JPWO2014050198A1 - スイッチング素子およびスイッチング素子の製造方法 - Google Patents
スイッチング素子およびスイッチング素子の製造方法 Download PDFInfo
- Publication number
- JPWO2014050198A1 JPWO2014050198A1 JP2014538223A JP2014538223A JPWO2014050198A1 JP WO2014050198 A1 JPWO2014050198 A1 JP WO2014050198A1 JP 2014538223 A JP2014538223 A JP 2014538223A JP 2014538223 A JP2014538223 A JP 2014538223A JP WO2014050198 A1 JPWO2014050198 A1 JP WO2014050198A1
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- wiring
- metal
- conductive layer
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 185
- 238000004519 manufacturing process Methods 0.000 title description 75
- 229910052751 metal Inorganic materials 0.000 claims abstract description 801
- 239000002184 metal Substances 0.000 claims abstract description 801
- 230000005684 electric field Effects 0.000 claims abstract description 52
- 230000004888 barrier function Effects 0.000 claims description 524
- 150000002500 ions Chemical class 0.000 claims description 440
- 229910021645 metal ion Inorganic materials 0.000 claims description 144
- 239000004065 semiconductor Substances 0.000 claims description 115
- 239000000758 substrate Substances 0.000 claims description 86
- 230000008054 signal transmission Effects 0.000 claims description 37
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 1240
- 239000010410 layer Substances 0.000 description 532
- 239000010949 copper Substances 0.000 description 272
- 239000011229 interlayer Substances 0.000 description 269
- 239000000463 material Substances 0.000 description 88
- 230000008569 process Effects 0.000 description 88
- 229910004298 SiO 2 Inorganic materials 0.000 description 69
- 229910052802 copper Inorganic materials 0.000 description 66
- 238000005530 etching Methods 0.000 description 62
- 239000007789 gas Substances 0.000 description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 56
- 238000006243 chemical reaction Methods 0.000 description 53
- 239000001307 helium Substances 0.000 description 49
- 229910052734 helium Inorganic materials 0.000 description 49
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 49
- 238000001312 dry etching Methods 0.000 description 48
- 229920002120 photoresistant polymer Polymers 0.000 description 48
- 230000007704 transition Effects 0.000 description 45
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 44
- 239000002994 raw material Substances 0.000 description 42
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 40
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 39
- 239000001301 oxygen Substances 0.000 description 39
- 229910052760 oxygen Inorganic materials 0.000 description 39
- 238000005498 polishing Methods 0.000 description 37
- 238000009792 diffusion process Methods 0.000 description 31
- 230000015572 biosynthetic process Effects 0.000 description 29
- 229910000618 GeSbTe Inorganic materials 0.000 description 27
- 230000006870 function Effects 0.000 description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 24
- 239000010703 silicon Substances 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 24
- 230000008859 change Effects 0.000 description 23
- 230000001681 protective effect Effects 0.000 description 21
- 238000004544 sputter deposition Methods 0.000 description 21
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 20
- 238000005240 physical vapour deposition Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 19
- 238000004380 ashing Methods 0.000 description 18
- 239000012071 phase Substances 0.000 description 18
- 229910052715 tantalum Inorganic materials 0.000 description 18
- 230000003647 oxidation Effects 0.000 description 17
- 238000007254 oxidation reaction Methods 0.000 description 17
- 239000011810 insulating material Substances 0.000 description 16
- 239000010936 titanium Substances 0.000 description 16
- 238000004090 dissolution Methods 0.000 description 15
- 150000004767 nitrides Chemical class 0.000 description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 14
- 229910052799 carbon Inorganic materials 0.000 description 14
- 239000012159 carrier gas Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 14
- 239000001257 hydrogen Substances 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 14
- 229910052721 tungsten Inorganic materials 0.000 description 14
- 239000006200 vaporizer Substances 0.000 description 14
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052719 titanium Inorganic materials 0.000 description 12
