JPWO2010021024A1 - 光学フィルムの切断方法およびこれを用いた装置 - Google Patents
光学フィルムの切断方法およびこれを用いた装置 Download PDFInfo
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- JPWO2010021024A1 JPWO2010021024A1 JP2009537437A JP2009537437A JPWO2010021024A1 JP WO2010021024 A1 JPWO2010021024 A1 JP WO2010021024A1 JP 2009537437 A JP2009537437 A JP 2009537437A JP 2009537437 A JP2009537437 A JP 2009537437A JP WO2010021024 A1 JPWO2010021024 A1 JP WO2010021024A1
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- 238000005520 cutting process Methods 0.000 title claims abstract description 68
- 239000012788 optical film Substances 0.000 title claims description 82
- 238000000034 method Methods 0.000 title claims description 27
- 238000011144 upstream manufacturing Methods 0.000 claims description 27
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 230000009471 action Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 82
- 230000032258 transport Effects 0.000 description 16
- 239000000356 contaminant Substances 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 9
- 239000000779 smoke Substances 0.000 description 9
- 230000007723 transport mechanism Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/16—Bands or sheets of indefinite length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Polarising Elements (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
前記光学フィルムの切断部位の幅方向に沿って形成された吸着溝を有する吸着台に当該光学フィルムを吸着保持させるとともに、吸着溝を挟んで光学フィルムを搬送方向の前後に傾斜させた状態で吸引しつつレーザで切断することを特徴とする。
帯状の前記光学フィルムを供給する供給手段と、
前記光学フィルムの切断部位の幅方向に沿って形成された吸着溝を有し、かつ、当該吸着溝を挟んで光学フィルムを搬送方向の前後に傾斜させた状態で吸着保持するよう段差を有する吸着台と、
前記吸着台に吸着保持された光学フィルムを吸着溝に沿って切断するレーザ装置と、
を備えたことを特徴とする。
3 … 切断機構
4 … 搬送機構
6 … 搬出機構
9 … 吸着テーブル
9a … 保持ブロック
9b … 保持ブロック
11 … ニップローラ
12 … ニップローラ
16 … 制御部
F … 偏光フィルム
上記実施例装置において、段差を0.3、0.5、0.7、1.0mmに設定して偏光フィルムFの切断実験を行った。なお、偏光フィルムの厚みは310μmであり、吸着溝の幅は、2mmである。その結果を以下の表1に示す。
Claims (5)
- 所定長さの枚葉の光学フィルムに切断する光学フィルムの切断方法であって、
前記光学フィルムの切断部位の幅方向に沿って形成された吸着溝を有する吸着台に当該光学フィルムを吸着保持させるとともに、吸着溝を挟んで光学フィルムを搬送方向の前後に傾斜させた状態で吸引しつつレーザで切断する
ことを特徴とする光学フィルムの切断方法。 - 請求項1に記載の光学フィルムの切断方法において、
前記吸着溝を挟んで光学フィルムの搬送方向の上流側と下流側の吸着台の表面高さに段差を設けた
ことを特徴とする光学フィルムの切断方法。 - 請求項2に記載の光学フィルムの切断方法において、
前記吸着台の段差は、下流側の表面高さが上流側の表面高さより低く設定されている
ことを特徴とする光学フィルムの切断方法。 - 所定長さの枚葉の光学フィルムに切断する光学フィルムの切断装置であって、
帯状の前記光学フィルムを供給する供給手段と、
前記光学フィルムの切断部位の幅方向に沿って形成された吸着溝を有し、かつ、当該吸着溝を挟んで光学フィルムを搬送方向の前後に傾斜させた状態で吸着保持するよう段差を有する吸着台と、
前記吸着台に吸着保持された光学フィルムを吸着溝に沿って切断するレーザ装置と、
を備えたことを特徴とする光学フィルムの切断装置。 - 請求項4に記載の光学フィルムの切断装置において、
前記吸着台の段差は、吸着溝を挟んで光学フィルム搬送方向の下流側の表面高さを上流側の表面高さより低く構成した
ことを特徴とする光学フィルムの切断装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/064745 WO2010021024A1 (ja) | 2008-08-19 | 2008-08-19 | 光学フィルムの切断方法およびこれを用いた装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2010021024A1 true JPWO2010021024A1 (ja) | 2012-01-26 |
JP5481195B2 JP5481195B2 (ja) | 2014-04-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009537437A Active JP5481195B2 (ja) | 2008-08-19 | 2008-08-19 | 光学フィルムの切断方法およびこれを用いた装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8257638B2 (ja) |
JP (1) | JP5481195B2 (ja) |
KR (1) | KR101440666B1 (ja) |
CN (1) | CN101778692B (ja) |
TW (1) | TWI474909B (ja) |
