JPWO2008096584A1 - Imaging device manufacturing method, imaging device, and portable terminal - Google Patents

Abstract

In order to obtain a manufacturing method in which a low-cost imaging device is obtained and to provide a low-cost imaging device by the manufacturing method, the most image side lens and the most image side lens of the imaging optical system are held, A manufacturing method of an imaging device including a step of integrally forming a frame member formed of a light-shielding material to form a unit and a step of fixing an imaging element to the unit.

Description

  The present invention relates to an imaging device manufacturing method, an imaging device, and a mobile terminal including the imaging device, each including an imaging optical system that guides subject light, and an imaging element that photoelectrically converts subject light guided by the imaging optical system. It is about.

  Smaller and thinner imaging devices than ever have been installed in portable terminals, which are small and thin electronic devices such as mobile phones and PDAs (Personal Digital Assistants), and not only audio information but also image information to remote locations It is possible to transmit to each other.

As a method for manufacturing such a small imaging device, a lens array on which a plurality of optical lenses are formed is bonded onto a silicon wafer on which a plurality of image sensors are formed in an array, and divided in accordance with the arrangement of the image sensors. Those are known (for example, see Patent Document 1).
JP 2002-290842 A

  However, in the manufacturing method of the imaging device of Patent Document 1, since a plurality of lens arrays corresponding to each of a plurality of image sensors on a silicon wafer are bonded and cut and separated, for example, some defect such as a pattern defect is caused. There is a problem that a lens is forced to be disposed also on the defective image sensor, and the lens bonded together with the defective image sensor must be discarded, resulting in an increase in cost.

  Also, in an imaging device built in a portable terminal, an imaging element has a high pixel count, and in response to this, a device that uses a plurality of lenses in order to obtain higher resolution has become common. On the other hand, the manufacturing method of the imaging apparatus disclosed in Patent Document 1 cannot cope with the incorporation of an imaging optical system composed of a plurality of lenses.

  In view of the above problems, an object of the present invention is to obtain a manufacturing method for obtaining a low-cost imaging device, to provide a low-cost imaging device by the manufacturing method, and to provide an imaging optical system including a plurality of lenses. An object of the present invention is to obtain a manufacturing method of an imaging apparatus that can be incorporated into a system and can be easily mass-produced.

  The above object is achieved by the invention described below.

  1. In a manufacturing method of an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging device that photoelectrically converts subject light guided by the imaging optical system; and a lens closest to the image plane of the imaging optical system; A step of holding a lens closest to the image plane and integrally forming a frame member formed of a light-shielding material, and a step of fixing the imaging element to the integrally formed unit; A method for manufacturing an imaging apparatus, comprising:

  2. The imaging optical system includes a plurality of lenses, and the step of fixing the imaging element to the unit is performed after the step of incorporating a lens other than the lens closest to the image plane of the imaging optical system. A method for manufacturing the imaging device according to 1.

  3. 3. The method of manufacturing an image pickup apparatus according to 2, wherein the lens other than the lens closest to the image plane of the image pickup optical system is formed by integrally forming a lens and a frame member.

  4). In a manufacturing method of an imaging apparatus having an imaging optical system that guides subject light and an imaging element that photoelectrically converts subject light guided by the imaging optical system, a plurality of the imaging elements are formed on one surface of a wafer. A step of placing a lens closest to the image plane of the imaging optical system for each of the imaging elements of the wafer, a step of integrally molding the imaging element and the lens closest to the image plane, An image pickup apparatus manufacturing method comprising: incorporating another lens of an image pickup optical system; and cutting and separating each image pickup element.

  5. 5. The method of manufacturing an image pickup apparatus according to 4, wherein the step of cutting and separating each image pickup element is performed after the step of incorporating another lens group of the image pickup optical system.

  6). 6. The method of manufacturing an imaging apparatus according to 4 or 5, wherein the other lens of the imaging optical system is a lens and a frame member that are integrally formed.

  An imaging apparatus manufactured by the method for manufacturing an imaging apparatus according to any one of 7.1 to 6.

  A portable terminal comprising the imaging device according to 8.7.

  According to the present invention, it is possible to obtain a low-cost imaging device manufacturing method, and it is possible to provide a low-cost imaging device by the manufacturing method. Furthermore, it is possible to obtain a manufacturing method of an imaging apparatus that can easily incorporate an imaging optical system constituted by a plurality of lenses and can be easily mass-produced.

