JPWO2008084646A1 - Imaging device manufacturing method, imaging device, and portable terminal - Google Patents

Abstract

In order to obtain a manufacturing method for obtaining a low-cost imaging device, and to provide a low-cost imaging device by the manufacturing method, a step of forming a plurality of the imaging elements on one surface of a silicon wafer; A step of sealing the light-receiving pixel portion for each of the image pickup devices, a step of cutting the silicon wafer for each of the image pickup devices, and a plurality of the cut non-defective image pickup devices with an optical member arranged closest Mounting on the substrate, electrically connecting the substrate and the plurality of imaging elements, incorporating the imaging optical system, cutting and separating the substrate for each imaging element, The manufacturing method of the imaging device having

Description

  The present invention relates to an imaging device manufacturing method, an imaging device, and a mobile terminal including the imaging device, each including an imaging optical system that guides subject light, and an imaging element that photoelectrically converts subject light guided by the imaging optical system. It is about.

  Smaller and thinner imaging devices than ever have been installed in portable terminals, which are small and thin electronic devices such as mobile phones and PDAs (Personal Digital Assistants), and not only audio information but also image information to remote locations It is possible to transmit to each other.

As a method for manufacturing such a small imaging device, a lens array on which a plurality of optical lenses are formed is bonded onto a silicon wafer on which a plurality of image sensors are formed in an array, and divided in accordance with the arrangement of the image sensors. Those are known (for example, see Patent Document 1).
JP 2002-290842 A

  However, in the manufacturing method of Patent Document 1, a plurality of lens arrays corresponding to each of a plurality of image sensors on a silicon wafer are bonded and then cut and separated. There is a problem that the lens must be disposed and the lens must be discarded together with the defective image sensor, resulting in high cost.

  In view of the above problems, an object of the present invention is to provide a manufacturing method for obtaining a low-cost imaging device and to provide a low-cost imaging device by the manufacturing method.

  The above object is achieved by the invention described below.

  1. In one method of manufacturing an imaging apparatus, the imaging optical system includes: an imaging optical system that guides subject light; and an imaging device that includes a plurality of light receiving pixel portions and that photoelectrically converts subject light guided by the imaging optical system. Forming a plurality of the image sensors on the image sensor, sealing the light receiving pixel portion for each image sensor with an optical member disposed closest to the image sensor, and forming the silicon wafer for each image sensor. A step of placing the plurality of image pickup devices that have been cut and judged to be non-defective products, a step of electrically connecting the substrate and the plurality of image pickup devices, and the imaging optical system. An image pickup apparatus manufacturing method comprising: an assembling step; and a step of cutting and separating the substrate for each image pickup element.

  2. In one method of manufacturing an imaging apparatus, the imaging optical system includes: an imaging optical system that guides subject light; and an imaging device that includes a plurality of light receiving pixel portions and that photoelectrically converts subject light guided by the imaging optical system. Forming a plurality of the image pickup elements on the substrate, sealing the light receiving pixel portion for each of the image pickup elements with an optical member in which at least a region through which the subject light passes is formed in a parallel plane, and the silicon wafer Cutting each image sensor, placing a plurality of the image sensors determined to be non-defective products on a substrate, electrically connecting the substrate and the plurality of image sensors, A step of integrally molding the plurality of imaging elements sealed with the substrate and the optical member, a step of fitting the imaging member into a positioning portion of the optical member and incorporating the imaging optical system; The imaging device manufacturing method characterized by having a step of cutting and separating the molding has been the substrate for each of the image pickup element.

  3. 3. The imaging according to claim 1, wherein the optical member in the step of sealing the light-receiving pixel portion for each of the imaging elements is incorporated with a positioning portion formed in a region where the subject light does not pass. Device manufacturing method.

  4). The imaging apparatus according to any one of claims 1 to 3, wherein in the step of sealing the light receiving pixel portion for each of the imaging elements, a plurality of the optical members are connected by arm portions. Manufacturing method.

  5. In one method of manufacturing an imaging apparatus, the imaging optical system includes: an imaging optical system that guides subject light; and an imaging device that includes a plurality of light receiving pixel portions and that photoelectrically converts subject light guided by the imaging optical system. A step of forming a plurality of the image pickup elements on the substrate, a step of sealing the light receiving pixel portion for each of the image pickup elements with an optical member formed on a parallel plate, and a step of cutting the silicon wafer for each of the image pickup elements. A step of placing the plurality of image pickup devices that are cut and determined to be non-defective products on a substrate, a step of electrically connecting the substrate and the plurality of image pickup devices, and the image pickup optical system on the optical member Incorporating the lens closest to the image plane side, molding the lens closest to the image plane of the imaging optical system incorporated with the substrate, the plurality of imaging elements and the optical member, and The imaging device manufacturing method characterized by having a step of incorporating the other lens group of the image optical system, and a step of cutting and separating the substrate that has been the molding for each of the image pickup device.