WO (1) | WO2010021024A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9029731B2 (en) | 2007-01-26 | 2015-05-12 | Electro Scientific Industries, Inc. | Methods and systems for laser processing continuously moving sheet material |
EP2637819B1 (de) * | 2011-10-17 | 2017-08-23 | Antolin Interiors Deutschland GmbH | Verfahren zur erzeugung von messer - oder laserschwächungen von lederhäutung |
CN102581492A (zh) * | 2012-01-31 | 2012-07-18 | 武汉吉事达激光技术有限公司 | 卷料自动送料激光刻蚀机 |
KR102025704B1 (ko) * | 2012-09-14 | 2019-09-27 | 삼성디스플레이 주식회사 | 필름 검사 장치 |
CN103600172B (zh) * | 2013-04-28 | 2017-02-08 | 宝山钢铁股份有限公司 | 一种开卷落料方法 |
JP2014228848A (ja) * | 2013-05-27 | 2014-12-08 | 日東電工株式会社 | 光学フィルムロールの製造システムおよび光学フィルムロールの製造方法 |
JP2019038643A (ja) * | 2017-08-24 | 2019-03-14 | 日産自動車株式会社 | シート材製造装置 |
CN112091456B (zh) * | 2020-08-05 | 2023-04-04 | 武汉宁致远汽车配件有限公司 | 一种带有除尘排废功能的激光切割工作台 |
CN215880388U (zh) * | 2021-09-30 | 2022-02-22 | 宁德时代新能源科技股份有限公司 | 模切装置 |
Family Cites Families (14)
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US4675497A (en) * | 1985-12-23 | 1987-06-23 | Gerber Garment Technology | Laser cutting system |
JPH1158061A (ja) * | 1997-08-12 | 1999-03-02 | Murata Mfg Co Ltd | 可撓性材料のレーザ加工装置および加工方法 |
JP2000015472A (ja) | 1998-07-01 | 2000-01-18 | Kyocera Corp | レーザ加工装置 |
JP2001062584A (ja) | 1999-08-27 | 2001-03-13 | Amada Co Ltd | レーザ加工機および製品搬出方法 |
JP2001179474A (ja) * | 1999-12-27 | 2001-07-03 | Dainippon Printing Co Ltd | 開封用切目線の形成方法 |
JP2001252783A (ja) | 2000-03-09 | 2001-09-18 | Asmo Co Ltd | フェルトの裁断方法、フェルトの裁断装置及び軸受装置用フェルト |
JP2001287063A (ja) | 2000-04-04 | 2001-10-16 | Matsuya R & D:Kk | レーザー裁断装置 |
JP4371709B2 (ja) | 2003-06-05 | 2009-11-25 | 富士フイルム株式会社 | 光学フィルム貼付装置及び方法 |
JP2005118849A (ja) * | 2003-10-20 | 2005-05-12 | Hitachi Kenki Fine Tech Co Ltd | レーザ加工装置 |
JP4233999B2 (ja) * | 2003-12-25 | 2009-03-04 | 日東電工株式会社 | 積層型偏光板およびその製造方法 |
CN2724948Y (zh) * | 2004-08-25 | 2005-09-14 | 林瑞森 | 薄膜切割器 |
JP3818451B2 (ja) * | 2004-11-22 | 2006-09-06 | 日東電工株式会社 | 積層体の切断方法 |
DE102004059766A1 (de) * | 2004-12-11 | 2006-06-22 | Vits Systems Gmbh | Querschneider für eine Papierbahn |
JP2008073742A (ja) * | 2006-09-22 | 2008-04-03 | Nitto Denko Corp | 光学フィルムの切断方法及び光学フィルム |
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2008
- 2008-08-19 JP JP2009537437A patent/JP5481195B2/ja active Active
- 2008-08-19 WO PCT/JP2008/064745 patent/WO2010021024A1/ja active Application Filing
- 2008-08-19 KR KR1020107011599A patent/KR101440666B1/ko active IP Right Grant
- 2008-08-19 US US12/670,976 patent/US8257638B2/en not_active Expired - Fee Related
- 2008-08-19 CN CN2008800171807A patent/CN101778692B/zh not_active Expired - Fee Related
- 2008-08-22 TW TW097132259A patent/TWI474909B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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CN101778692A (zh) | 2010-07-14 |
US8257638B2 (en) | 2012-09-04 |
US20100206859A1 (en) | 2010-08-19 |
WO2010021024A1 (ja) | 2010-02-25 |
CN101778692B (zh) | 2013-07-10 |
TWI474909B (zh) | 2015-03-01 |
KR101440666B1 (ko) | 2014-09-23 |
JP5481195B2 (ja) | 2014-04-23 |
TW201008736A (en) | 2010-03-01 |
KR20110055476A (ko) | 2011-05-25 |
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