JPWO2009063734A1 - 電子部品搭載機器 - Google Patents

電子部品搭載機器 Download PDF

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Publication number
JPWO2009063734A1
JPWO2009063734A1 JP2009541085A JP2009541085A JPWO2009063734A1 JP WO2009063734 A1 JPWO2009063734 A1 JP WO2009063734A1 JP 2009541085 A JP2009541085 A JP 2009541085A JP 2009541085 A JP2009541085 A JP 2009541085A JP WO2009063734 A1 JPWO2009063734 A1 JP WO2009063734A1
Authority
JP
Japan
Prior art keywords
housing
electronic component
circuit board
printed circuit
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009541085A
Other languages
English (en)
Japanese (ja)
Inventor
雅治 今里
雅治 今里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of JPWO2009063734A1 publication Critical patent/JPWO2009063734A1/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2009541085A 2007-11-13 2008-10-24 電子部品搭載機器 Withdrawn JPWO2009063734A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007294003 2007-11-13
JP2007294003 2007-11-13
PCT/JP2008/069322 WO2009063734A1 (fr) 2007-11-13 2008-10-24 Appareil sur lequel est monté un composant électronique

Publications (1)

Publication Number Publication Date
JPWO2009063734A1 true JPWO2009063734A1 (ja) 2011-03-31

Family

ID=40638587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009541085A Withdrawn JPWO2009063734A1 (ja) 2007-11-13 2008-10-24 電子部品搭載機器

Country Status (2)

Country Link
JP (1) JPWO2009063734A1 (fr)
WO (1) WO2009063734A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5215942B2 (ja) * 2009-06-03 2013-06-19 株式会社日立製作所 電子装置、および、雑音電流測定方法
US9357385B2 (en) 2012-08-20 2016-05-31 Qualcomm Incorporated Configuration of a new enrollee device for use in a communication network
US10154025B2 (en) 2013-03-15 2018-12-11 Qualcomm Incorporated Seamless device configuration in a communication network

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834797U (ja) * 1981-09-01 1983-03-07 株式会社東芝 シ−ルド用金具の取付け装置
JPS6217198U (fr) * 1985-07-16 1987-02-02
JP2834934B2 (ja) * 1992-06-09 1998-12-14 三洋電機株式会社 電子機器の筐体構造
JP2586966Y2 (ja) * 1993-07-30 1998-12-14 株式会社ケーヒン 電子部品収納ケース
JP2000012113A (ja) * 1998-06-22 2000-01-14 Matsushita Electric Ind Co Ltd アースバネ装置
JP3028956B1 (ja) * 1999-01-14 2000-04-04 静岡日本電気株式会社 環境配慮型ｆｇ構造
JP3581043B2 (ja) * 1999-05-10 2004-10-27 エヌイーシー三菱電機ビジュアルシステムズ株式会社 映像表示装置

Also Published As

Publication number Publication date
WO2009063734A1 (fr) 2009-05-22

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20120110