corp
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2018062508A1 publication Critical patent/JPWO2018062508A1/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2018542946A 2016-09-30 2017-09-29 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法 Pending JPWO2018062508A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016195104 2016-09-30
JP2016195104 2016-09-30
PCT/JP2017/035547 WO2018062508A1 (ja) 2016-09-30 2017-09-29 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021021039A Division JP2021081740A (ja) 2016-09-30 2021-02-12 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Publications (1)

Publication Number Publication Date
JPWO2018062508A1 true JPWO2018062508A1 (ja) 2019-07-04

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Family Applications (3)

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JP2018542946A Pending JPWO2018062508A1 (ja) 2016-09-30 2017-09-29 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法
JP2021021039A Pending JP2021081740A (ja) 2016-09-30 2021-02-12 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2022148829A Active JP7414102B2 (ja) 2016-09-30 2022-09-20 物体保持装置及び露光装置

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JP2021021039A Pending JP2021081740A (ja) 2016-09-30 2021-02-12 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2022148829A Active JP7414102B2 (ja) 2016-09-30 2022-09-20 物体保持装置及び露光装置

Country Status (5)

Country Link
JP (3) JPWO2018062508A1 (zh)
KR (2) KR20210118252A (zh)
CN (1) CN109791369B (zh)
TW (1) TWI760371B (zh)
WO (1) WO2018062508A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102406293B1 (ko) * 2020-08-11 2022-06-10 에스씨플랫 주식회사 디스플레이 장치의 기판용 연마장비
KR20230135889A (ko) * 2022-03-17 2023-09-26 삼성전자주식회사 디스플레이 모듈을 포함하는 디스플레이 장치 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
JP2004165582A (ja) * 2002-09-17 2004-06-10 Nikon Corp 基板ホルダ、基板トレイ、ステージ装置、及び基板ホルダの製造方法
JP2005012009A (ja) * 2003-06-19 2005-01-13 Nikon Corp 基板保持装置、ステージ装置及び露光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2807905B2 (ja) * 1989-09-14 1998-10-08 日立電子エンジニアリング株式会社 基板チャック機構
JP2000012663A (ja) * 1998-06-17 2000-01-14 Nikon Corp 基板保持方法及び装置、及びそれを備えた露光装置
SG150388A1 (en) * 2002-12-10 2009-03-30 Nikon Corp Exposure apparatus and method for producing device
US7665981B2 (en) * 2005-08-25 2010-02-23 Molecular Imprints, Inc. System to transfer a template transfer body between a motion stage and a docking plate
JP2008251754A (ja) * 2007-03-29 2008-10-16 Nikon Corp 基板搬送方法及び装置、並びに露光方法及び装置
TW201100975A (en) 2009-04-21 2011-01-01 Nikon Corp Moving-object apparatus, exposure apparatus, exposure method, and device manufacturing method
KR101862234B1 (ko) * 2009-08-20 2018-05-29 가부시키가이샤 니콘 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법
JP5524577B2 (ja) * 2009-11-11 2014-06-18 キヤノン株式会社 露光装置及びデバイス製造方法
SG191479A1 (en) 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
JP6135099B2 (ja) * 2012-11-13 2017-05-31 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
JP2004165582A (ja) * 2002-09-17 2004-06-10 Nikon Corp 基板ホルダ、基板トレイ、ステージ装置、及び基板ホルダの製造方法
JP2005012009A (ja) * 2003-06-19 2005-01-13 Nikon Corp 基板保持装置、ステージ装置及び露光装置

Also Published As

Publication number Publication date
JP2022176233A (ja) 2022-11-25
JP2021081740A (ja) 2021-05-27
JP7414102B2 (ja) 2024-01-16
CN109791369B (zh) 2022-01-14
TW201816924A (zh) 2018-05-01
KR20210118252A (ko) 2021-09-29
CN109791369A (zh) 2019-05-21
WO2018062508A1 (ja) 2018-04-05
KR102306204B1 (ko) 2021-09-28
KR20190050828A (ko) 2019-05-13
TWI760371B (zh) 2022-04-11

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