It is sectional drawing which shows the outline of the imaging device which concerns on 1st Embodiment. It is a figure which shows the manufacture order of the imaging device which concerns on 1st Embodiment. It is sectional drawing which shows the outline of the modification of the imaging device which concerns on 1st Embodiment. It is a figure which shows the example of the manufacture order of the imaging device which concerns on 2nd Embodiment. It is the perspective view which showed typically the state in which the 3rd lens was mounted on the wafer. It is a figure which shows the other example of the manufacturing method of the imaging device which concerns on 2nd Embodiment. It is an external view of a mobile phone which is an example of a mobile terminal provided with an imaging device. It is a control block diagram of a mobile phone.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 1st lens 12 2nd lens 13 3rd lens 14 Aperture 15 Image pick-up element 21 1st frame member 22 2nd frame member 23 3rd frame member B Adhesive agent S Imaging device T Mobile telephone W Wafer

  Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.

(First embodiment)
FIG. 1 is a cross-sectional view illustrating an outline of the imaging apparatus according to the first embodiment.

  As shown in the figure, the imaging apparatus S according to the first embodiment includes, for example, an imaging optical system having a three-lens configuration including a first lens 11, a second lens 12, and a third lens 13 from the object side. Yes. In this example, the third lens 13 corresponds to the lens closest to the image plane. Between the first lens 11 and the second lens 12, a diaphragm 14 that defines an aperture diameter is disposed. An infrared light cut coat is applied to one surface of any of the three lenses. In particular, when an infrared light cut coat is applied to the imaging surface side of the first lens 11, color reproducibility is achieved. Good results are obtained. The infrared light cut coat is not limited to this, and may be configured by sharing a multilayer film on a plurality of surfaces.

  On the surface (referred to as the front surface) of the imaging element 15 on the imaging optical system side, a plurality of light receiving pixel portions are arranged in a two-dimensional array, and are arranged around the photoelectric conversion portion 15a. A signal processing unit 15b and a plurality of pad units are formed. The pad portion is connected to an external terminal 15d formed on the back surface by a through via 15c.

  The first lens 11 is integrally formed with the first frame member 21 made of a light-shielding material and unitized by, for example, two-color molding. The second lens 12 is integrally formed with the second frame member 22 formed of a light-shielding material and unitized by, for example, two-color molding. The third lens 13 is integrally formed with the third frame member 23 formed of a light-shielding material and unitized by, for example, two-color molding.

  The image sensor 15 is bonded and fixed with an adhesive B in a state where it is in contact with the contact portion of the third frame member 23 at a portion other than the photoelectric conversion portion 15a.

  FIG. 2 is a diagram illustrating a manufacturing order of the imaging device S according to the first embodiment. This will be described with reference to FIG.

  First, as shown in FIG. 6A, for example, a unit of the third lens 13 and the third frame member 23 integrally formed by two-color molding is a base. Although details are omitted in the figure, a plurality of third lenses 13 are connected by flexible arm portions 13b, and a plurality of third frame members 23 are connected by flexible arm portions 23b. What is integrally molded in a state is preferable for mass production. The integrated third lens 13 and the third frame member 23 may each be a single product and integrated.

  Next, as shown in FIG. 4B, on the object side of the third lens 13, the integrated second lens 12 and the second frame member 22, the diaphragm 14, the integrated first lens 11 and the first frame member 21 are provided. Assembled. Also in this case, the plurality of second lenses 12 are connected by the flexible arm 12b, and the plurality of second frame members 22 are connected by the flexible arm 22b, and are integrally formed. Are preferred. In addition, the plurality of first lenses 11 are connected by the flexible arm portion 11b, and the plurality of first frame members 21 are connected by the flexible arm portion 21b and are integrally molded. preferable. By doing in this way, the several imaging device S can be assembled collectively, an assembly man-hour can be reduced and cost can be reduced.

  As an assembly order, the integrated second lens 12 and the second frame member 22 are assembled, the diaphragm 14 is assembled, and then the integrated first lens 11 and the first frame member 21 may be assembled. The second lens 12, the second frame member 22, the diaphragm 14, and the integrated first lens 11 and the first frame member 21 may be assembled in advance and then assembled to the object side of the third lens 13. In the above assembly, an adhesive or the like is appropriately used.

  Next, as shown in FIG. 3C, the imaging element 15 is bonded and fixed with the adhesive B in a state where the imaging element 15 is in contact with the contact portion of the third frame member 23.

  Thereafter, the arm portion 11b of the first lens 11, the arm portion 12b of the second lens 12, the arm portion 13b of the third lens 13, the arm portion 21b of the first frame member 21, the arm portion 22b of the second frame member 22, By cutting the arm portion 23b of the third frame member 23 at, for example, the position of the broken line in the drawing, the imaging device S shown in FIG.

  In the above description, the image sensor 15 is assembled last, but the image sensor 15 may be assembled first to the unit of the third lens 13 and the third frame member 23.

