JP2006294659A - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

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Publication number
JP2006294659A
JP2006294659A JP2005109284A JP2005109284A JP2006294659A JP 2006294659 A JP2006294659 A JP 2006294659A JP 2005109284 A JP2005109284 A JP 2005109284A JP 2005109284 A JP2005109284 A JP 2005109284A JP 2006294659 A JP2006294659 A JP 2006294659A
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semiconductor device
holding
base portion
holding portion
translucent lid
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Katsuyoshi Matsumoto
克良 松本
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

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  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To allow a light transmitting lid body to be exchanged in a semiconductor device for mounting an optical semiconductor element in a package, having a conductor for making connection to an external circuit and the light transmitting lid body for sealing an opening, and also to reduce costs. <P>SOLUTION: The package 3 comprises a substrate 7 having a die attachment surface 3a for mounting the optical semiconductor element, such as a photosensor 1; and a holder 8 made of a shape memory resin for holding the light transmitting lid body 5 at the upper portion of the die attachment surface 3a stuck to the periphery of the substrate 7, thus easily mounting or exchanging the light transmitting lid body 5 by utilizing the shape memory properties of the holder 8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、光半導体素子をパッケージ内に搭載した半導体装置およびその製造方法に関し、特にパッケージの開口部を封止する光透過性蓋体を交換可能に搭載する技術に関するものである。   The present invention relates to a semiconductor device in which an optical semiconductor element is mounted in a package and a method for manufacturing the same, and more particularly to a technique for mounting a light-transmitting lid that seals an opening of a package in a replaceable manner.

従来、光半導体素子は一般に、素子への光の経路を確保し且つ外部から保護するために、プラスチックやセラミックで形成したパッケージ内に実装し、パッケージの開口部をガラス板などの光透過性蓋体で封止している。   Conventionally, an optical semiconductor element is generally mounted in a package formed of plastic or ceramic in order to secure a light path to the element and protect it from the outside, and the opening of the package is a light-transmitting lid such as a glass plate. Sealed with body.

この種の半導体装置の一例として、ＤＩＰタイプの光センサパッケージを図１６に示す。（ａ）は断面図、（ｂ）は上面図である。この光センサパッケージは、ＣＣＤやＣＭＯＳセンサなどの光センサ１を、外部回路と接続するための導体２を配した凹状のパッケージ３内に搭載し、前記導体２にボンディングワイヤ４で接続しており、パッケージ３の開口端はパッケージ３とほぼ同じ大きさのガラス板などの透光性蓋体５によりエポキシ系樹脂などの接着剤６を用いて封止している。   As an example of this type of semiconductor device, a DIP type optical sensor package is shown in FIG. (A) is sectional drawing, (b) is a top view. In this optical sensor package, an optical sensor 1 such as a CCD or CMOS sensor is mounted in a concave package 3 provided with a conductor 2 for connecting to an external circuit, and connected to the conductor 2 by a bonding wire 4. The open end of the package 3 is sealed with an adhesive 6 such as an epoxy resin by a translucent cover 5 such as a glass plate having the same size as the package 3.

しかしこのような光センサパッケージでは、パッケージ３に一旦封着した透光性蓋体５を取り外すことは困難であり、コストアップにつながってしまう。たとえば組立工程中に透光性蓋体５にキズや汚れ等が発生した場合も交換できず、光センサ１が良品であっても光センサパッケージ全体が不良品となってしまい、逆に透光性蓋体５での封着後の検査工程で光センサ１の不良が発見された場合に、透光性蓋体５が良品であっても光センサパッケージ全体が不良品となってしまう。また透光性蓋体５をたとえばガラス板からローパスフィルターやレンズなどの光学部品に交換することはできない。そこで透光性蓋体５を取り外し可能にすべく、弾性体を介在させて透光性蓋体５を嵌入することが提案されている（例えば特許文献１参照）。
特開２００１−８５６５５公報 However, in such an optical sensor package, it is difficult to remove the translucent lid 5 once sealed on the package 3, resulting in an increase in cost. For example, even if the translucent cover 5 is scratched or soiled during the assembly process, it cannot be replaced, and even if the optical sensor 1 is a good product, the entire optical sensor package becomes a defective product. When a defect of the optical sensor 1 is found in the inspection process after sealing with the conductive lid 5, even if the transparent lid 5 is a good product, the entire optical sensor package becomes a defective product. Further, the translucent lid 5 cannot be exchanged from a glass plate to an optical component such as a low-pass filter or a lens. Then, in order to make the translucent lid 5 removable, it has been proposed to insert the translucent lid 5 through an elastic body (see, for example, Patent Document 1).
JP 2001-85655 A

しかし弾性体を介在させる従来構造では、透過性蓋体の取付時に弾性体との間の摩擦や内圧によって取付精度を保つことは困難であり、製造が容易ではない。
本発明の目的は、上記問題に鑑み、透光性蓋体が交換可能であり、コストを低減できるとともに、透光性蓋体の取付時に容易に取付精度を確保できる半導体装置を提供することにある。 However, in the conventional structure in which the elastic body is interposed, it is difficult to maintain the mounting accuracy due to friction and internal pressure with the elastic body when mounting the permeable lid, and the manufacture is not easy.
In view of the above problems, an object of the present invention is to provide a semiconductor device in which a translucent lid can be replaced, the cost can be reduced, and mounting accuracy can be easily secured when the translucent lid is attached. is there.