  6). In one method of manufacturing an imaging apparatus, the imaging optical system includes: an imaging optical system that guides subject light; and an imaging device that includes a plurality of light receiving pixel portions and that photoelectrically converts subject light guided by the imaging optical system. Forming a plurality of the image pickup elements on the surface, sealing the light receiving pixel portion for each of the image pickup elements with a lens closest to the image plane of the image pickup optical system, and forming the silicon wafer for each of the image pickup elements. A step of cutting, a step of placing a plurality of the image sensors that have been cut and determined to be non-defective products, a step of electrically connecting the substrate and the plurality of image sensors, and a plurality of the substrates and the plurality of the image sensors. A step of integrally molding a lens closest to the image plane of the imaging optical system incorporated with the imaging device, a step of incorporating another lens group of the imaging optical system, and the molded substrate. The imaging device manufacturing method characterized by and a step of cutting and separating each serial image sensor.

  7). The most image-side lens of the imaging optical system incorporated in the molding step includes a plurality of imaging-side lenses of the imaging optical system connected by arm portions. The manufacturing method of the imaging device of 5 or 6.

  8). 8. The imaging apparatus according to claim 2, wherein the step of incorporating the lens group after the molding step incorporates a plurality of lens groups connected by a flexible arm portion. Manufacturing method.

  9. 9. The method of manufacturing an imaging apparatus according to 8, wherein the plurality of lens groups are formed by integrally forming a lens portion and a light-shielding portion having different translucency.

  An image pickup apparatus manufactured by the method for manufacturing an image pickup apparatus according to any one of 10.1 to 9.

  11. A portable terminal comprising the imaging device according to 11.10.

  According to the present invention, it is possible to obtain a manufacturing method in which a low-cost imaging device can be obtained, and it is possible to provide a low-cost imaging device by this manufacturing method.

It is a schematic diagram which shows the initial process step of the manufacturing method of the imaging device which concerns on 1st Embodiment. It is a schematic diagram which shows the intermediate | middle process step of the manufacturing method of the imaging device which concerns on 1st Embodiment. It is a schematic diagram which shows the latter process step of the manufacturing method of the imaging device which concerns on 1st Embodiment. It is a schematic diagram which shows the initial process step of the manufacturing method of the imaging device which concerns on 2nd Embodiment. It is a schematic diagram which shows the intermediate | middle process step of the manufacturing method of the imaging device which concerns on 2nd Embodiment. It is a schematic diagram which shows the latter process step of the manufacturing method of the imaging device which concerns on 2nd Embodiment. It is a schematic diagram which shows the initial process step of the manufacturing method of the imaging device which concerns on 3rd Embodiment. It is a schematic diagram which shows the intermediate | middle process step of the manufacturing method of the imaging device which concerns on 3rd Embodiment. It is a schematic diagram which shows the latter process step of the manufacturing method of the imaging device which concerns on 3rd Embodiment. It is a figure which shows an example of the lens group integrated unit integrally connected by the flexible arm part. It is a figure which shows the other example of the light-shielding member unit in which the part for several units was formed integrally. It is a figure which shows the other example of the lens group integrated unit integrally connected by the flexible arm part. It is a figure which shows the other example of the lens group integrated unit integrally connected by the flexible arm part. It is sectional drawing which shows the imaging device incorporating the two-color molded lens group integrated unit after the process shown in FIGS. It is an external view of a mobile phone which is an example of a mobile terminal provided with an imaging device. It is a control block diagram of a mobile phone.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Silicon wafer 12 Image pick-up element 13 Adhesive 14 Optical member 19 Dicing blade 21 Board | substrate 30 Lens group integrated unit 31 Lens 32 Light-shielding member unit 41 Diaphragm member 50 Imaging device 100 Cellular phone LB Lens (lens on the most image surface side)
MD molding YB wire bonding

  Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.

(First embodiment)
Hereinafter, a method for manufacturing the imaging device according to the first embodiment will be described.

  FIG. 1 is a schematic diagram illustrating an initial process stage of the manufacturing method of the imaging device according to the first embodiment. The left column of the figure shows an overall schematic state, and the right column is a cross-sectional view showing one of the schematic states.

  First, a plurality of image sensors 12 are formed on one surface of a silicon wafer 11 shown in FIG. In this process, a known film formation process, photolithography process, etching process, impurity addition process, etc. are repeated to form transfer electrodes, insulating films, wirings, etc. in a multilayer structure, and a plurality of image sensors 12 are formed in an array. It is. The imaging device 12 is, for example, a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor.

  Next, as shown in FIG. 2B, an adhesive 13 is applied to each of the plurality of imaging elements 12 formed on the silicon wafer 11. The adhesive 13 is applied at a position avoiding the light receiving pixel area of the image pickup device 12, and an interval between optical members bonded above the light receiving pixel area of the image pickup device 12 by adjusting the amount of the adhesive applied. Is decided.

  Thereafter, the optical member 14 is bonded as shown in FIG. The light receiving pixel region of the image sensor 12 is sealed by the adhesion of the optical member 14. In the optical member 14, a region located above the light receiving pixel region of the image sensor 12, that is, a region through which subject light passes is formed in parallel planes. Further, a positioning portion for positioning a lens to be incorporated later is formed in an area where the subject light does not pass. In this example, the positioning portion corresponds to a circular recess surface 14t and a wall surface portion 14s thereof. The optical member 14 is provided with an infrared light cut coating.

