JPWO2013069088A1 - ウェーハ収納容器 - Google Patents
ウェーハ収納容器 Download PDFInfo
- Publication number
- JPWO2013069088A1 JPWO2013069088A1 JP2013542730A JP2013542730A JPWO2013069088A1 JP WO2013069088 A1 JPWO2013069088 A1 JP WO2013069088A1 JP 2013542730 A JP2013542730 A JP 2013542730A JP 2013542730 A JP2013542730 A JP 2013542730A JP WO2013069088 A1 JPWO2013069088 A1 JP WO2013069088A1
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- Prior art keywords
- wafer
- storage container
- loading
- semiconductor
- semiconductor wafer
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- 235000012431 wafers Nutrition 0.000 claims abstract description 284
- 239000004065 semiconductor Substances 0.000 claims abstract description 108
- 238000005452 bending Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S206/00—Special receptacle or package
- Y10S206/832—Semiconductor wafer boat
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
図2は、本発明の第1の実施例に係るウェーハ収納容器の斜視図。図1は、そのウェーハ収納容器に蓋体が取り付けらていない状態を上から見たときの平面断面図である。
2 ウェーハ出し入れ開口
3 蓋体
5 奥側リテーナ
6 蓋側リテーナ
10 ウェーハ支持棚
A 奥側ウェーハ支持凸部
B1,B2 手前側ウェーハ支持凸部
W 半導体ウェーハ
Claims (6)
- 半導体ウェーハを複数並列に並べた状態で収納するための容器本体と、上記容器本体に上記半導体ウェーハを出し入れするために上記容器本体の前面に形成されたウェーハ出し入れ開口と、上記ウェーハ出し入れ開口を塞ぐために上記ウェーハ出し入れ開口に着脱自在に前方から取り付けられる蓋体と、上記蓋体が上記ウェーハ出し入れ開口に取り付けられていない状態の時に上記半導体ウェーハを水平に支持するように上記容器本体内の上記ウェーハ出し入れ開口側から見て左右両側の位置において上記複数の半導体ウェーハの外縁部が個別に載置されるウェーハ支持棚とを備えたウェーハ収納容器において、
上記ウェーハ出し入れ開口から見て左右両側に配置された上記ウェーハ支持棚に各々、上記半導体ウェーハの外縁部が局部的に載置されるウェーハ支持凸部が、上記ウェーハ出し入れ開口側から見て上記半導体ウェーハの中心位置より奥側に一か所と手前側に二箇所ずつ設けられていることを特徴とするウェーハ収納容器。 - 請求項1のウェーハ収納容器において、左右に二か所ずつ設けられた上記手前側ウェーハ支持凸部のうち、上記半導体ウェーハの中心位置を通り上記ウェーハ出し入れ開口と平行をなす基準中心線から遠い方の第2の手前側ウェーハ支持凸部が、上記基準中心線に対して45°±15°をなす範囲の方向に設けられているウェーハ収納容器。
- 請求項2のウェーハ収納容器において、上記半導体ウェーハの中心位置より手前側の左右に二箇所ずつ設けられた手前側ウェーハ支持凸部のうち上記基準中心線に近い方の第1の手前側ウェーハ支持凸部が、上記基準中心線に対して20°±5°をなす範囲の方向に設けられ、上記第1と第2の手前側ウェーハ支持凸部の相対的位置関係が、上記半導体ウェーハの中心位置回りにおいて10°〜30°の範囲で相違しているウェーハ収納容器。
- 請求項3のウェーハ収納容器において、上記ウェーハ支持棚に上記半導体ウェーハが支持された状態において、上記半導体ウェーハが上記第1と第2の手前側ウェーハ支持凸部に同時に接触、載置された状態になるウェーハ収納容器。
- 請求項4のウェーハ収納容器において、上記第2の手前側ウェーハ支持凸部が、上記第1の手前側ウェーハ支持凸部より0.2mm以内の範囲で低い位置に設けられているウェーハ収納容器。
- 請求項1のウェーハ収納容器において、左右に一か所ずつ設けられた上記奥側ウェーハ支持凸部が、左右に二箇所ずつ設けられた上記手前側ウェーハ支持凸部のどれよりも低い位置に設けられているウェーハ収納容器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/075656 WO2013069088A1 (ja) | 2011-11-08 | 2011-11-08 | ウェーハ収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013069088A1 true JPWO2013069088A1 (ja) | 2015-04-02 |
JP6018075B2 JP6018075B2 (ja) | 2016-11-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013542730A Active JP6018075B2 (ja) | 2011-11-08 | 2011-11-08 | ウェーハ収納容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8960442B2 (ja) |
JP (1) | JP6018075B2 (ja) |
KR (1) | KR101738219B1 (ja) |
TW (1) | TWI544563B (ja) |
WO (1) | WO2013069088A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9520264B2 (en) * | 2012-03-19 | 2016-12-13 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for clamping and cooling a substrate for ion implantation |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9865487B2 (en) * | 2013-09-11 | 2018-01-09 | Miraial Co., Ltd. | Substrate storage container |
US10643876B2 (en) * | 2016-06-28 | 2020-05-05 | Murata Machinery, Ltd. | Substrate carrier and substrate carrier stack |
US10573545B2 (en) * | 2016-06-28 | 2020-02-25 | Murata Machinery, Ltd. | Substrate carrier and substrate carrier stack |
KR20180001999A (ko) * | 2016-06-28 | 2018-01-05 | 테크-샘 아게 | 개선된 기판 스토리지 및 프로세싱 |
JP6915037B2 (ja) * | 2017-02-27 | 2021-08-04 | ミライアル株式会社 | 基板収納容器 |
KR101992626B1 (ko) | 2017-11-20 | 2019-06-25 | (주)에스티아이 | 기판 용기 세정장치 |
TWI689030B (zh) * | 2018-06-14 | 2020-03-21 | 家登精密工業股份有限公司 | 基板載具 |