上記課題を解決するために、本発明の第１の半導体装置は、外部回路と接続するための導体と開口部を封止する透光性蓋体とを備えたパッケージ内に光半導体素子を搭載した半導体装置において、前記パッケージが、光半導体素子搭載面を有した基台部と、前記基台部の周縁部に固着され前記光半導体素子搭載面の上方に透光性蓋体を保持する形状記憶樹脂製の保持部とで構成されたことを特徴とする。これによれば、保持部の形状記憶性を利用して透光性蓋体を容易に取り付け、また交換することが可能である。   In order to solve the above-described problems, an optical semiconductor element is mounted in a package including a conductor for connecting to an external circuit and a translucent lid for sealing an opening. In the above semiconductor device, the package has a base portion having an optical semiconductor element mounting surface, and a shape that is fixed to a peripheral portion of the base portion and holds a translucent lid above the optical semiconductor element mounting surface And a holding portion made of a memory resin. According to this, it is possible to easily attach or replace the translucent lid using the shape memory property of the holding portion.

保持部の内周に透光性蓋体の周縁部が嵌入する凹部が形成されるか、あるいは、保持部と基台部とにわたる内周に透光性蓋体の周縁部が嵌入する凹部が形成されるのが好ましい。凹部によって透光性蓋体の位置決めが容易になされるからである。保持部と基台部とを接続するための接着剤塗布位置から凹部を離しておけば、接着剤塗布位置からはみ出した接着剤が透光性蓋体に接触して透光性蓋体が接着される不良を防ぐことができる。また後者の場合は、透光性蓋体を基台部上に搭載した後で基台部上に保持部を固着することも可能であり、製造が容易になる。   A recess in which the peripheral edge of the translucent lid is fitted in the inner periphery of the holding part, or a recess in which the peripheral edge of the translucent lid is fitted in the inner circumference extending between the holding part and the base part Preferably it is formed. This is because the translucent lid can be easily positioned by the recess. If the concave part is separated from the adhesive application position for connecting the holding part and the base part, the adhesive protruding from the adhesive application position contacts the translucent lid and the translucent lid adheres. Can be prevented. In the latter case, it is also possible to fix the holding part on the base part after the translucent lid is mounted on the base part, which facilitates manufacture.

本発明の第２の半導体装置は、外部回路と接続するための導体と開口部を封止する透光性蓋体とを備えたパッケージ内に光半導体素子を搭載した半導体装置において、前記パッケージが、光半導体素子搭載面を有した基台部と、前記基台部の周縁部に配設され前記光半導体素子搭載面の上方に透光性蓋体を保持する保持部と、前記保持部を基台部上に脱着自在に支持する形状記憶樹脂製の支持部材とで構成されたことを特徴とする。これによれば、支持部材の形状記憶性を利用して保持部ごと、場合によっては透光性蓋体が固着された保持部ごと取り外し、別途の支持部材、保持部、透光性蓋体と交換することが可能である。   A second semiconductor device of the present invention is a semiconductor device in which an optical semiconductor element is mounted in a package provided with a conductor for connecting to an external circuit and a translucent lid that seals an opening. A base portion having an optical semiconductor element mounting surface; a holding portion that is disposed at a peripheral portion of the base portion and holds a translucent lid above the optical semiconductor element mounting surface; and the holding portion. And a support member made of a shape memory resin that is detachably supported on the base portion. According to this, using the shape memory property of the support member, each holding portion, and in some cases, the holding portion to which the translucent lid is fixed are removed, and the separate support member, the holding portion, the translucent lid, and It is possible to exchange.

支持部材は、保持部の下面に接続され、基台部に形成された貫通穴あるいは外周溝部に嵌め込まれたものとすることができる。支持部材は、基台部の下面に係止する爪部を有しているのが好ましい。また基台部の下面に、支持部材の爪部を収容する凹部が形成されているのが好ましい。爪部を凹部に収容することによって、支持部材によるパッケージ高さの増加を回避できるからである。   The support member may be connected to the lower surface of the holding portion and fitted into a through hole or an outer peripheral groove formed in the base portion. It is preferable that the supporting member has a claw portion that is locked to the lower surface of the base portion. Moreover, it is preferable that the recessed part which accommodates the nail | claw part of a support member is formed in the lower surface of a base part. This is because by accommodating the claw portion in the recess, an increase in the package height due to the support member can be avoided.

第１または第２の半導体装置において、保持部は、基台部の周縁部にその全周にわたって配置されていてもよいし、基台部の周縁部にその周方向に適当間隔をおいて配置されていてもよい。   In the first or second semiconductor device, the holding portion may be disposed on the entire periphery of the base portion, or may be disposed on the peripheral portion of the base portion at an appropriate interval in the circumferential direction. May be.

基台部に保持部を位置決めする凹部が形成されるか、あるいは保持部と基台部とに互いに嵌め合って位置決めする凹部と凸部とが形成されるのが好ましい。基台部に対して保持部の位置決めが容易になされるからである。また後者の場合は、保持部と基台部とにわたる凹部で透過性蓋体を保持する際も、保持部と基台部とを接続するための接着剤塗布位置を保持用の凹部から離すことが可能となり、接着剤塗布位置からはみ出した接着剤が透光性蓋体に接触して透光性蓋体が接着される不良を防ぐことができる。   It is preferable that a concave portion for positioning the holding portion is formed on the base portion, or a concave portion and a convex portion for fitting and positioning to the holding portion and the base portion are formed. This is because the holding portion can be easily positioned with respect to the base portion. In the latter case, the adhesive application position for connecting the holding part and the base part should be separated from the holding concave part even when the transparent lid is held by the concave part extending between the holding part and the base part. Therefore, it is possible to prevent the adhesive that protrudes from the adhesive application position from coming into contact with the light-transmitting lid and bonding the light-transmitting lid.