  Next, as shown in FIG. 4D, the silicon wafer 11 is cut for each image sensor by a dicing blade 19. As a result, a chip of each image sensor 12 in which the light receiving pixel region is sealed by the optical member 14 is obtained.

  FIG. 2 is a schematic diagram illustrating a mid-stage process step of the manufacturing method of the imaging device according to the first embodiment. In the following drawings, the same members are denoted by the same reference numerals in order to avoid overlapping description.

  As described above, the area where the subject light passes is formed in a parallel plane, and the area where the subject light does not pass is the chip of the individual image sensor 12 to which the optical member 14 on which the positioning portion is formed is bonded. As shown in a), a plurality of substrates are placed on the substrate 21. The substrate 21 is formed with a plurality of wirings for the chips of the individual image pickup devices 12 so that the chips of the plurality of image pickup devices 12 can be placed thereon.

  In addition, only the chip | tip with which the chip | tip of each image pick-up element 12 mounted at this time was determined to be non-defective by the test | inspection is mounted. As a result, a lens or the like incorporated thereafter is not wasted. The contents of the inspection include, for example, a wafer surface appearance inspection, a pattern inspection, a film thickness unevenness inspection, and a foreign matter inspection. Further, the inspection may be performed either before cutting or after cutting.

  Next, as shown in FIG. 2B, the chip of the image sensor 12 and the substrate 21 are electrically connected by wire bonding YB. On the other surface of the substrate 21, a plurality of external electrodes 21 b (for example, solder balls) used for connection to other control substrates (not shown) are formed. As a result, signal input / output can be performed between the imaging element 12 and another control board (not shown) connected to the board 21.

  Thereafter, as shown in FIG. 2C, the resin material MD is injected into the surface of the substrate 21 on the image pickup device 12 side, and is molded integrally so that only the optical member 14 is exposed.

  FIG. 3 is a schematic diagram illustrating a later stage of the manufacturing method of the imaging device according to the first embodiment.

  As shown in FIG. 5A, the lens 31 and the light shielding member unit 32, which are imaging optical systems, are incorporated in a state where the chips of the plurality of imaging elements 12 are integrally molded. The imaging optical system is a lens group integrated unit 30 that is integrally formed by connecting a plurality of lenses 31 by flexible arm portions 31r. The individual lenses 31 are positioned in the direction perpendicular to the optical axis by fitting with the exposed wall surface 14s of the optical member 14 while being connected to the flexible arm portion 31r. Further, it is abutted against the recess surface 14t and positioned in the optical axis direction and incorporated. Next, the light shielding member unit 32 is stacked and fixed so as to sandwich the lens 31. Similarly, the light shielding member unit 32 is also integrally formed with a plurality of units. Thereby, in the example shown in the drawing, an image pickup device of 8 units is integrally formed. In addition, the light shielding member unit 32 may be not only a resin molded product but also a metal member processed by etching or the like, or may be used by overlapping a plurality. Although it is preferable in terms of cost to be positioned and assembled while being connected to the flexible arm 31r as described above, the lens 31 and the light-shielding member unit 32 are a single unit and are incorporated individually. Such a configuration may be adopted.

  Thereafter, by cutting and separating at the broken line portion shown in FIG. 6A, the image pickup device 50 is separated into a single product as shown in FIG.

  In addition, although the example in which the infrared light cut coating is applied to the optical member 14 has been described, the present invention is not limited to this, and the lens 31 may be provided with an infrared light cut coating, or may be a separate infrared light cut. A filter may be incorporated.

  Further, although the example using the optical member 14 in which the positioning portion is formed in the area where the subject light does not pass and the area where the subject light passes is formed in the parallel plane has been described, the optical member formed entirely in the parallel plane It may be.

  The above is the manufacturing method of the imaging device according to the first embodiment.

  As described above, by cutting the silicon wafer for each chip of the image pickup device and placing a plurality of image pickup device chips on the substrate, it is possible to put only non-defective chips into the subsequent steps. Thus, a lens or the like incorporated thereafter is not wasted, and a manufacturing method for obtaining a low-cost imaging device can be obtained. Furthermore, in the step of assembling the lens group, a plurality of lenses connected by flexible arm portions are incorporated at a time, and a unit in which a plurality of units are integrally formed is incorporated at a time. By doing so, it becomes possible to reduce the number of man-hours, and it is possible to obtain a manufacturing method for obtaining a low-cost imaging device.

  In the above example, the optical members 14 are individually separated, but a plurality of optical members 14 are connected and integrated by arm portions, and a plurality of them are formed at a time. Preferably, the step of incorporating the optical member 14 is used. By doing so, it is possible to further reduce the number of man-hours and to obtain a manufacturing method for obtaining a lower cost imaging device.

(Second Embodiment)
Hereinafter, a manufacturing method of the imaging device according to the second embodiment will be described.

  FIG. 4 is a schematic diagram illustrating the initial process steps of the method of manufacturing the imaging device according to the second embodiment. The left column of the figure shows an overall schematic state, and the right column is a cross-sectional view showing one of the schematic states.

  First, a plurality of image sensors 12 are formed on one surface of a silicon wafer 11 shown in FIG. This step is the same as in the first embodiment.