  FIG. 3 is a cross-sectional view illustrating an outline of a modified example of the imaging apparatus according to the first embodiment. Since the imaging apparatus S shown in the figure is common to most of the imaging apparatus shown in FIG. 1, only different parts will be described.

  The image pickup apparatus S shown in the figure has a leg portion 13k formed on the third lens 13 as a contact portion when the image pickup device 15 is assembled to the integrated unit of the third lens 13 and the third frame member 23. It is. With such a configuration, the interval between the third lens 13 and the photoelectric conversion surface 15a of the image sensor 15 can be set more accurately.

  As described above, the step of integrally forming a lens on the most image plane side of the imaging optical system and a frame member formed of a light-shielding material into a unit, and a step of fixing the imaging device to this unit; By using the imaging device manufacturing method having the above, it is possible to assemble only a non-defective imaging device, to eliminate a waste, and to obtain a manufacturing method for obtaining a low-cost imaging device. In addition, this makes it possible to provide a low-cost imaging device.

  Furthermore, since the image pickup device 15 uses a sensor chip having an external terminal or the like formed thereon, the number of wire bonding steps is not required, the space for the terminal for wire bonding is not required, and it is small and low cost. It can be set as an imaging device.

(Second Embodiment)
Hereinafter, an imaging apparatus according to the second embodiment will be described. In the imaging apparatus according to the second embodiment, the same functional members as those of the imaging apparatus according to the first embodiment are denoted by the same reference numerals in order to avoid overlapping description.

  FIG. 4 is a diagram illustrating an example of the manufacturing order of the imaging device S according to the second embodiment. This will be described with reference to FIG.

  First, as shown in FIG. 2A, the third lens 13 that is the lens closest to the image plane of the imaging optical system is placed on and adhered to the photoelectric conversion unit 15a on the wafer W.

  FIG. 5 is a perspective view schematically showing a state where the third lens 13 is placed on the wafer W. FIG. As shown in the figure, on the wafer W, the third lens 13 that is the lens on the most image plane side of the imaging optical system is placed corresponding to each of the photoelectric conversion units.

  Returning to FIG. 4, the third lens 13 is preferably connected to a plurality of third lenses 13 by flexible arm portions 13b as shown in the figure.

  Next, as shown in FIG. 4B, the resin material MD is injected with the third lens 13 placed on the wafer W, and is molded integrally so that only the third lens 13 is exposed as shown. The In addition, since it molds as mentioned above, after mounting the 3rd lens 13 on the photoelectric conversion part 15a, it does not necessarily need to adhere | attach.

  Next, as shown in FIG. 3C, the second lens 12 and the second frame member 22, the diaphragm 14, the first lens 11 and the first frame member 21 are assembled on the object side of the third lens 13. Also in this case, the plurality of second lenses 12 are connected by the flexible arm 12b, and the plurality of second frame members 22 are connected by the flexible arm 22b, and are integrally formed. Are preferred. In addition, the plurality of first lenses 11 are connected by the flexible arm portion 11b, and the plurality of first frame members 21 are connected by the flexible arm portion 21b and are integrally molded. preferable. By doing in this way, the several imaging device S can be assembled collectively, an assembly man-hour can be reduced and cost can be reduced.

  As an assembly order, the integrated second lens 12 and the second frame member 22 are assembled, the diaphragm 14 is assembled, and then the integrated first lens 11 and the first frame member 21 may be assembled. The second lens 12, the second frame member 22, the diaphragm 14, and the integrated first lens 11 and the first frame member 21 may be assembled in advance and then assembled to the object side of the third lens 13. In the above assembly, an adhesive or the like is appropriately used.

  Thereafter, at the position of the broken line C shown in FIG. 4C, the wafer W, the molding part, the arm part 11b of the first lens 11, the arm part 12b of the second lens 12, the arm part 13b of the third lens 13, By cutting the arm portion 21b of the one frame member 21 and the arm portion 22b of the second frame member 22, the imaging device S is a single product.

  FIG. 6 is a diagram illustrating another example of the manufacturing order of the imaging device S according to the second embodiment.

  The process shown in FIG. 4A is the same as that shown in FIG.

  Next, as shown in FIG. 4B, the resin material MD is injected with the third lens 13 placed on the wafer W, and is molded integrally so that only the third lens 13 is exposed as shown. The Thereafter, the wafer W, the molding part, and the arm part 13b of the third lens 13 are cut at the position indicated by the broken line C in the drawing. Thereby, it isolate | separates into the partial assembly of each image pick-up element 15 in which the 3rd lens 13 was assembled | attached.