透光性蓋体は、ガラス板または光学フィルタまたは光学レンズであってよい。
第１の半導体装置を製造する方法は、前記パッケージを、光半導体素子搭載面を有した基台部と前記光半導体素子搭載面の上方に透光性蓋体を保持するための形状記憶樹脂製の保持部とに分割形成する工程と、前記基台部の周縁部に前記保持部を配設し固着する工程と、前記保持部を変形させ、その内周に透光性蓋体を嵌め込み、形状復元させる工程とにより形成することを特徴とする。 The translucent lid may be a glass plate or an optical filter or an optical lens.
A method for manufacturing a first semiconductor device includes: a package made of a shape memory resin for holding a base having an optical semiconductor element mounting surface and a translucent lid above the optical semiconductor element mounting surface; A step of dividing and forming the holding portion, a step of disposing and fixing the holding portion on a peripheral portion of the base portion, deforming the holding portion, and fitting a translucent lid on the inner periphery thereof, It is formed by the process of shape restoration.

透光性蓋体を嵌め込む際に、保持部あるいは基台部上端の内周に予め形成された凹部により位置決めするのが好都合である。
第２の半導体装置を製造する方法は、前記パッケージを、光半導体素子搭載面を有した基台部と透光性蓋体を保持するための保持部とに分割形成するとともに、前記基台部に一端が保持部に対向する貫通穴あるいは溝部を形成する工程と、前記保持部の下面に形状記憶樹脂製の支持部材を接続する工程と、前記保持部に接続した支持部材を変形させ、前記基台部の貫通穴あるいは溝部に嵌め込み、形状復元させることにより、前記保持部を基台部上に支持部材により支持固定する工程と、前記保持部に前記透光性蓋体を固着する工程とにより形成することを特徴とする。 When the translucent lid is fitted, it is convenient to position it by a recess formed in advance on the inner periphery of the upper end of the holding part or the base part.
According to a second method of manufacturing a semiconductor device, the package is divided into a base portion having an optical semiconductor element mounting surface and a holding portion for holding a light-transmitting lid, and the base portion A step of forming a through hole or a groove having one end facing the holding portion, a step of connecting a support member made of shape memory resin to the lower surface of the holding portion, and deforming the support member connected to the holding portion, A step of fitting and fixing the holding portion on the base portion by a support member by fitting in a through hole or a groove portion of the base portion, and a step of fixing the translucent lid to the holding portion; It is formed by.

第１または第２の半導体装置を製造する方法では、基台部上に保持部を配設する際に、保持部の下端が嵌入するように基台部に予め形成された凹部により位置決めするのが好都合である。また、基台部上に保持部を配設する際に、基台部と保持部とに互いに嵌め合うように予め形成された凹部と凸部とにより位置決めするのが好都合である。   In the method for manufacturing the first or second semiconductor device, when the holding portion is arranged on the base portion, the positioning is performed by the recess formed in advance in the base portion so that the lower end of the holding portion is fitted. Is convenient. In addition, when the holding part is disposed on the base part, it is convenient to position the base part and the holding part with a concave part and a convex part that are formed in advance so as to fit each other.

第１の半導体装置を製造する方法では、保持部の形状記憶性を利用して透光性蓋体を交換することもできる。第２の半導体装置を製造する方法では、所望により支持部材の形状記憶性を利用して保持部と支持部材との一体化物を交換することもできる。   In the method for manufacturing the first semiconductor device, the translucent lid can be replaced using the shape memory property of the holding portion. In the method for manufacturing the second semiconductor device, an integrated product of the holding portion and the support member can be exchanged using the shape memory of the support member as desired.

本発明の第１の半導体装置は、透光性蓋体を保持する保持部を形状記憶樹脂により形成したので、保持部の形状記憶性を利用して透光性蓋体を容易に取り付け、また交換することができる。   In the first semiconductor device of the present invention, since the holding portion for holding the translucent lid is formed of the shape memory resin, the translucent lid is easily attached using the shape memory of the holding portion. Can be exchanged.

また第２の半導体装置は、透光性蓋体を保持する保持部を形状記憶樹脂製の支持部材によって基台部に支持したので、支持部材の形状記憶性を利用して保持部ごと、場合によっては透光性蓋体が固着された保持部ごと取り外し、別途の支持部材、保持部、透光性蓋体を取り付けることができる。   Moreover, since the 2nd semiconductor device supported the holding | maintenance part holding a translucent cover body by the base part by the support member made from shape memory resin, the case where every holding | maintenance part utilized the shape memory property of a support member, Depending on the case, the holding part to which the translucent lid is fixed can be removed and a separate support member, holding part, and translucent lid can be attached.

よって、両半導体装置とも、一部の構成物のみが不良の場合に残りの良品構成物を再利用することが可能になり、コストを低減することが可能となる。   Therefore, in both semiconductor devices, when only some of the components are defective, the remaining non-defective components can be reused, and the cost can be reduced.