  Next, as shown in FIG. 2B, an adhesive 13 is applied to each of the plurality of imaging elements 12 formed on the silicon wafer 11. This process is also the same as in the first embodiment.

  Thereafter, the optical member 14 is bonded as shown in FIG. The light receiving pixel region of the image sensor 12 is sealed by the adhesion of the optical member 14. The optical member 14 is a member having translucency formed on a parallel plate. The optical member 14 is provided with an infrared light cut coating.

  Next, as shown in FIG. 4D, the silicon wafer 11 is cut for each image sensor by a dicing blade 19. As a result, a chip of each image sensor 12 in which the light receiving pixel region is sealed by the optical member 14 is obtained.

  FIG. 5 is a schematic diagram illustrating a mid-stage process step of the method of manufacturing the imaging device according to the second embodiment.

  A plurality of chips of each image sensor 12 to which the optical member 14 is bonded are placed on the substrate 21 as shown in FIG. The substrate 21 is formed with a plurality of wirings for the chips of the individual image pickup devices 12 so that the chips of the plurality of image pickup devices 12 can be placed thereon.

  In addition, only the chip | tip with which the chip | tip of each image pick-up element 12 mounted at this time was determined to be non-defective by the test | inspection is mounted. As a result, a lens or the like incorporated thereafter is not wasted. The contents of the inspection include, for example, a wafer surface appearance inspection, a pattern inspection, a film thickness unevenness inspection, and a foreign matter inspection. Further, the inspection may be performed either before cutting or after cutting.

  Next, as shown in FIG. 2B, the chip of the image sensor 12 and the substrate 21 are electrically connected by wire bonding YB. On the other surface of the substrate 21, a plurality of external electrodes 21 b (for example, solder balls) used for connection to other control substrates (not shown) are formed. As a result, signal input / output can be performed between the imaging element 12 and another control board (not shown) connected to the board 21.

  Thereafter, as shown in FIG. 3C, the lens LB closest to the image plane constituting the imaging optical system is placed on and fixed to the optical member 14. The lens LB on the most image plane side is formed by connecting a plurality of lenses LB as shown in the figure, and is placed on the optical member 14 and fixed together. The connecting portion of the lens LB preferably has a shape like a thin plate-like arm in the optical axis direction, for example, having elasticity in the optical axis direction and having rigidity in the optical axis orthogonal direction. By doing so, it is preferable that the number of steps for incorporating the lens LB can be reduced and the cost can be reduced. However, the lens LB may be a single unit and may be incorporated individually. A positioning portion for positioning a lens group to be incorporated later is formed on the flange portion of the lens LB. In this example, the positioning portion corresponds to the wall surface portion LBs and the flat portion LBt.

  Thereafter, as shown in FIG. 4D, the resin material MD is injected into the surface of the substrate 21 on the image pickup device 12 side, and only the lens LB on the most image plane side of the image pickup optical system is exposed as shown. So that they are molded together.

  FIG. 6 is a schematic diagram illustrating a later stage of the manufacturing method of the imaging device according to the second embodiment.

  As shown in FIG. 5A, the most image of the lens group constituting the imaging optical system in a state where a plurality of imaging elements, optical members, and the lens on the most image plane side of the imaging optical system are integrally molded. A lens 31 and a light shielding member unit 32 positioned in front of the surface side lens LB are incorporated. As shown in the drawing, the lens 31 positioned in front of the lens LB closest to the image plane side is integrally formed by connecting a plurality of lenses 31 by flexible arm portions 31r to form a lens group integrated unit 30. It is what. Each lens 31 is positioned in the direction perpendicular to the optical axis by fitting with the wall surface portion LBs of the lens LB closest to the image plane while being connected to the flexible arm portion 31r. Further, it is abutted against the flat portion LBt and positioned in the optical axis direction and incorporated.

  Next, the light shielding member unit 32 is stacked and fixed so as to sandwich the lens 31. Similarly, the light shielding member unit 32 is also integrally formed with a plurality of units. Thereby, in the example shown in the drawing, an image pickup device of 8 units is integrally formed. In addition, the light shielding member unit 32 may be not only a resin molded product but also a metal member processed by etching or the like, or may be used by overlapping a plurality. Although it is preferable in terms of cost to be positioned and assembled while being connected to the flexible arm 31r as described above, the lens 31 and the light-shielding member unit 32 are a single unit and are incorporated individually. Such a configuration may be adopted.

  Thereafter, by cutting and separating at the broken line portion shown in FIG. 6A, the image pickup device 50 is separated into a single product as shown in FIG.

  In addition, although the example in which the infrared light cut coating is applied to the optical member 14 has been described, the present invention is not limited to this, and the lens 31 may be provided with an infrared light cut coating, or may be a separate infrared light cut. A filter may be incorporated.

  Further, the example using the optical member 14 formed entirely in a parallel plane has been described. However, an optical member in which a positioning portion is formed in a region where subject light does not pass and a region where subject light passes is formed in a parallel plane. It may be.

  The above is the manufacturing method of the imaging device according to the second embodiment.

