JPWO2013146979A1 - 電子部品及びその製造方法 - Google Patents
電子部品及びその製造方法 Download PDFInfo
- Publication number
- JPWO2013146979A1 JPWO2013146979A1 JP2014508002A JP2014508002A JPWO2013146979A1 JP WO2013146979 A1 JPWO2013146979 A1 JP WO2013146979A1 JP 2014508002 A JP2014508002 A JP 2014508002A JP 2014508002 A JP2014508002 A JP 2014508002A JP WO2013146979 A1 JPWO2013146979 A1 JP WO2013146979A1
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- metal terminal
- pair
- component element
- element body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 74
- 229910052751 metal Inorganic materials 0.000 claims abstract description 74
- 239000000463 material Substances 0.000 claims description 24
- 230000005484 gravity Effects 0.000 claims description 7
- 230000035882 stress Effects 0.000 description 15
- 239000003985 ceramic capacitor Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
続され、他端側が自由端として形成されている。また、リード端子部4bの自由端側の一部は、電子部品素体2の端面2dに設けられた外部電極3の面と略平行に配置されるようにして接続部6として形成され、さらに、この接続部6と前記基端との間の部分は湾曲させて撓み変形可能なリード部7として形成されている。
この構成によれば、回路基板の実装面からの衝撃を受けた際、前記一端部と前記他端部の間に設けた応力吸収部により、電子部品の外側からかかる外乱応力を積極的に吸収緩和して電子部品素体の損傷を防ぐことができる。
Claims (5)
- 上面と底面と1対の側面と1対の端面とを有し前記一対の端面に設けられた一対の外部電極とを有する電子部品素体と、この電子部品素体の前記一対の外部電極にそれぞれ接続した一対の金属端子を備える電子部品であって、 前記金属端子は、その一端部が前記電子部品素体の前記外部電極に電気的かつ機械的に接続されるリード端子と、前記リード端子の他端部が接続されているとともに前記電子部品素体の底面と接触している底面接触部を有する水平部と、で構成されていることを特徴とする電子部品。
- 前記金属端子の重心が前記電子部品素子の前記底面上に位置していることを特徴とする請求項1記載の電子部品
- 前記リード端子は、前記一端部と前記他端部の間に撓み変形可能なリード部を設けてなることを特徴とする請求項1記載の電子部品。
- 上面と底面と1対の側面と外部電極を設けた1対の端面とを有する電子部品素体の前記外部電極に、それぞれ金属端子を取り付けてなる電子部品の製造方法であって、 少なくともL状に折り曲げ形成されて、曲げられた一方に接続部を設けるとともに他方に底面接触部を設けてなる金属端子を用意するステップと、 前記電子部品素体を前記底面が上側で前記上面が下側となるようにひっくり返すステップと、 前記ひっくり返された電子部品素体の前記底面に前記金属端子の前記底面接触部を接触させるとともに、前記外部電極に前記金属端子の前記接続部をペースト状の接合材により仮止めするステップと、 前記仮止め部分を加熱して前記接合材を溶融し、その後、冷却することにより前記電子部品素体の前記外部電極と前記金属端子の前記接続部を電気的、かつ機械的に接続するステップ、 との順に形成することを特徴とする電子部品の製造方法。
- 前記金属端子は、前記電子部品素体上に仮止めされた際に、重心が電子部品素子の前記底面上に位置するようにして形成されていることを特徴とする請求項4記載の電子部品の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012075369 | 2012-03-29 | ||
JP2012075369 | 2012-03-29 | ||
PCT/JP2013/059183 WO2013146979A1 (ja) | 2012-03-29 | 2013-03-28 | 電子部品及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2013146979A1 true JPWO2013146979A1 (ja) | 2015-12-14 |
JP6092848B2 JP6092848B2 (ja) | 2017-03-08 |
JP6092848B6 JP6092848B6 (ja) | 2017-07-12 |
Family
ID=
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065478A (ja) * | 1992-06-19 | 1994-01-14 | Nippon Chemicon Corp | 固体電解コンデンサ |
JPH1174147A (ja) * | 1997-06-27 | 1999-03-16 | Tdk Corp | セラミックコンデンサ |
JP2004288847A (ja) * | 2003-03-20 | 2004-10-14 | Tdk Corp | 電子部品 |