以下、本発明の実施の形態を図面を参照しながら説明する。
図１（ａ）は本発明の第１の実施形態の半導体装置の断面図、図１（ｂ）は同半導体装置の一部切り欠き上面図である。ここでは半導体装置の一例として、先に図１６を用いて説明したのと同様のＤＩＰタイプの光センサパッケージを示している。 Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1A is a cross-sectional view of the semiconductor device according to the first embodiment of the present invention, and FIG. 1B is a partially cut-out top view of the semiconductor device. Here, as an example of the semiconductor device, a DIP type optical sensor package similar to that described above with reference to FIG. 16 is shown.

半導体装置は、ＣＣＤやＣＭＯＳセンサなどの光センサ１を、外部回路と接続するための導体２を配した筐体としてのパッケージ３内に搭載し、前記導体２にボンディングワイヤ４で接続しており、パッケージ３の開口端はパッケージ３とほぼ同じ大きさの透光性蓋体５により封止している。   In the semiconductor device, an optical sensor 1 such as a CCD or CMOS sensor is mounted in a package 3 as a housing provided with a conductor 2 for connection to an external circuit, and is connected to the conductor 2 by a bonding wire 4. The open end of the package 3 is sealed with a translucent lid 5 having the same size as the package 3.

パッケージ３は、光センサ１を搭載するダイアタッチ面３ａをその背面に対して精密な平行度で形成し、複数の導体２をそれぞれの内端部がダイアタッチ面３ａの周囲に露出するように埋め込んだ基台部７と、ダイアタッチ面３ａの上方に間隙をおいて透光性蓋体５を保持するように基台部７の周縁部に固着した四角枠状の保持部８とを有している。透光性蓋体５には、用途に応じて様々なガラス、あるいはローパスフィルターなどの光学フィルタや光学レンズなどを選択する。   In the package 3, the die attach surface 3a on which the optical sensor 1 is mounted is formed with a precise parallelism with respect to the back surface, and the plurality of conductors 2 are exposed to the periphery of the die attach surface 3a. An embedded base portion 7 and a rectangular frame-shaped holding portion 8 fixed to the peripheral portion of the base portion 7 so as to hold the translucent lid 5 with a gap above the die attach surface 3a are provided. is doing. For the translucent lid 5, various glasses, optical filters such as a low-pass filter, optical lenses, and the like are selected according to the application.

この半導体装置が従来のものと相違するのは、パッケージ３の保持部８のほぼ全体を形状記憶樹脂で形成し、その内面に周方向に沿って形成した凹部９に透光性蓋体５の周縁部を嵌入させて保持している点である。   This semiconductor device is different from the conventional one in that almost the entire holding portion 8 of the package 3 is formed of a shape memory resin, and a translucent lid 5 is formed in a concave portion 9 formed in the inner surface along the circumferential direction. This is a point where the peripheral edge is inserted and held.

この半導体装置の製造方法について説明する。
図２（ａ）に示すように、基台部７を導体２を配して形成しておく。基台部７の材料には積層セラミックやエポキシ系樹脂などを用い、導体２には銅や４２アロイなどの鉄系の合金などを用いる。図２（ｂ）に示すように、四角枠状の保持部８をポリエステルやポリウレタンなどの形状記憶樹脂にて別途に形成し、基台部７の周縁部上の所定位置に接着剤６により接着固定する。 A method for manufacturing this semiconductor device will be described.
As shown in FIG. 2A, the base portion 7 is formed with the conductor 2 disposed thereon. The base part 7 is made of a multilayer ceramic or epoxy resin, and the conductor 2 is made of an iron-based alloy such as copper or 42 alloy. As shown in FIG. 2 (b), a rectangular frame-shaped holding portion 8 is separately formed of a shape memory resin such as polyester or polyurethane, and is adhered to a predetermined position on the peripheral portion of the base portion 7 with an adhesive 6. Fix it.

図２（ｃ）に示すように、基台部７のダイアタッチ面３ａに光センサ１を搭載し、光センサ１と導体２とを金線などのボンディングワイヤ４で接続する。
図２（ｄ）に示すように、形状記憶樹脂製の保持部８に所定温度を付加したうえで、その凹部９を開くように変形させ、開いた凹部９に透光性蓋体５を嵌め込む。 As shown in FIG. 2C, the optical sensor 1 is mounted on the die attach surface 3a of the base portion 7, and the optical sensor 1 and the conductor 2 are connected by a bonding wire 4 such as a gold wire.
As shown in FIG. 2 (d), a predetermined temperature is applied to the holding portion 8 made of shape memory resin, and then the concave portion 9 is deformed so as to be opened, and the translucent lid 5 is fitted into the opened concave portion 9. Include.

図２（ｅ）に示すように保持部８を元の温度に戻して形状復元させることにより、半導体装置の完成品を得る。
以上の製造方法からもわかるように、この半導体装置は、保持部８の形状記憶性を利用して接着剤を用いることなく透光性蓋体５を保持するものであり、透光性蓋体５の取り付け、取り外しとも容易である。したがって、一部の構成部品のみが不良の場合は残りの良品部品を再利用することが可能である。たとえば組立工程中に透光性蓋体５にキズや汚れ等が発生した場合には、図３（ａ）〜（ｅ）に示す手順で透光性蓋体５´に交換すればよいし、透光性蓋体５での封着後の検査工程で光センサ１の不良が発見された場合には、透光性蓋体５を取り外して再利用すればよい。よって、コストを低減することが可能である。透光性蓋体５を他の種類の透光性蓋体と交換することも可能である。 As shown in FIG. 2E, the holding unit 8 is returned to the original temperature to restore the shape, thereby obtaining a completed semiconductor device.
As can be seen from the above manufacturing method, this semiconductor device uses the shape memory property of the holding portion 8 to hold the translucent lid 5 without using an adhesive. 5 is easy to attach and remove. Therefore, when only some of the components are defective, the remaining non-defective components can be reused. For example, if scratches or dirt are generated on the translucent lid 5 during the assembly process, the translucent lid 5 ′ may be replaced by the procedure shown in FIGS. 3 (a) to (e). When a defect of the optical sensor 1 is found in the inspection process after sealing with the translucent lid 5, the translucent lid 5 may be removed and reused. Thus, cost can be reduced. It is also possible to replace the translucent lid 5 with another type of translucent lid.