  As described above, also in this example, by cutting the silicon wafer for each chip of the image pickup device and placing a plurality of image pickup device chips on the substrate, only non-defective chips are used in the subsequent steps. Therefore, it is possible to obtain a low-cost imaging device manufacturing method without wasting waste of a lens or the like incorporated thereafter. Further, in the step of incorporating the lens group, a plurality of lenses connected by flexible arm portions are incorporated at a time, and a light shielding member unit integrally formed with a plurality of units is formed at a time. By incorporating it, it is possible to reduce the number of man-hours and obtain a manufacturing method for obtaining a low-cost imaging device.

  In the above example, the optical members 14 are individually separated, but a plurality of optical members 14 are connected and integrated by arm portions, and a plurality of optical members 14 are formed at a time. The step of incorporating the optical member 14 is preferable. By doing so, it is possible to further reduce the number of man-hours and to obtain a manufacturing method for obtaining a lower cost imaging device.

(Third embodiment)
Hereinafter, a manufacturing method of the imaging device according to the third embodiment will be described.

  FIG. 7 is a schematic diagram illustrating an initial process stage of the manufacturing method of the imaging device according to the third embodiment. The left column of the figure shows an overall schematic state, and the right column is a cross-sectional view showing one of the schematic states.

  First, a plurality of image sensors 12 are formed on one surface of a silicon wafer 11 shown in FIG. This step is the same as in the first and second embodiments.

  Next, as shown in FIG. 2B, the lens LB closest to the image plane constituting the imaging optical system is placed and fixed in correspondence with each of the plurality of imaging elements 12 formed on the silicon wafer 11. Is done. The lens LB on the most image plane side is formed by connecting a plurality of lenses LB, and is placed on the silicon wafer 11 together and fixed by an adhesive 13. The connecting portion of the lens LB preferably has a shape like a thin plate-like arm in the optical axis direction, for example, having elasticity in the optical axis direction and having rigidity in the optical axis orthogonal direction. In addition, it is desirable that the connecting portion is formed at a position that does not interfere with wire bonding, which is a subsequent process, for example, an upper portion of a region where wire bonding is not performed. By doing so, it is preferable that the number of steps for incorporating the lens LB can be reduced and the cost can be reduced. However, the lens LB may be a single unit and may be incorporated individually. A positioning portion for positioning a lens group to be incorporated later is formed on the flange portion of the lens LB. In this example, the positioning portion corresponds to the wall surface portion LBs and the flat portion LBt. The lens LB is provided with an infrared light cut coating.

  Next, as shown in FIG. 3C, the silicon wafer 11 is cut for each image pickup element by a dicing blade 19. As a result, a chip of each image sensor 12 in which the light receiving pixel region is sealed by the lens LB is obtained.

  FIG. 8 is a schematic diagram illustrating a mid-stage process step of the method of manufacturing the imaging device according to the third embodiment.

  A plurality of chips of the individual image pickup elements 12 to which the lenses LB are bonded are placed on the substrate 21 as shown in FIG. The substrate 21 is formed with a plurality of wirings for the chips of the individual image pickup devices 12 so that the chips of the plurality of image pickup devices 12 can be placed thereon.

  In addition, only the chip | tip with which the chip | tip of each image pick-up element 12 mounted at this time was determined to be non-defective by the test | inspection is mounted. As a result, a lens or the like that is incorporated thereafter is not wasted. The contents of the inspection include, for example, a wafer surface appearance inspection, a pattern inspection, a film thickness unevenness inspection, and a foreign matter inspection. Further, the inspection may be performed either before cutting or after cutting.

  Next, as shown in FIG. 2B, the chip of the image sensor 12 and the substrate 21 are electrically connected by wire bonding YB. On the other surface of the substrate 21, a plurality of external electrodes 21 b (for example, solder balls) used for connection to other control substrates (not shown) are formed. As a result, signal input / output can be performed between the imaging element 12 and another control board (not shown) connected to the board 21.

  Thereafter, as shown in FIG. 3C, the resin material MD is injected into the surface of the substrate 21 on the image pickup device 12 side, and only the lens LB closest to the image plane of the image pickup optical system is exposed as shown. So that they are molded together.

  FIG. 9 is a schematic diagram illustrating a later stage of the manufacturing method of the imaging device according to the third embodiment.

  As shown in FIG. 6A, in a state where a plurality of image sensors and the lens closest to the image plane are integrally molded, the front side of the lens LB closest to the image plane in the lens group constituting the image pickup optical system. The lens 31 and the light-shielding member unit 32 which are located in are assembled. As shown in the drawing, the lens 31 positioned in front of the lens LB closest to the image plane side is integrally formed by connecting a plurality of lenses 31 by flexible arm portions 31r to form a lens group integrated unit 30. It is what. Each lens 31 is positioned in the direction perpendicular to the optical axis by fitting with the wall surface portion LBs of the lens LB closest to the image plane while being connected to the flexible arm portion 31r. Further, it is abutted against the flat portion LBt and positioned in the optical axis direction and incorporated.

