JPWO2017002528A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JPWO2017002528A1 JPWO2017002528A1 JP2017526243A JP2017526243A JPWO2017002528A1 JP WO2017002528 A1 JPWO2017002528 A1 JP WO2017002528A1 JP 2017526243 A JP2017526243 A JP 2017526243A JP 2017526243 A JP2017526243 A JP 2017526243A JP WO2017002528 A1 JPWO2017002528 A1 JP WO2017002528A1
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- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- G—PHYSICS
- G01—MEASURING; TESTING
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Abstract
Description
本発明の構造第1の実施例として,MEMS型加速度センサを用いて発明を説明する。
本発明の構造第2の実施例として,チップパッケージの変形例について述べる。
以下,本発明の構造第3の実施例としてMEMS型角速度センサについて述べる。
図10は静電容量検出型の角速度センサチップ11aの上面図であり,図11は図10のA−A’の断面図,図12は図10のB−B’の断面図を示している。また,図13は図11のC−C’の平面図,図14は図11のD−D’の平面図を示している。本構造は,図1乃至図9に示した構造と同様の手法で作成できるが,デバイス基板4で作成する振動体の構造が異なる。以下,図10乃至図14を説明するに当たり,図1乃至図9と同一の構成要素については,その詳細な説明を省略し,異なる点を中心に説明することとする。
本発明の構造第4の実施例として複合センサについて述べる。複合センサは,例えば前記加速度センサと前記角速度センサ等の複数のセンサが,一つのパッケージに纏められたものであり,本形態においては,リードフレーム15もしくは,基板22は一つであることを特徴とする。
本発明の構造第5の実施例として前記複合センサの変形例について述べる。本形態においては,複合センサ用の回路基板12bは,複数のセンサの回路基板が一つの基板に作成されていることを特徴とする。
本発明の構造第6の実施例として前記複合センサの変形例について述べる。本形態においては,複合センサのセンサチップ11bは,一つの基板に作成されていることを特徴とする。
1a キャビティ部
1b キャビティ上部
1ba キャビティ上部短辺
1bb キャビティ上部長辺
2 領域(センサチップにおいて第一の樹脂に覆われる面)
3 接着材
4 デバイス基板
4a 錘
4b 支持梁
4c アンカー
4d アンカー(貫通配線接続有)
4d1 アンカー(貫通配線接続有,複合センサ・第一の加速度センシング部)
4d2 アンカー(貫通配線接続有,複合センサ・第二の加速度センシング部)
4d3 アンカー(貫通配線接続有,複合センサ・角速度センシング部)
4e 検出電極
4f 固定電極
4g 空洞部
4g1 空洞部(複合センサ・第一の加速度センシング部)
4g2 空洞部(複合センサ・第二の加速度センシング部)
4g3 空洞部(複合センサ・角速度センシング部)
4h 錘(第1の振動体)
4i 支持梁
4j 錘(第2の振動体)
4k 梁(検出用)
4l 駆動電極(錘4h側)
4m 駆動電極(支持基板固定側)
4n 検出電極(錘4j側)
4o 検出電極(支持基板固定側)
4p リンク梁
4q1 振動子
4q2 振動子
5 支持基板
5a キャビティ部
6 絶縁膜
7 貫通配線
8 絶縁膜
9 平面配線
9a パッド
9b 貫通配線上部
10 絶縁膜
10a パッド開口部
11 加速度センサチップ
11a 角速度センサチップ
11b センサチップ(複合センサ)
12 回路基板(加速度センサ用)
12a 回路基板(角速度センサ用)
12b 回路基板(複合センサ用)
13 接着材
14 ワイヤボンディング
15 リードフレーム
16 接着材
17 ワイヤボンディング
18 第一の樹脂
19 第二の樹脂
20 チップパッケージ(リードフレーム型)
20a チップパッケージ変形例(リードフレーム型,複合センサ)
20b チップパッケージ変形例(リードフレーム型,複合センサ)
21 チップパッケージ(基板型)
21a チップパッケージ変形例(基板型,複合センサ)
21b チップパッケージ変形例(基板型,複合センサ)
22 基板
23 パッド
24 配線
25 パッド
26 半田ボール
40 第一の加速度センシング部(複合センサ)
41 第二の加速度センシング部(複合センサ)
50 角速度センシング部(複合センサ)
Claims (15)
- センサチップと,前記センサチップの内周部を覆った第一の樹脂と,前記センサチップの外周部を覆った第二の樹脂とを備えた半導体装置。