さらに、透光性蓋体５は保持部８の凹部９で位置決めがなされるので、容易に位置精度よく取り付けできる。凹部９を図示したように下端から離しておけば、保持部８を基台部７上に接着する際にはみ出す接着剤が透光性蓋体５に接触することはなく、透光性蓋体５が接着剤で汚れたり、接着固定されてしまう不良を防ぐことができる。   Furthermore, since the translucent lid 5 is positioned by the concave portion 9 of the holding portion 8, it can be easily attached with high positional accuracy. If the concave portion 9 is separated from the lower end as shown in the figure, the adhesive that protrudes when the holding portion 8 is bonded onto the base portion 7 does not come into contact with the translucent lid 5, and the translucent lid. It is possible to prevent defects in which 5 is soiled with an adhesive or is fixedly bonded.

図４（ａ）は本発明の第２の実施形態の半導体装置の断面図、図４（ｂ）は同半導体装置の一部切り欠き上面図である。
この第２の実施形態の半導体装置が第１の実施形態のものと相違するのは、基台部７をその周縁部に立ち上がった四角枠状の外枠部１１を持った凹状に形成し、外枠部１１の上に周方向に沿って適当間隔をおいて（ここでは外枠部１１上のコーナー部近傍に２箇所ずつ）四角柱状の保持部１２を接着固定し、外枠部１１の上端の平坦面１１ａと保持部１２の下端内周部に形成した段部１２ｂとで構成される凹部９に透光性蓋体５の周縁部を嵌入させて保持している点である。 FIG. 4A is a cross-sectional view of the semiconductor device according to the second embodiment of the present invention, and FIG. 4B is a partially cut-out top view of the semiconductor device.
The difference between the semiconductor device of the second embodiment and that of the first embodiment is that the base portion 7 is formed in a concave shape having a rectangular frame-like outer frame portion 11 rising at the peripheral edge portion thereof, A rectangular columnar holding portion 12 is bonded and fixed on the outer frame portion 11 at appropriate intervals along the circumferential direction (here, two in the vicinity of the corner portion on the outer frame portion 11). The point is that the peripheral edge of the translucent lid 5 is fitted and held in the concave portion 9 formed by the flat surface 11a at the upper end and the step portion 12b formed at the inner peripheral portion of the lower end of the holding portion 12.

この半導体装置を製造する際には、図５（ａ）に示すように、基台部７を外枠部１１と導体２とを配して形成しておく。次に、図５（ｂ）に示すように、基台部７のダイアタッチ面３ａに光センサ１を搭載し、光センサ１と導体２とを金線などのボンディングワイヤ４で接続する。次に、図５（ｃ）に示すように、外枠部１１の平坦面１１ａの内周縁部上に透光性蓋体５を搭載する。最後に、図５（ｄ）に示すように、外枠部１１の平坦面１１ａの外周縁部上に形状記憶樹脂により形成した保持部１２を接着剤６で接着固定する。   When manufacturing this semiconductor device, as shown in FIG. 5A, the base portion 7 is formed by arranging the outer frame portion 11 and the conductor 2. Next, as shown in FIG. 5B, the optical sensor 1 is mounted on the die attach surface 3a of the base portion 7, and the optical sensor 1 and the conductor 2 are connected by a bonding wire 4 such as a gold wire. Next, as shown in FIG. 5C, the translucent lid 5 is mounted on the inner peripheral edge portion of the flat surface 11 a of the outer frame portion 11. Finally, as shown in FIG. 5 (d), the holding portion 12 formed of a shape memory resin is bonded and fixed to the outer peripheral edge portion of the flat surface 11 a of the outer frame portion 11 with an adhesive 6.

以上の製造方法からもわかるように、この第２の実施形態の半導体装置は、第１の実施形態のものと比較して、形状記憶樹脂製の保持部１２を最後に接着固定するので、透光性蓋体５の搭載時に保持部１２を変形させるための温度付加は必要でなく、製造工程を簡単にすることが可能である。透光性蓋体５の取り外し、あるいは交換時には保持部１２を変形させることになる。   As can be seen from the above manufacturing method, the semiconductor device of the second embodiment is bonded and fixed last to the holding portion 12 made of shape memory resin, compared with that of the first embodiment. It is not necessary to add a temperature for deforming the holding portion 12 when the optical lid 5 is mounted, and the manufacturing process can be simplified. The holder 12 is deformed when the translucent lid 5 is removed or replaced.