  Next, the light shielding member unit 32 is stacked and fixed so as to sandwich the lens 31. Similarly, the light shielding member unit 32 is also integrally formed with a plurality of units. Thereby, in the example shown in the drawing, an image pickup device of 8 units is integrally formed. In addition, the light shielding member unit 32 may be not only a resin molded product but also a metal member processed by etching or the like, or may be used by overlapping a plurality. Although it is preferable in terms of cost to be positioned and assembled while being connected to the flexible arm 31r as described above, the lens 31 and the light-shielding member unit 32 are a single unit and are incorporated individually. Such a configuration may be adopted.

  Thereafter, by cutting and separating at the broken line portion shown in FIG. 6A, the image pickup device 50 is separated into a single product as shown in FIG.

  The example in which the infrared light cut coating is applied to the lens LB has been described. However, the present invention is not limited to this, and the lens 31 may be provided with an infrared light cut coating or a separate infrared light cut filter. May be incorporated.

  The above is the manufacturing method of the imaging device according to the third embodiment.

  As described above, also in this example, by cutting the silicon wafer for each chip of the image pickup device and placing a plurality of image pickup device chips on the substrate, only non-defective chips are used in the subsequent steps. Therefore, it is possible to obtain a low-cost imaging device manufacturing method without wasting waste of a lens or the like incorporated thereafter. Further, in the step of incorporating the lens group, a plurality of lenses connected by flexible arm portions are incorporated at a time, and a light shielding member unit integrally formed with a plurality of units is formed at a time. By incorporating it, it is possible to reduce the number of man-hours and obtain a manufacturing method for obtaining a low-cost imaging device.

  In the description of the above-described embodiment, an example in which an imaging device of 8 units is manufactured on one substrate 21 has been described for the purpose of illustration, but the present invention is not limited to this. In addition, although an example in which the lens to be incorporated after molding is described as one sheet, a plurality of lenses may be incorporated.

  FIG. 10 is a diagram illustrating an example of the lens group integrated unit 30 integrally connected by a flexible arm portion. FIG. 2A is a plan view, and FIG. 2B is a partially enlarged sectional view. The figure shows an example in which a lens portion and a flexible arm portion are integrally formed of the same material.

  As shown in FIGS. 2A and 2B, the lens group integrated unit 30 is formed in a frame 35 with a plurality of lenses 31 supported by flexible arm portions 31r. The arm portion 31r is formed in a thin, bent line shape and can be bent. By forming in this way, the lens 31 can be moved individually in the direction perpendicular to the optical axis (direction parallel to the paper surface) and the optical axis direction (front and back direction on the paper surface) from the state shown in FIG. It has become.

  Accordingly, when the lens 31 is collectively fitted and abutted on the positioning portion of the optical member 14 (see FIG. 3), or when the lens 31 is fitted and abutted on the positioning portion of the lens LB closest to the image plane. (Refer to FIGS. 6 and 9), the optical member 14 and the lens LB which have been molded can be moved in correspondence with a minute positional shift and can be incorporated without difficulty.

  The side surface portion 31s of the flange portion of the lens 31 shown in FIG. 5B is fitted to the wall surface 14s of the optical member 14, and the annular flat portion 31t is abutted against the recessed surface 14t, and is positioned and incorporated ( (See FIG. 3). In the case of the lens LB, the side surface portion 31s is fitted to the wall surface portion LBs, and the flat portion 31t is abutted against the flat portion LBt, and is positioned and incorporated (see FIGS. 6 and 9).

  In addition, although the example which shape | molds the 18 lenses 31 integrally was shown in this example, it is not restricted to this, It is preferable to shape | mold the same number as the number of units of the image pick-up element molded. Further, when assembling, a desired number of lenses 31 may be cut from the lens group integrated unit 30 and used.

  FIG. 11 is a diagram illustrating another example of the light shielding member unit 32 in which a plurality of units are integrally formed. FIG. 2A is a plan view, and FIG. 2B is a partially enlarged sectional view.

  As shown in FIGS. 2A and 2B, the light shielding member unit 32 is formed in a frame 36 with a plurality of light shielding portions 33 supported by flexible arm portions 33r. The arm portion 33r is formed in a thin bent line shape and can be bent. By forming in this way, the light-shielding part 33 is individually moved in the direction perpendicular to the optical axis (direction parallel to the paper surface) and the optical axis direction (front and back direction on the paper surface) from the state shown in FIG. It is possible.

  As a result, the lens 31 can be moved in accordance with a minute positional shift and can be incorporated without difficulty.

  FIG. 3C shows a state in which the light blocking member unit 32 is put on the lens group integrated unit 30.

  In addition, although the example which shape | molds the 18 light shielding parts 33 integrally was shown in this example, it is not restricted to this, It is preferable to shape | mold the same number as the number of units of the image pick-up element molded. Further, when assembling, a desired number of light shielding portions 33 may be cut from the light shielding member unit 32 by the arm portions 33r.

  FIG. 12 is a diagram showing another example of the lens group integrated unit 30 integrally connected by a flexible arm portion. This figure is an example in which the lens group integrated unit 30 is integrally formed of a lens portion and a light-shielding portion having different translucency. FIG. 4A is a plan view, and FIG. 4B is a partial cross-sectional view.

  A lens group integrated unit 30 shown in the figure is formed by insert molding a lens portion 31 on a thin metal plate.