KR102064354B1 (ko) | 2019-06-18 | 2020-01-09 | (주)에스티아이 | 기판 용기 세정장치 |
US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
US11676838B2 (en) * | 2021-02-26 | 2023-06-13 | Visera Technologies Company Limiied | Wafer cassette |
Citations (6)
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JP2001185601A (ja) * | 1999-12-27 | 2001-07-06 | Nsk Ltd | 円板支持装置 |
JP2005191021A (ja) * | 2003-12-02 | 2005-07-14 | Miraial Kk | 薄板支持容器 |
JP2009500854A (ja) * | 2005-07-08 | 2009-01-08 | アシスト テクノロジーズ インコーポレイテッド | 加工物支持構造体及びこれにアクセスするための装置 |
WO2009107254A1 (ja) * | 2008-02-27 | 2009-09-03 | ミライアル株式会社 | 裏面支持構造付きウエハ収納容器 |
JP2011054984A (ja) * | 2003-12-02 | 2011-03-17 | Miraial Kk | 薄板支持容器用蓋体 |
JP2011253960A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
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JP3280438B2 (ja) * | 1992-11-30 | 2002-05-13 | 東芝セラミックス株式会社 | 縦型ボート |
US5725101A (en) | 1995-06-26 | 1998-03-10 | Kakizaki Manufacturing Co., Ltd. | Thin-plate supporting container |
TW296361B (ja) | 1995-06-26 | 1997-01-21 | Kakizaki Seisakusho Kk | |
JPH0964162A (ja) | 1995-08-18 | 1997-03-07 | Kakizaki Seisakusho:Kk | 薄板用支持容器 |
KR970030613A (ko) * | 1995-11-30 | 1997-06-26 | 김광호 | 웨이퍼를 로딩하는 보트 및 반도체 장치의 제조 방법 |
US5788082A (en) | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
JPH11135606A (ja) * | 1997-10-31 | 1999-05-21 | Sony Corp | ウエハ洗浄用のウエハキャリア |
JP4218260B2 (ja) * | 2002-06-06 | 2009-02-04 | 東京エレクトロン株式会社 | 被処理体の収納容器体及びこれを用いた処理システム |
JP4146718B2 (ja) | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
JP4693488B2 (ja) | 2005-05-11 | 2011-06-01 | 信越ポリマー株式会社 | 固定キャリア |
JP4584023B2 (ja) | 2005-05-17 | 2010-11-17 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
JP5385130B2 (ja) * | 2006-06-13 | 2014-01-08 | インテグリス・インコーポレーテッド | ウェハ収納容器用の再利用可能な弾性クッション |
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JP2011060877A (ja) | 2009-09-08 | 2011-03-24 | Shin Etsu Polymer Co Ltd | 基板用支持体及び基板収納容器 |
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JP5301731B2 (ja) * | 2010-05-24 | 2013-09-25 | ミライアル株式会社 | 基板収納容器 |
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JP3171789U (ja) * | 2011-09-05 | 2011-11-17 | 旭硝子株式会社 | 縦型ウエハボート |
-
2011
- 2011-11-08 JP JP2013542730A patent/JP6018075B2/ja active Active
- 2011-11-08 WO PCT/JP2011/075656 patent/WO2013069088A1/ja active Application Filing
- 2011-11-08 KR KR1020147011829A patent/KR101738219B1/ko active IP Right Grant
- 2011-11-08 US US14/356,852 patent/US8960442B2/en active Active
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2012
- 2012-11-05 TW TW101140965A patent/TWI544563B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001185601A (ja) * | 1999-12-27 | 2001-07-06 | Nsk Ltd | 円板支持装置 |
JP2005191021A (ja) * | 2003-12-02 | 2005-07-14 | Miraial Kk | 薄板支持容器 |
JP2011054984A (ja) * | 2003-12-02 | 2011-03-17 | Miraial Kk | 薄板支持容器用蓋体 |
JP2009500854A (ja) * | 2005-07-08 | 2009-01-08 | アシスト テクノロジーズ インコーポレイテッド | 加工物支持構造体及びこれにアクセスするための装置 |
WO2009107254A1 (ja) * | 2008-02-27 | 2009-09-03 | ミライアル株式会社 | 裏面支持構造付きウエハ収納容器 |
JP2011253960A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9520264B2 (en) * | 2012-03-19 | 2016-12-13 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for clamping and cooling a substrate for ion implantation |
Also Published As
Publication number | Publication date |
---|---|
WO2013069088A1 (ja) | 2013-05-16 |
TW201332039A (zh) | 2013-08-01 |
US8960442B2 (en) | 2015-02-24 |
TWI544563B (zh) | 2016-08-01 |
KR101738219B1 (ko) | 2017-05-19 |
KR20140074975A (ko) | 2014-06-18 |
JP6018075B2 (ja) | 2016-11-02 |
US20140367307A1 (en) | 2014-12-18 |
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