図６（ａ）は本発明の第３の実施形態の半導体装置の断面図、図６（ｂ）は同半導体装置の一部切り欠き上面図である。
この第３の実施形態の半導体装置が第２の実施形態のものと相違するのは、外枠部１１の上端内周部に透光性蓋体５の外形に見合った段部１１ｂを形成し、この外枠部１１の段部１１ｂと保持部１２の段部１２ｂとで構成される凹部９に透光性蓋体５の周縁部を嵌入させて保持している点である。この第３の実施形態の光センサパッケージは、第２の実施形態のものと比較して、透光性蓋体５の搭載時に外枠部１１の段部１１ｂに嵌め込むことで位置決めできるので、取り付け精度の向上と製造工程を簡単にすることが可能となる。 FIG. 6A is a cross-sectional view of a semiconductor device according to a third embodiment of the present invention, and FIG. 6B is a partially cut-out top view of the semiconductor device.
The semiconductor device of the third embodiment is different from that of the second embodiment in that a step portion 11b corresponding to the outer shape of the translucent lid 5 is formed on the inner periphery of the upper end of the outer frame portion 11. In addition, the peripheral edge portion of the translucent lid 5 is fitted and held in the concave portion 9 constituted by the step portion 11 b of the outer frame portion 11 and the step portion 12 b of the holding portion 12. Since the optical sensor package of the third embodiment can be positioned by fitting into the step portion 11b of the outer frame portion 11 when the translucent lid 5 is mounted, as compared with that of the second embodiment, It is possible to improve the mounting accuracy and simplify the manufacturing process.

図７（ａ）は本発明の第４の実施形態の半導体装置の断面図、図７（ｂ）は同半導体装置の一部切り欠き上面図である。図８（ａ）は同半導体装置を構成しているパッケージの上面図、図８（ｂ）（ｃ）（ｄ）はそれぞれ、同パッケージの図８（ａ）におけるＡ−Ａ断面図、Ｂ−Ｂ断面図、Ｃ−Ｃ断面図である。図８において導体２は省略している。   FIG. 7A is a cross-sectional view of a semiconductor device according to a fourth embodiment of the present invention, and FIG. 7B is a partially cut-out top view of the semiconductor device. 8A is a top view of a package constituting the semiconductor device, FIGS. 8B, 8C, and 8D are cross-sectional views taken along line AA in FIG. It is B sectional drawing and CC sectional drawing. In FIG. 8, the conductor 2 is omitted.

この第４の実施形態の半導体装置が第３の実施形態のものと相違するのは、外枠部１１の上端外周部と保持部１２の下端外周部とに、互いに嵌め合うと凹部１１ｃと凸部１２ｃとが形成されている点である。   The difference between the semiconductor device of the fourth embodiment and that of the third embodiment is that the recesses 11c and the protrusions are formed when they are fitted to the outer periphery of the upper end of the outer frame part 11 and the outer periphery of the lower end of the holding part 12. This is a point where a portion 12c is formed.

この第４の実施形態の半導体装置を製造する際には、図９（ａ）に示すように基台部７に光センサ１を実装した後に、図９（ｂ）に示すように外枠部１１の上端内周部の段部１１ｂに透光性蓋体５の周縁部を嵌め込む。図９（ｃ）はその状態での別の断面を示す。この外枠部１１の上端外周部の凹部１１ｃに、図９（ｄ）に示すように、保持部１２の下端外周部の凸部１２ｃを嵌め込む。   When manufacturing the semiconductor device of the fourth embodiment, after mounting the optical sensor 1 on the base portion 7 as shown in FIG. 9A, the outer frame portion as shown in FIG. 9B. The peripheral edge of the translucent lid 5 is fitted into the step 11 b at the inner periphery of the upper end 11. FIG. 9C shows another cross section in this state. As shown in FIG. 9 (d), the convex portion 12 c at the lower end outer peripheral portion of the holding portion 12 is fitted into the concave portion 11 c at the upper outer peripheral portion of the outer frame portion 11.

このようにして、透光性蓋体５を外枠部１１上に位置決めし、また保持部１２を外枠部１１上に位置決めできるので、取り付け精度の向上と製造工程を簡単にすることが可能となる。保持部１２と外枠部１１との接着固定のためには凹部１１ｃ内の底面に接着剤６を配すればよいので、接着剤塗布位置を透過性蓋体５から遠ざけて、透光性蓋体５に接着剤６が付着する不良を防ぐことができる。これによっても取り付け精度の向上と製造工程の簡単化を図り、製造歩留まりの向上をも実現できる。   In this way, the translucent lid 5 can be positioned on the outer frame part 11 and the holding part 12 can be positioned on the outer frame part 11, so that it is possible to improve the mounting accuracy and simplify the manufacturing process. It becomes. In order to bond and fix the holding portion 12 and the outer frame portion 11, the adhesive 6 may be disposed on the bottom surface in the recess 11 c, so that the adhesive application position is kept away from the transmissive lid 5, and the translucent lid is provided. The defect that the adhesive 6 adheres to the body 5 can be prevented. This also improves the mounting accuracy, simplifies the manufacturing process, and improves the manufacturing yield.