  The lens group integrated unit 30 shown in FIGS. 9A and 9B is formed of a thin metal plate, a frame 38, a flexible arm portion 37r, and a circular portion 37e supported by the arm portion 37r. The lens 31 is insert-molded in 37e. The arm portion 37r is formed in a thin bent line shape and can be bent. By forming in this way, the lens 31 can be moved individually in the direction perpendicular to the optical axis (direction parallel to the paper surface) and the optical axis direction (front and back direction on the paper surface) from the state shown in FIG. It has become. Accordingly, similarly, the lens 31 can be moved in accordance with a minute positional deviation of the molded optical member 14 and the lens LB, and can be incorporated without difficulty.

  With such a configuration, the lens group integrated unit 30 in which the light shielding member unit is integrated can be obtained, and the number of assembling steps can be further reduced, and the cost can be reduced.

  Similarly, in this example, an example in which 18 lenses 31 are integrally formed by insert molding is shown, but the present invention is not limited to this.

  FIG. 13 is a diagram showing another example of the lens group integrated unit 30 integrally connected by a flexible arm portion. This figure is also an example in which the lens group integrated unit 30 is integrally formed of a lens portion and a light-shielding portion having different translucency. FIG. 4A is a plan view, and FIG. 4B is a partial cross-sectional view.

  The lens group integrated unit 30 shown in the figure is formed by two-color molding of a light-blocking portion 33 formed of a light-blocking resin material and a lens portion 31 formed of a light-transmitting resin material.

  The lens group integrated unit 30 shown in FIGS. 4A and 4B is made of a resin material having a light shielding property, and has two arm portions 39r and a light shielding portion 33 for each lens 31, and has a light transmitting property. A lens 31 and two arm portions 31r are formed of a resin material, and both are molded in two colors. In such a configuration, the two arm portions and the light shielding portion 33 are molded in advance with a first mold using a resin material having a light shielding property, and a molded product of the resin material having a light shielding property is placed in the second mold. Insert and mold the lens 31 and the two arm portions 31r with a light-transmitting resin material in addition to the two arm portions and the light-blocking portion 33 of the resin material having the light-blocking property with the second mold. Can be formed.

  Even in this case, the lens 31 can be individually moved from the state shown in FIG. 5A in the direction orthogonal to the optical axis (direction parallel to the paper surface) and in the optical axis direction (front and back direction of the paper surface). . Accordingly, similarly, the lens 31 can be moved in accordance with a minute positional deviation of the molded optical member 14 and the lens LB, and can be incorporated without difficulty.

  Even with such a configuration, the lens group integrated unit 30 in which the light shielding member unit is integrated can be obtained, and the number of assembling steps can be further reduced, and the cost can be reduced.

  Similarly, in the present example, the 18 lenses 31 are integrally molded in two colors, but the present invention is not limited to this.

  FIG. 14 is a cross-sectional view showing an imaging apparatus incorporating a two-color molded lens group integrated unit after the steps shown in FIGS.

  As shown in the figure, the light shielding portion 33a and the lens 31a are disposed on the lens LB in a state where the chips of the plurality of image pickup devices 12 and the lens LB positioned closest to the image plane of the image pickup optical system are molded on the substrate 21. The lens group integrated unit 30a constituted by is mounted and fixed. At this time, the outer peripheral surface of the light shielding portion 33a and the wall surface portion LBs of the lens LB are fitted, and the end surface of the light shielding portion 33a is abutted against the flat portion LBt, and is positioned and incorporated. Next, the diaphragm member 41 is assembled.

  Further, a lens group integrated unit 30b composed of the light shielding portion 33b and the lens 31b is placed and fixed. At this time, the outer peripheral surface of the lens 31b and the inner peripheral surface of the light shielding portion 33a are fitted, and the flat end surface of the lens 31b and the flat end surface of the lens 31a are abutted, positioned, and incorporated.

  Thereafter, the arm portion and the molded substrate 21 are cut at a position indicated by a broken line in the drawing to be separated into a single imaging device 50 and completed.

  In addition, after assembling the lens group integrated unit 30a and the lens group integrated unit 30b, the lens group integrated unit 30a may be placed on the molded lens LB. Alternatively, only one two-color molded lens group integrated unit may be incorporated.

  A portable terminal including the imaging device 50 manufactured as described above will be described.

  FIG. 15 is an external view of a mobile phone 100 that is an example of a mobile terminal including the imaging device 50.

  In the mobile phone 100 shown in the figure, an upper casing 71 as a case having display screens D1 and D2 and a lower casing 72 having an operation button 60 as an input unit are connected via a hinge 73. Yes. The imaging device 50 is built below the display screen D <b> 2 in the upper casing 71, and is arranged so that the imaging device 50 can capture light from the outer surface side of the upper casing 71.

  Note that the position of the imaging device may be disposed above or on the side of the display screen D2 in the upper casing 71. Of course, the mobile phone is not limited to a folding type.

  FIG. 16 is a control block diagram of the mobile phone 100.

  As shown in the figure, it is connected to the control unit 101 of the mobile phone 100 via the external electrode 21 b of the imaging device 50, and outputs an image signal such as a luminance signal or a color difference signal to the control unit 101.