JP2007158046A (ja) * | 2005-12-06 | 2007-06-21 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2008130954A (ja) * | 2006-11-24 | 2008-06-05 | Maruwa Co Ltd | 導電脚体付きチップ形積層コンデンサ及びその製造方法並びにチップ形積層コンデンサの導電脚体形成用前駆体 |
JP2010177370A (ja) * | 2009-01-28 | 2010-08-12 | Tdk Corp | 積層コンデンサ及び積層コンデンサの製造方法 |
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065478A (ja) * | 1992-06-19 | 1994-01-14 | Nippon Chemicon Corp | 固体電解コンデンサ |
JPH1174147A (ja) * | 1997-06-27 | 1999-03-16 | Tdk Corp | セラミックコンデンサ |
JP2004288847A (ja) * | 2003-03-20 | 2004-10-14 | Tdk Corp | 電子部品 |
JP2007158046A (ja) * | 2005-12-06 | 2007-06-21 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2008130954A (ja) * | 2006-11-24 | 2008-06-05 | Maruwa Co Ltd | 導電脚体付きチップ形積層コンデンサ及びその製造方法並びにチップ形積層コンデンサの導電脚体形成用前駆体 |
JP2010177370A (ja) * | 2009-01-28 | 2010-08-12 | Tdk Corp | 積層コンデンサ及び積層コンデンサの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2013146979A1 (ja) | 2013-10-03 |
CN104115244A (zh) | 2014-10-22 |
US20150008026A1 (en) | 2015-01-08 |
KR101566772B1 (ko) | 2015-11-06 |
KR20140098797A (ko) | 2014-08-08 |
CN104115244B (zh) | 2017-05-24 |
JP6092848B2 (ja) | 2017-03-08 |
US9570236B2 (en) | 2017-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190304702A1 (en) | Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement | |
US20150366063A1 (en) | Module, module component composing the module, and method of manufacturing the module | |
JP2006295158A (ja) | 材料結合式で配設された端子要素を有するパワー半導体モジュール | |
JP2504610B2 (ja) | 電力用半導体装置 | |
US20100246149A1 (en) | Connection member and printed circuit board unit | |
JP6206494B2 (ja) | 半導体装置 | |
WO2013146979A1 (ja) | 電子部品及びその製造方法 | |
CN104021932B (zh) | 电子部件和电子控制单元 | |
KR20090060140A (ko) | 고체 전해 콘덴서 | |
US20170236643A1 (en) | Electronic component having a connection element | |
JP2002009217A (ja) | 樹脂封止型半導体装置 | |
EP2814307A1 (en) | Bus bar | |
JP2006024825A (ja) | 電気部品 | |
JP6092848B6 (ja) | 電子部品及びその製造方法 | |
JP2009049258A (ja) | 電子部品の実装方法 | |
JP2004221460A (ja) | 半導体部品、半導体装置、及び該半導体装置の製造方法 | |
JP4882394B2 (ja) | 半導体装置 | |
JP2000340446A (ja) | 端子付き電子部品 | |
JP3012948U (ja) | Bga電子部品 | |
JP2010087367A (ja) | 半導体装置の製造方法 | |
JP2009004871A (ja) | 表面実装用の水晶デバイス | |
JP2017130561A (ja) | 抵抗器 | |
JP2012122908A (ja) | 焦電型赤外線検出器 | |
JP6072496B2 (ja) | 電子素子 | |
JP5981163B2 (ja) | 電流ヒューズおよび電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151027 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151202 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160620 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160808 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170117 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170209 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6092848 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |