JPWO2008132978A1 - 絶縁電線、電機コイル及びモータ - Google Patents
絶縁電線、電機コイル及びモータ Download PDFInfo
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- JPWO2008132978A1 JPWO2008132978A1 JP2009511748A JP2009511748A JPWO2008132978A1 JP WO2008132978 A1 JPWO2008132978 A1 JP WO2008132978A1 JP 2009511748 A JP2009511748 A JP 2009511748A JP 2009511748 A JP2009511748 A JP 2009511748A JP WO2008132978 A1 JPWO2008132978 A1 JP WO2008132978A1
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- insulated wire
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- insulating film
- polyetherimide
- polyesterimide
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- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 30
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- 125000004427 diamine group Chemical group 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
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- OKBVMLGZPNDWJK-UHFFFAOYSA-N naphthalene-1,4-diamine Chemical compound C1=CC=C2C(N)=CC=C(N)C2=C1 OKBVMLGZPNDWJK-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/30—Windings characterised by the insulating material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
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- Organic Insulating Materials (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Description
導体と、前記導体を被覆する絶縁皮膜よりなる絶縁電線であって、前記絶縁皮膜が、ポリエーテルイミドとポリエステルイミドとの混合樹脂を、塗布、焼き付けして形成された絶縁層を有することを特徴とする絶縁電線を提供する。
本発明に係る絶縁電線を作成するに先立って、以下に示す方法によって、混合樹脂ワニスを調整した。
ポリエステルイミドワニスとして、日立化成社製 ISOMID 40SM−45(商品名)を使用した(固形分:45%、)。以下、PEsIとも記す。
温度計、冷却管、塩化カルシウム充填管、攪拌器を取り付けたフラスコ中に、クレゾール800gを投入し、130℃まで昇温した後、ウルテム1000(商品名:日本GEプラスチック社製ポリエーテルイミド)200gを投入した。その後、130℃で1時間撹拌して溶解し、濃度20%のポリエーテルイミドワニスを得た。以下、PEIとも記す。
温度計、冷却管、塩化カルシウム充填管、攪拌器を取り付けたフラスコ中に、表1に示す樹脂混合比(固形分換算、重量比)で、ポリエステルイミド及びワニスポリエーテルイミドワニスを投入し、130℃で1時間撹拌、混合し、処方例1〜7の混合樹脂ワニスを得た。得られた混合樹脂ワニスの固形分(%)を、表1に併せて示す。
〈単層コート絶縁電線の作成〉
表2に示す導体径の銅線表面に、表2に示す処方例No.の混合樹脂ワニスを常法によって塗布、焼付けして、実施例1〜3の単層コート絶縁電線を得た。又、PEsI(比較例1)及びPEI(比較例2)のみで、同様に単層コート絶縁電線を得た。得られた各絶縁電線の寸法(仕上径、膜厚)を、表2に併せて示す。
得られた各絶縁電線について誘電率を測定した。測定は、図1に示すように、巻線の表面に銀ペーストを塗布し(塗布幅は、左右が各10mm、中間部が100mmである)、導体と銀ペースト間の静電容量をLCRメータで測定し、測定した静電容量の値と皮膜の厚みから誘電率を算出する方法で行った。測定結果を、表2に併せて示す。
本実施の形態においては、上記で処方例の混合樹脂ワニス、及び以下に示す方法によって得られた汎用のポリアミドイミド樹脂ワニスを用いて、2層コート絶縁電線を作成し、コロナ放電開始電圧を測定した。
温度計、冷却管、塩化カルシウム充填管、攪拌器、窒素吹き込み管を取り付けたフラスコ中に、前記窒素吹き込み管から毎分150mlの窒素ガスを流しながら、TMA(トリメリット酸無水物、三菱瓦斯化学社製)108.6g、MDI(メチレンジイソシネート、三井武田ケミカル社製、商品名:コスモネートPH)141.5gを投入した。次いで、NMP(N−メチル−2−ピロリドン溶媒、三菱化学社製)637.0gを入れ、撹拌器で撹拌しながら80℃で3時間加熱した。さらに、約3時間かけて系の温度を140℃まで昇温した後、140℃で1時間加熱した。1時間経過した段階で加熱を止め、放冷して、不揮発分25%のポリアミドイミド樹脂ワニスを得た。このポリアミドイミド樹脂ワニスを、以下汎用AIと記す。
直径約0.8mmの銅線(導体)表面に、得られた汎用AIを常法によって塗布、焼付けして、表3に示す膜厚の第1層を形成した。その上に、表3、4の樹脂構成の第2層に示す処方例No.の混合樹脂ワニスを常法によって塗布、焼付けして、表3、4に示す膜厚の第2層を形成して、実施例4〜10の2層コート絶縁電線を得た。又、ポリエステルイミドワニス(比較例3)及びポリエーテルイミドワニス(比較例4)のみで第2層を形成して、同様に単層コート絶縁電線を得た。得られた各絶縁電線の寸法(導体径、各層の膜厚、総膜厚、仕上径)を、表3、4に併せて示す。
(コロナ放電開始電圧の測定方法)
図2に示すように、巻線2本を撚り合わせ、2本の巻線の両端に交流電圧を印加する。電圧を70V/secの速さで上げ、放電量が100pCに達したときの電圧を測定値とする。測定結果を、表3、4に併せて示す。
上記で得られた混合樹脂ワニス、及び以下に示す高密着ポリアミドイミド樹脂ワニスを用いて、3層コート、あるいは4層コート絶縁電線を作成し、コロナ放電開始電圧を測定した。
