JPWO2013042751A1 - 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 - Google Patents

積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 Download PDF

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Publication number
JPWO2013042751A1
JPWO2013042751A1 JP2013534757A JP2013534757A JPWO2013042751A1 JP WO2013042751 A1 JPWO2013042751 A1 JP WO2013042751A1 JP 2013534757 A JP2013534757 A JP 2013534757A JP 2013534757 A JP2013534757 A JP 2013534757A JP WO2013042751 A1 JPWO2013042751 A1 JP WO2013042751A1
Authority
JP
Japan
Prior art keywords
resin
fiber
laminate
layer
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013534757A
Other languages
English (en)
Japanese (ja)
Inventor
真裕 青嶌
真裕 青嶌
佳弘 高橋
佳弘 高橋
由香 山崎
由香 山崎
上方　康雄
康雄 上方
村井　曜
曜 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corporation
Showa Denko Materials Co Ltd
Original Assignee
Resonac Corporation
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corporation, Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Resonac Corporation
Priority to JP2013534757A priority Critical patent/JPWO2013042751A1/ja
Publication of JPWO2013042751A1 publication Critical patent/JPWO2013042751A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10614—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer comprising particles for purposes other than dyeing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2013534757A 2011-09-22 2012-09-20 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 Pending JPWO2013042751A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013534757A JPWO2013042751A1 (ja) 2011-09-22 2012-09-20 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011207981 2011-09-22
JP2011207981 2011-09-22
JP2012200950 2012-09-12
JP2012200950 2012-09-12
JP2013534757A JPWO2013042751A1 (ja) 2011-09-22 2012-09-20 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2013042751A1 true JPWO2013042751A1 (ja) 2015-03-26

Family

ID=47914511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013534757A Pending JPWO2013042751A1 (ja) 2011-09-22 2012-09-20 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法

Country Status (5)

Country Link
JP (1) JPWO2013042751A1 (zh)
KR (1) KR20140063712A (zh)
CN (2) CN203093220U (zh)
TW (1) TW201334643A (zh)
WO (1) WO2013042751A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013158998A (ja) * 2012-02-03 2013-08-19 Nippon Kayaku Co Ltd 積層ガラスシート
CR20160441A (es) * 2014-03-31 2016-12-01 Nagase Chemtex Corp Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje
JP6326948B2 (ja) * 2014-05-09 2018-05-23 日立化成株式会社 積層体、積層板、及び多層プリント配線板
US11014336B2 (en) * 2017-09-06 2021-05-25 Nippon Pillar Packing Co., Ltd. Circuit board and method for manufacturing the same
CN112351961A (zh) * 2018-06-29 2021-02-09 Ａｇｃ株式会社 玻璃树脂层叠体、复合层叠体以及它们的制造方法
CN115971017B (zh) * 2018-09-28 2024-01-16 日铁化学材料株式会社 聚酰亚胺膜的制造方法、覆金属层叠板的制造方法及电路基板的制造方法
KR20210104695A (ko) * 2018-12-18 2021-08-25 쇼와덴코머티리얼즈가부시끼가이샤 적층판, 프린트 배선판, 반도체 패키지 및 적층판의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04219233A (ja) * 1990-12-20 1992-08-10 Dainippon Ink & Chem Inc 無機ガラス層を有する成形物
JP2010519088A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性を有する複合品
JP2010519089A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413620B1 (en) * 1999-06-30 2002-07-02 Kyocera Corporation Ceramic wiring substrate and method of producing the same
JP2001162721A (ja) * 1999-12-06 2001-06-19 Mitsubishi Plastics Ind Ltd 熱硬化性樹脂複合品及びその製造方法
DE19961842B4 (de) * 1999-12-21 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mehrschichtleiterplatte
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
US20100096173A1 (en) * 2007-02-23 2010-04-22 Kentaro Fujino Epoxy resin composition, prepreg, and laminate and printed wiring board
JP5723776B2 (ja) * 2009-09-08 2015-05-27 旭硝子株式会社 ガラス／樹脂積層体の製造方法
JP5489640B2 (ja) * 2009-10-22 2014-05-14 富士フイルム株式会社 複合フィルム及び電子部品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04219233A (ja) * 1990-12-20 1992-08-10 Dainippon Ink & Chem Inc 無機ガラス層を有する成形物
JP2010519088A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性を有する複合品
JP2010519089A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法

Also Published As

Publication number Publication date
TW201334643A (zh) 2013-08-16
WO2013042751A1 (ja) 2013-03-28
KR20140063712A (ko) 2014-05-27
CN103009724A (zh) 2013-04-03
CN203093220U (zh) 2013-07-31

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