図１０（ａ）は本発明の第５の実施形態の半導体装置の断面図、図１０（ｂ）は同半導体装置の一部切り欠き上面図、図１０（ｃ）は同半導体装置の下面図である。
この第５の実施形態の半導体装置が第１の実施形態のものと相違するのは、パッケージ３を、基台部７と、四角枠状の保持部８と、保持部８を基台部７上に脱着自在に支持する形状記憶樹脂製の複数の支持部材１０とで構成し、透光性蓋体５を保持部８の上端面に接着剤６で接着固定している点である。支持部材１０はほぼ柱状であって先端に爪部１０ａを有しており、保持部８の４隅の下面にそれぞれ接続され、基台部７に形成された貫通穴７ａに嵌め込まれ、爪部１０ａで基台部７の下面に係止している。 10A is a cross-sectional view of a semiconductor device according to a fifth embodiment of the present invention, FIG. 10B is a partially cutaway top view of the semiconductor device, and FIG. 10C is a bottom view of the semiconductor device. It is.
The semiconductor device of the fifth embodiment is different from that of the first embodiment in that the package 3 includes a base portion 7, a square frame-shaped holding portion 8, and the holding portion 8 includes the base portion 7. It is composed of a plurality of support members 10 made of shape memory resin that are detachably supported on the top, and the translucent lid 5 is bonded and fixed to the upper end surface of the holding portion 8 with an adhesive 6. The support member 10 has a substantially columnar shape and has claw portions 10a at the tip thereof. The support members 10 are respectively connected to the lower surfaces of the four corners of the holding portion 8 and are fitted into through holes 7a formed in the base portion 7. 10a is engaged with the lower surface of the base part 7.

この半導体装置を製造する際には、図１１（ａ）に示すように、積層セラミックやエポキシ系樹脂などで形成した保持部８の下面の所定位置に形状記憶樹脂よりなる支持部材１０を接着固定する。また図１１（ｂ）に示すように、基台部７を積層セラミックやエポキシ系樹脂などを用いて、導体２を配して、且つ所定位置に貫通穴７ａを設けて形成しておく。   When manufacturing this semiconductor device, as shown in FIG. 11A, a support member 10 made of a shape memory resin is bonded and fixed to a predetermined position on the lower surface of the holding portion 8 formed of laminated ceramic or epoxy resin. To do. Further, as shown in FIG. 11B, the base portion 7 is formed by using a laminated ceramic, epoxy resin, or the like, arranging the conductor 2 and providing a through hole 7a at a predetermined position.

そして、基台部７の貫通穴７ａに対し、支持部材１０を所定温度を付加し変形させてから、図１１（ｃ）に示すように嵌め込み、次いで支持部材１０を元の温度に戻して形状復元させることにより、図１１（ｄ）に示すように、保持部８を支持部材１０を介して基台部７上に支持固定して、パッケージ３の完成品を得る。   Then, the support member 10 is deformed by applying a predetermined temperature to the through hole 7a of the base portion 7, and then fitted as shown in FIG. 11 (c), and then the support member 10 is returned to the original temperature and shaped. By restoring, as shown in FIG. 11D, the holding portion 8 is supported and fixed on the base portion 7 via the support member 10, and the finished product of the package 3 is obtained.

その後に、図１１（ｅ）に示すように、パッケージ３内のダイアタッチ面３ａに光センサ１を実装し、図１１（ｆ）に示すように、パッケージ３の保持部８の上端面に接着剤６を用いて透光性蓋体５を接着固定して、半導体装置の完成品を得る。   After that, as shown in FIG. 11 (e), the optical sensor 1 is mounted on the die attach surface 3a in the package 3, and as shown in FIG. 11 (f), it adheres to the upper end surface of the holding portion 8 of the package 3. The translucent lid 5 is bonded and fixed using the agent 6 to obtain a finished product of the semiconductor device.

透光性蓋体５を交換するには、図１２（ａ）に示す半導体装置の支持部材１０を、図１２（ｂ）に示すように所定温度を付加し変形させた後に、図１２（ｃ）に示すように貫通穴７ａから抜き出すことにより、基台部７から、保持部８と透光性蓋体５と支持部材１０とを一体に分離する。その後に、図１１（ｄ）〜図１１（ｈ）に示すように、先に図１１を用いて説明した透光性蓋体５の取り付け時と同様にして、別途の保持部８´を別途の支持部材１０´を介して基台部７上に支持固定し、保持部８の上端面に接着剤６を用いて別途の透光性蓋体５´を接着固定する。   In order to replace the translucent lid 5, the support member 10 of the semiconductor device shown in FIG. 12A is deformed by applying a predetermined temperature as shown in FIG. ), The holding portion 8, the translucent lid 5 and the support member 10 are integrally separated from the base portion 7 by being extracted from the through hole 7a. Thereafter, as shown in FIGS. 11 (d) to 11 (h), a separate holding portion 8 ′ is separately provided in the same manner as when the translucent lid 5 described above with reference to FIG. 11 is attached. The support member 10 ′ is supported and fixed on the base portion 7, and a separate translucent lid 5 ′ is bonded and fixed to the upper end surface of the holding portion 8 using the adhesive 6.

図１３（ａ）は本発明の第６の実施形態の半導体装置の断面図、図１３（ｂ）は同半導体装置の一部切り欠き上面図、図１３（ｃ）は同半導体装置の下面図である。
この第６の実施形態の半導体装置が第５の実施形態のものと相違するのは、保持部８の下端外周部と対向する基台部７の上端外周部とに、互いに嵌め合うと凹部８ａと凸部７ｂとを形成して、保持部８を基台部７上に位置決めしている点である。この第６の実施形態の半導体装置によると、第５の実施形態のものと比較して、取り付け精度の向上と製造工程を簡単にすることが可能となる。 13A is a cross-sectional view of a semiconductor device according to a sixth embodiment of the present invention, FIG. 13B is a partially cutaway top view of the semiconductor device, and FIG. 13C is a bottom view of the semiconductor device. It is.
The difference between the semiconductor device of the sixth embodiment and that of the fifth embodiment is that the recess 8a is fitted into the lower end outer peripheral portion of the holding portion 8 and the upper end outer peripheral portion of the base portion 7 facing each other. And the convex part 7 b are formed, and the holding part 8 is positioned on the base part 7. According to the semiconductor device of the sixth embodiment, it is possible to improve the mounting accuracy and simplify the manufacturing process as compared with the semiconductor device of the fifth embodiment.