- 請求項1記載の半導体装置において,前記センサチップはセンシング部を有し,前記センシング部は前記センサチップの内周部にあり,前記第一の樹脂は前記センシング部に対応する前記センサチップの第一表面を覆い,前記第二の樹脂は前記センシング部に対応しない前記センサチップの第二表面を覆ったことを特徴とする半導体装置。
- 請求項1記載の半導体装置において,前記第一の樹脂と,前記第二の樹脂は,同一の材質であることを特徴とする半導体装置。
- 請求項1記載の半導体装置において,前記第一の樹脂と,前記第二の樹脂は,互いに異なる材質であることを特徴とする半導体。
- 請求項4記載の半導体装置において,前記第一の樹脂は,前記第二の樹脂と比較して,ヤング率が小さいことを特徴とする半導体装置。
- 請求項4記載の半導体装置において,前記第一の樹脂は,光を透過することを特徴とする半導体装置。
- 請求項1乃至6記載の半導体装置の何れかにおいて,前記第一の樹脂は,第一の工程で成形され,前記第二の樹脂は,第二の工程で成形されたことを特徴とする半導体装置。
- 請求項1乃至6記載の半導体装置の何れかにおいて,前記第二の樹脂は,第一の工程で成形され,前記第一の樹脂は,第二の工程で成形されたことを特徴とする半導体装置。
- 請求項6または8記載の半導体装置において,前記各工程において,前記第一の樹脂の成形圧力を,前記第二の樹脂の成形圧力よりも小さくしたことを特徴とする半導体装置。
- 請求項1乃至9記載の半導体装置の何れかにおいて,前記センサチップに空隙を有することを特徴とする半導体装置。
- 請求項10記載の半導体装置において,前記空隙は気密である特徴とする半導体装置。
- 請求項1乃至11記載の半導体装置の何れかにおいて,前記センサチップの材質は半導体もしくはガラスであることを特徴とする半導体装置。
- 請求項1乃至11記載の半導体装置の何れかにおいて,前記センサチップにはワイヤボンディング用のパッドを有し,ワイヤボンディングされていることを特徴とする半導体装置。
- 請求項13記載の半導体装置において,前記パッド及びワイヤボンディングは,前記第二の樹脂で覆われていることを特徴とする半導体センサ装置。
- 請求項13記載の半導体装置において,前記パッド及びワイヤボンディングは,前記第一の樹脂で覆われていることを特徴とする半導体センサ装置。
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Application Number | Priority Date | Filing Date | Title |
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JP2015132313 | 2015-07-01 | ||
JP2015132313 | 2015-07-01 | ||
PCT/JP2016/066528 WO2017002528A1 (ja) | 2015-07-01 | 2016-06-03 | 半導体装置 |
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JPWO2017002528A1 true JPWO2017002528A1 (ja) | 2018-01-25 |
JP6462128B2 JP6462128B2 (ja) | 2019-01-30 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
JPH09119875A (ja) * | 1995-10-25 | 1997-05-06 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2015007559A (ja) * | 2013-06-25 | 2015-01-15 | セイコーエプソン株式会社 | モジュール、モジュールの製造方法、電子機器及び移動体 |
JP2015018922A (ja) * | 2013-07-10 | 2015-01-29 | 株式会社デンソー | モールドパッケージの製造方法 |
-
2016
- 2016-06-03 WO PCT/JP2016/066528 patent/WO2017002528A1/ja active Application Filing
- 2016-06-03 JP JP2017526243A patent/JP6462128B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
JPH09119875A (ja) * | 1995-10-25 | 1997-05-06 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2015007559A (ja) * | 2013-06-25 | 2015-01-15 | セイコーエプソン株式会社 | モジュール、モジュールの製造方法、電子機器及び移動体 |
JP2015018922A (ja) * | 2013-07-10 | 2015-01-29 | 株式会社デンソー | モールドパッケージの製造方法 |
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