  Next, as shown in FIG. 3C, the second lens 12, the second frame member 22, the aperture 14, the first lens 11, and the first lens are arranged on the object side of the third lens 13 of the plurality of separated parts. The frame member 21 is assembled. Also in this case, the plurality of second lenses 12 are connected by the flexible arm 12b, and the plurality of second frame members 22 are connected by the flexible arm 22b, and are integrally formed. Are preferred. In addition, the plurality of first lenses 11 are connected by the flexible arm portion 11b, and the plurality of first frame members 21 are connected by the flexible arm portion 21b and are integrally molded. preferable. By doing in this way, the several imaging device S can be assembled collectively, an assembly man-hour can be reduced and cost can be reduced. In the above assembly, an adhesive or the like is appropriately used.

  Thereafter, the arm portion 11b of the first lens 11, the arm portion 12b of the second lens 12, the arm portion 21b of the first frame member 21, and the arm portion 22b of the second frame member 22 are cut at the position of the broken line D shown in the figure. Thus, the imaging device S is a single item.

  As described above, the lens on the most image plane side of the imaging optical system is placed for each imaging element of the wafer, molded integrally, and then incorporated with other lenses of the imaging optical system, and for each imaging element. The method of manufacturing an image pickup apparatus that includes a plurality of lenses can be easily incorporated and can be easily mass-produced. It becomes.

  In the above description, the imaging optical system having the three-sheet configuration is described. However, the present invention is not limited to this, and the present invention can be applied to an imaging apparatus having two or more imaging optical systems. Moreover, in order to cut infrared light, although it demonstrated with what applied the infrared light cut coat to either side of the lens to comprise, it is not restricted to this, A separate infrared light cut filter is used. You may arrange.

  A portable terminal including the imaging device S manufactured as described above will be described.

  FIG. 7 is an external view of a mobile phone T that is an example of a mobile terminal including the imaging device S.

  In the mobile phone T shown in the figure, an upper casing 71 as a case having a display screen D and a lower casing 72 having an operation button P as an input unit are connected via a hinge 73. The imaging device S is built in the upper housing 71 and is arranged so that the imaging device S can capture light from the outer surface side of the upper housing 71.

  Note that the imaging device S may be arranged at another position. Of course, the mobile phone is not limited to a folding type.

  FIG. 8 is a control block diagram of the mobile phone T.

  As shown in the figure, it is connected to the control unit 101 of the mobile phone T via an external terminal of the imaging device S, and outputs an image signal such as a luminance signal or a color difference signal to the control unit 101.

  On the other hand, the mobile phone T controls each part in an integrated manner, and also executes a control part (CPU) 101 that executes a program corresponding to each process, an operation button P that is an input part for inputting a number and the like, A display screen D for displaying predetermined data and captured images, a wireless communication unit 80 for realizing various information communication with an external server, a system program for mobile phone T, various processing programs, a terminal ID, etc. A storage unit (ROM) 91 storing various necessary data, and various processing programs and data executed by the control unit 101, processing data, image data by the imaging device S, and the like are temporarily stored. A temporary storage unit (RAM) 92 used as a work area is provided.

  Further, the image signal input from the imaging device S is stored in an image storage unit (not shown) or displayed on the display screen D by the control unit 101 of the mobile phone T, and further, the wireless communication unit 80 is connected. It is transmitted to the outside as image information.

Claims (8)

In a method for manufacturing an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging element that photoelectrically converts subject light guided by the imaging optical system.
A step of forming a unit by integrally molding a lens on the most image plane side of the imaging optical system, and a frame member formed of a light-shielding material, holding the lens on the most image plane side;
And a step of fixing the image pickup device to the integrally molded unit. The imaging optical system includes a plurality of lenses, and the step of fixing the imaging element to the unit is performed after the step of incorporating a lens other than the lens closest to the image plane of the imaging optical system. The manufacturing method of the imaging device of Claim 1. 3. The method of manufacturing an imaging apparatus according to claim 2, wherein the lens other than the lens closest to the image plane of the imaging optical system is formed by integrally forming a lens and a frame member. In a method for manufacturing an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging element that photoelectrically converts subject light guided by the imaging optical system.
Forming a plurality of the imaging elements on one surface of the wafer;
Placing the lens on the most image plane side of the imaging optical system for each imaging element of the wafer;
Molding the image sensor and the lens closest to the image plane;
Incorporating another lens of the imaging optical system;
And a step of cutting and separating each image pickup device. 5. The method of manufacturing an imaging apparatus according to claim 4, wherein the step of cutting and separating each of the imaging elements is performed after the step of incorporating another lens group of the imaging optical system. 6. The method of manufacturing an imaging apparatus according to claim 4, wherein the other lens of the imaging optical system is a lens and a frame member that are integrally formed. An image pickup apparatus manufactured by the method for manufacturing an image pickup apparatus according to any one of claims 1 to 6. A portable terminal comprising the imaging device according to claim 7.