高密着ポリアミドイミド樹脂ワニスとして、日立化成社製 HI400A−25を使用した。以下、高密着AIとも記す。
直径約0.8mmの銅線(導体)表面に、高密着AIを常法によって塗布、焼付けして、表5に示す膜厚の第1層を形成した。その上に、汎用AIを常法によって塗布、焼付けして、表5に示す膜厚の第2層を形成した。さらに、表5の樹脂構成の第3層に示す混合樹脂ワニスを常法によって塗布、焼付けして、表5に示す膜厚の第3層を形成して、実施例11の3層コート絶縁電線を得た。
実施例11で得られた3層コート絶縁電線の上に、汎用AIを常法によって塗布、焼付けして、表5に示す膜厚の第4層を形成して、実施例12の4層コート絶縁電線を得た。又、第3層を汎用AIとした以外は、実施例12と同様の4層コート絶縁電線を得た。この電線を比較例5とする。得られた各絶縁電線の寸法(導体径、各層の膜厚、総膜厚、仕上径)を、表5に併せて示す。
Claims (6)
- 導体と、前記導体を被覆する絶縁皮膜よりなる絶縁電線であって、前記絶縁皮膜が、ポリエーテルイミドとポリエステルイミドとの混合樹脂を、塗布、焼き付けして形成された絶縁層を有することを特徴とする絶縁電線。
- 前記混合樹脂におけるポリエステルイミドとポリエーテルイミドの混合比(重量比)が、75:25〜10:90であることを特徴とする請求項1に記載の絶縁電線。
- 前記絶縁皮膜が、ポリアミドイミドを主体とする樹脂層をさらに有することを特徴とする請求項1又は請求項2に記載の絶縁電線。
- 前記絶縁皮膜が、その最外層に、表面潤滑層をさらに有することを特徴とする請求項1ないし請求項3のいずれかに記載の絶縁電線。
- 請求項1ないし請求項4のいずれか1項に記載の絶縁電線を巻線してなることを特徴とする電機コイル。
- 請求項5に記載の電機コイルを使用することを特徴とするモータ。
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JP2012095488A (ja) * | 2010-10-28 | 2012-05-17 | Toyota Motor Corp | 回転電機用ロータ、およびこれを用いた回転電機 |
JP2012164426A (ja) * | 2011-02-03 | 2012-08-30 | Sumitomo Electric Ind Ltd | 絶縁電線 |
US8980053B2 (en) | 2012-03-30 | 2015-03-17 | Sabic Innovative Plastics Ip B.V. | Transformer paper and other non-conductive transformer components |
KR20160008566A (ko) * | 2013-05-10 | 2016-01-22 | 사빅 글로벌 테크놀러지스 비.브이. | 이중층 와이어 코팅 |
JP5931097B2 (ja) * | 2014-01-22 | 2016-06-08 | 古河電気工業株式会社 | 絶縁電線およびその製造方法、ならびに回転電機およびその製造方法 |
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US4480007A (en) * | 1980-09-03 | 1984-10-30 | General Electric Company | Enamel having improved coatability and insulated electrical articles produced therefrom |
JPS6185710A (ja) * | 1984-10-02 | 1986-05-01 | 東京特殊電線株式会社 | 耐熱平角絶縁電線の製造方法 |
JPS6258519A (ja) * | 1985-09-06 | 1987-03-14 | 東京特殊電線株式会社 | 耐熱平角絶縁電線の製造方法 |
US4835047A (en) * | 1987-05-14 | 1989-05-30 | Avraam Isayev | Wholly aromatic polyester fiber-reinforced polyetherimide composite and process for preparing same |
US5135990A (en) * | 1990-10-05 | 1992-08-04 | General Electric Company | Polyetherimide-liquid crystalline polymer blends |
JP3424273B2 (ja) * | 1993-08-31 | 2003-07-07 | 住友電気工業株式会社 | 絶縁電線 |
JPH0773743A (ja) * | 1993-08-31 | 1995-03-17 | Sumitomo Electric Ind Ltd | 絶縁電線 |
JPH08185735A (ja) * | 1994-12-28 | 1996-07-16 | Kanegafuchi Chem Ind Co Ltd | 集合絶縁電線の製造方法 |
JP3058817B2 (ja) * | 1995-10-03 | 2000-07-04 | 第一電工株式会社 | 半田付け用絶縁電線 |
US5700863A (en) * | 1996-08-19 | 1997-12-23 | E. I. Du Pont De Nemours And Company | Polyimide polymeric blends |
JP3717297B2 (ja) * | 1996-12-25 | 2005-11-16 | 古河電気工業株式会社 | 絶縁電線 |
US5965263A (en) * | 1996-12-25 | 1999-10-12 | The Furukawa Electric Co., Ltd. | Insulated wire |
JP4057230B2 (ja) * | 2000-10-03 | 2008-03-05 | 古河電気工業株式会社 | 絶縁被覆電気導体 |
JP2005135607A (ja) * | 2003-10-28 | 2005-05-26 | Hitachi Chem Co Ltd | 電気絶縁用樹脂組成物及びエナメル線 |
JP2006001996A (ja) * | 2004-06-16 | 2006-01-05 | Hitachi Chem Co Ltd | 電気絶縁用樹脂組成物及びエナメル線 |
JP5135718B2 (ja) * | 2005-06-01 | 2013-02-06 | 三菱化学株式会社 | テトラカルボン酸又はそのポリエステルイミド、及びその製造方法 |
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