- 238000003487 electrochemical reaction Methods 0.000 description 11
- 229910052697 platinum Inorganic materials 0.000 description 11
- 150000001879 copper Chemical class 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 10
- 238000007429 general method Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 238000007562 laser obscuration time method Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 238000000059 patterning Methods 0.000 description 10
- 239000003870 refractory metal Substances 0.000 description 10
- 229910052707 ruthenium Inorganic materials 0.000 description 10
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 10
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 10
- 239000010937 tungsten Substances 0.000 description 10
- 150000004770 chalcogenides Chemical class 0.000 description 9
- 150000002431 hydrogen Chemical class 0.000 description 9
- 239000012141 concentrate Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 7
- 239000005751 Copper oxide Substances 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 7
- 229910000431 copper oxide Inorganic materials 0.000 description 7
- 230000008034 disappearance Effects 0.000 description 7
- 238000000608 laser ablation Methods 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000009471 action Effects 0.000 description 5
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000008033 biological extinction Effects 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012789 electroconductive film Substances 0.000 description 1
- 239000010416 ion conductor Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/253—Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
Landscapes
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012217319 | 2012-09-28 | ||
JP2012217319 | 2012-09-28 | ||
PCT/JP2013/063248 WO2014050198A1 (fr) | 2012-09-28 | 2013-05-13 | Élément commutateur et son procédé de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2014050198A1 true JPWO2014050198A1 (ja) | 2016-08-22 |
Family
ID=50387617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014538223A Pending JPWO2014050198A1 (ja) | 2012-09-28 | 2013-05-13 | スイッチング素子およびスイッチング素子の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2014050198A1 (fr) |
WO (1) | WO2014050198A1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4489363B2 (ja) * | 2003-03-03 | 2010-06-23 | シャープ株式会社 | 不揮発性記憶素子、不揮発性記憶回路、不揮発性記憶カードおよび記録再生装置 |
CN100407440C (zh) * | 2003-07-18 | 2008-07-30 | 日本电气株式会社 | 开关元件、驱动开关元件的方法、可重写的逻辑集成电路以及存储元件 |
US7812335B2 (en) * | 2008-04-11 | 2010-10-12 | Sandisk 3D Llc | Sidewall structured switchable resistor cell |
JP2011211165A (ja) * | 2010-03-12 | 2011-10-20 | Nec Corp | 半導体装置及びその製造方法 |
-
2013
- 2013-05-13 WO PCT/JP2013/063248 patent/WO2014050198A1/fr active Application Filing
- 2013-05-13 JP JP2014538223A patent/JPWO2014050198A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2014050198A1 (fr) | 2014-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6428860B2 (ja) | スイッチング素子およびスイッチング素子の製造方法 | |
JP5211483B2 (ja) | 固体電解質スイッチング素子およびその製造方法ならびに集積回路 | |
JP6901686B2 (ja) | スイッチング素子、半導体装置及びその製造方法 | |
JP6665776B2 (ja) | スイッチング素子及びスイッチング素子の製造方法 | |
JP5565570B2 (ja) | スイッチング素子、スイッチング素子の製造方法および半導体装置 | |
JP2011238828A (ja) | 半導体装置及びその製造方法 | |
JP5895932B2 (ja) | 抵抗変化素子、それを含む半導体装置およびそれらの製造方法 | |
US20120091426A1 (en) | Resistance-variable element and method for manufacturing the same | |
WO2016203751A1 (fr) | Élément de redressement, élément de commutation, et procédé de fabrication d'élément de redressement | |
JP5999768B2 (ja) | 半導体装置及びその製造方法 | |
WO2013103122A1 (fr) | Élément de commutation, et procédé de fabrication de celui-ci | |
JP2011211165A (ja) | 半導体装置及びその製造方法 | |
JP5493703B2 (ja) | スイッチング素子およびスイッチング素子を用いた半導体装置 | |
JP5807789B2 (ja) | スイッチング素子、半導体装置およびそれぞれの製造方法 | |
US10923534B2 (en) | Rectifying element and switching element having the rectifying element | |
US10693467B2 (en) | Switch circuit, semiconductor device using same, and switching method | |
WO2014050198A1 (fr) | Élément commutateur et son procédé de fabrication | |
US20210050517A1 (en) | Semiconductor device | |
WO2016157820A1 (fr) | Élément de commutation, dispositif à semi-conducteurs, et procédé de fabrication d'un élément de commutation | |
WO2020145253A1 (fr) | Elément de commutation et son procédé de fabrication | |
US20190189690A1 (en) | Semiconductor device and method for producing semiconductor device | |
JP2019047003A (ja) | 抵抗変化素子と半導体装置および製造方法 |