  On the other hand, the mobile phone 100 controls each part in an integrated manner, and also executes a control part (CPU) 101 that executes a program corresponding to each process, an operation button 60 that is an input part for inputting a number and the like, Display screens D1 and D2 for displaying predetermined data and captured images, a wireless communication unit 80 for realizing various information communications with an external server, a system program for mobile phone 100, various processing programs, and a terminal A storage unit (ROM) 91 that stores necessary data such as an ID, and various processing programs and data executed by the control unit 101 or processing data, image data from the imaging device 50, and the like are temporarily stored. Or a temporary storage unit (RAM) 92 used as a work area.

  Further, the image signal input from the imaging device 50 is stored in the storage unit 91 by the control unit 101 of the mobile phone 100, or displayed on the display screens D1 and D2, and further via the wireless communication unit 80. It is transmitted to the outside as image information.

Claims (11)

In a method for manufacturing an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging device that photoelectrically converts subject light that is formed by a plurality of light receiving pixel portions and guided by the imaging optical system.
Forming a plurality of the imaging elements on one surface of a silicon wafer;
A step of sealing the light receiving pixel portion for each of the image sensors with an optical member disposed closest to the image sensor;
Cutting the silicon wafer for each imaging element;
A step of placing a plurality of the imaging devices that have been cut and determined to be non-defective products on a substrate;
Electrically connecting the substrate and the plurality of imaging elements;
Incorporating the imaging optical system;
And a step of cutting and separating the substrate for each of the image pickup devices. In a method for manufacturing an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging device that photoelectrically converts subject light that is formed by a plurality of light receiving pixel portions and guided by the imaging optical system.
Forming a plurality of the imaging elements on one surface of a silicon wafer;
A step of sealing the light-receiving pixel portion for each of the imaging elements with an optical member in which at least a region through which the subject light passes is formed in a parallel plane;
Cutting the silicon wafer for each imaging element;
A step of placing a plurality of the imaging devices that have been cut and determined to be non-defective products on a substrate;
Electrically connecting the substrate and the plurality of imaging elements;
Molding the plurality of image pickup elements sealed with the substrate and the optical member integrally;
Incorporating the imaging optical system;
And a step of cutting and separating the molded substrate for each of the image pickup devices. 2. The optical device according to claim 1, wherein the optical member in the step of sealing the light receiving pixel portion for each of the image pickup elements is incorporated with a positioning portion formed in a region through which the subject light does not pass. The manufacturing method of the imaging device of a 2nd term | claim. 4. The method according to claim 1, wherein the step of sealing the light-receiving pixel portion for each of the image pickup elements incorporates a plurality of the optical members connected by arm portions. 5. The manufacturing method of the imaging device of any one. In a method for manufacturing an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging device that photoelectrically converts subject light that is formed by a plurality of light receiving pixel portions and guided by the imaging optical system.
Forming a plurality of the imaging elements on one surface of a silicon wafer;
A step of sealing the light receiving pixel portion for each of the image sensors with an optical member formed on a parallel plate; a step of cutting the silicon wafer for each of the image sensors;
A step of placing a plurality of the imaging devices that have been cut and determined to be non-defective products on a substrate;
Electrically connecting the substrate and the plurality of imaging elements;
Incorporating the lens closest to the image plane of the imaging optical system on the optical member;
Molding the lens closest to the image plane of the imaging optical system incorporated with the substrate, the plurality of imaging elements and the optical member; and
Incorporating other lens groups of the imaging optical system;
And a step of cutting and separating the molded substrate for each of the image pickup devices. In a method for manufacturing an imaging apparatus, comprising: an imaging optical system that guides subject light; and an imaging device that photoelectrically converts subject light that is formed by a plurality of light receiving pixel portions and guided by the imaging optical system.
Forming a plurality of the imaging elements on one surface of a silicon wafer;
A step of sealing the light receiving pixel portion for each of the image pickup devices with a lens closest to the image plane of the image pickup optical system;
Cutting the silicon wafer for each imaging element;
A step of placing a plurality of the imaging devices that have been cut and determined to be non-defective products on a substrate;
Electrically connecting the substrate and the plurality of imaging elements;
Molding the lens closest to the image plane of the imaging optical system incorporated with the substrate and the plurality of imaging elements; and
Incorporating other lens groups of the imaging optical system;
And a step of cutting and separating the molded substrate for each of the image pickup devices. The most image-side lens of the imaging optical system incorporated in the molding step includes a plurality of imaging-side lenses of the imaging optical system connected by arm portions. The manufacturing method of the imaging device according to claim 5 or 6. 8. The step of assembling a lens group after the molding step incorporates a plurality of lens groups connected by flexible arms. The manufacturing method of the imaging device of any one of Claims 1. 9. The method of manufacturing an imaging apparatus according to claim 8, wherein the plurality of lens groups are formed by integrally forming a lens portion and a light-shielding portion having different translucency. An image pickup apparatus manufactured by the method for manufacturing an image pickup apparatus according to any one of claims 1 to 9. A portable terminal comprising the imaging device according to claim 10.