JPWO2008139981A1 - 発光装置および発光装置用パッケージ集合体 - Google Patents

発光装置および発光装置用パッケージ集合体 Download PDF

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Publication number
JPWO2008139981A1
JPWO2008139981A1 JP2009514124A JP2009514124A JPWO2008139981A1 JP WO2008139981 A1 JPWO2008139981 A1 JP WO2008139981A1 JP 2009514124 A JP2009514124 A JP 2009514124A JP 2009514124 A JP2009514124 A JP 2009514124A JP WO2008139981 A1 JPWO2008139981 A1 JP WO2008139981A1
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JP
Japan
Prior art keywords
light emitting
emitting device
lower electrode
substrate
metal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009514124A
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English (en)
Japanese (ja)
Inventor
宏司 伏見
宏司 伏見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CI Kasei Co Ltd
Original Assignee
CI Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CI Kasei Co Ltd filed Critical CI Kasei Co Ltd
Publication of JPWO2008139981A1 publication Critical patent/JPWO2008139981A1/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
JP2009514124A 2007-05-09 2008-04-24 発光装置および発光装置用パッケージ集合体 Pending JPWO2008139981A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007124551 2007-05-09
JP2007124551 2007-05-09
PCT/JP2008/058443 WO2008139981A1 (ja) 2007-05-09 2008-04-24 発光装置および発光装置用パッケージ集合体

Publications (1)

Publication Number Publication Date
JPWO2008139981A1 true JPWO2008139981A1 (ja) 2010-08-05

Family

ID=40002185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009514124A Pending JPWO2008139981A1 (ja) 2007-05-09 2008-04-24 発光装置および発光装置用パッケージ集合体

Country Status (5)

Country Link
JP (1) JPWO2008139981A1 (zh)
KR (1) KR20100028033A (zh)
CN (1) CN101681960B (zh)
TW (1) TW200921945A (zh)
WO (1) WO2008139981A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102412346A (zh) * 2010-09-23 2012-04-11 展晶科技(深圳)有限公司 发光二极管制造方法
KR20120045880A (ko) * 2010-11-01 2012-05-09 삼성엘이디 주식회사 Ｌｅｄ 패키지의 광특성 측정 장치
JP5896302B2 (ja) 2010-11-02 2016-03-30 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、樹脂付リードフレーム、半導体装置の製造方法、および半導体素子搭載用リードフレーム
CN102544325B (zh) * 2012-02-14 2013-06-12 张家港市金港镇东南电子厂 一种led集成模组及其制作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP2006066409A (ja) * 2004-07-28 2006-03-09 Kyocera Corp 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP2006156704A (ja) * 2004-11-30 2006-06-15 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2006303397A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 発光装置
JP2006339559A (ja) * 2005-06-06 2006-12-14 Matsushita Electric Ind Co Ltd Ｌｅｄ部品およびその製造方法
JP2006351895A (ja) * 2005-06-17 2006-12-28 Koito Mfg Co Ltd 発光デバイス及びこれを用いた光源装置
JP2007005722A (ja) * 2005-06-27 2007-01-11 Toshiba Corp 光半導体素子用外囲器およびそれを用いた光半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070200133A1 (en) * 2005-04-01 2007-08-30 Akira Hashimoto Led assembly and manufacturing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP2006066409A (ja) * 2004-07-28 2006-03-09 Kyocera Corp 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP2006156704A (ja) * 2004-11-30 2006-06-15 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2006303397A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 発光装置
JP2006339559A (ja) * 2005-06-06 2006-12-14 Matsushita Electric Ind Co Ltd Ｌｅｄ部品およびその製造方法
JP2006351895A (ja) * 2005-06-17 2006-12-28 Koito Mfg Co Ltd 発光デバイス及びこれを用いた光源装置
JP2007005722A (ja) * 2005-06-27 2007-01-11 Toshiba Corp 光半導体素子用外囲器およびそれを用いた光半導体装置

Also Published As

Publication number Publication date
CN101681960A (zh) 2010-03-24
TW200921945A (en) 2009-05-16
KR20100028033A (ko) 2010-03-11
CN101681960B (zh) 2011-09-07
WO2008139981A1 (ja) 2008-11-20

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