図１４（ａ）は本発明の第７の実施形態の半導体装置の断面図、図１４（ｂ）は同半導体装置の一部切り欠き上面図、図１４（ｃ）は同半導体装置の下面図である。
この第７の実施形態の半導体装置が第５の実施形態のものと相違するのは、基台部７に、貫通穴７ａに代えて溝部７ｃを外周面に形成し、この溝部７ｃに嵌め合う寸法の支持部材１０を保持部８の下端外周部に接合して、支持部材１０を介して保持部８を基台部７上に支持固定している点である。この第７の実施形態の半導体装置では、支持部材１０を基台部７の外側の溝部７ｃに通すだけでよいため、支持部材１０と基台部７との寸法精度は第５の実施形態のものほど厳密でなくてよく、製造歩留まりの向上がなされる。 14A is a cross-sectional view of a semiconductor device according to a seventh embodiment of the present invention, FIG. 14B is a partially cutaway top view of the semiconductor device, and FIG. 14C is a bottom view of the semiconductor device. It is.
The semiconductor device of the seventh embodiment is different from that of the fifth embodiment in that a groove portion 7c is formed on the outer peripheral surface in place of the through hole 7a in the base portion 7, and is fitted into the groove portion 7c. The size of the support member 10 is joined to the outer periphery of the lower end of the holding portion 8, and the holding portion 8 is supported and fixed on the base portion 7 via the support member 10. In the semiconductor device of the seventh embodiment, since the support member 10 only needs to be passed through the groove 7c outside the base portion 7, the dimensional accuracy between the support member 10 and the base portion 7 is the same as that of the fifth embodiment. It does not have to be as strict as a product, and the production yield is improved.

図１５（ａ）は本発明の第８の実施形態の半導体装置の断面図、図１５（ｂ）は同半導体装置の一部切り欠き上面図、図１５（ｃ）は同半導体装置の下面図である。
この第８の実施形態の半導体装置が第７の実施形態のものと相違するのは、基台部７に形成する溝部７ｄを外周面だけでなくそれに続く下面にも形成し、この溝部７ｄに嵌め合う寸法の支持部材１０を保持部８の下端外周部に接合して、支持部材１０を介して保持部８を基台部７上に支持固定している点である。この発明の第８の実施形態によると、第７の実施形態と比較して、支持部材１０の爪部１０ａも溝部７ｄに嵌め込むので、その分だけパッケージ３の高さを低減可能となる。 FIG. 15A is a sectional view of a semiconductor device according to an eighth embodiment of the present invention, FIG. 15B is a partially cutaway top view of the semiconductor device, and FIG. 15C is a bottom view of the semiconductor device. It is.
The semiconductor device of the eighth embodiment is different from that of the seventh embodiment in that a groove portion 7d formed in the base portion 7 is formed not only on the outer peripheral surface but also on a lower surface following the groove portion 7d. The support member 10 having a fitting size is joined to the outer peripheral portion of the lower end of the holding portion 8, and the holding portion 8 is supported and fixed on the base portion 7 via the support member 10. According to the eighth embodiment of the present invention, as compared with the seventh embodiment, the claw portion 10a of the support member 10 is also fitted into the groove portion 7d, so that the height of the package 3 can be reduced accordingly.

本発明の半導体装置は、光半導体素子を外部回路と接続するための導体を配したパッケージ内に密封したものであり、かかる半導体装置を搭載するデジタルスチルカメラ、携帯用カメラ、ムービー、車載用カメラ、監視カメラ、医療用カメラ、放送用カメラ、Ｗｅｂカメラ、テレビ電話用カメラ、ゲーム機用カメラ、光学マウス、ＤＶＤ・ＣＤドライブなどの光ピックアップなどに有用である。   The semiconductor device of the present invention is an optical semiconductor element sealed in a package provided with a conductor for connecting to an external circuit. A digital still camera, a portable camera, a movie, and an in-vehicle camera mounted with the semiconductor device. It is useful for surveillance cameras, medical cameras, broadcast cameras, Web cameras, video phone cameras, game machine cameras, optical mice, optical pickups such as DVD / CD drives, and the like.

本発明の第１の実施形態の半導体装置の構成図1 is a configuration diagram of a semiconductor device according to a first embodiment of the present invention. 図１の半導体装置の製造方法を説明する工程断面図Process sectional drawing explaining the manufacturing method of the semiconductor device of FIG. 図１の半導体装置の透光性蓋体の交換方法を説明する工程断面図Process sectional drawing explaining the replacement | exchange method of the translucent cover body of the semiconductor device of FIG. 本発明の第２の実施形態の半導体装置の構成図The block diagram of the semiconductor device of the 2nd Embodiment of this invention 図４の半導体装置の製造方法を説明する工程断面図Process sectional drawing explaining the manufacturing method of the semiconductor device of FIG. 本発明の第３の実施形態の半導体装置の構成図The block diagram of the semiconductor device of the 3rd Embodiment of this invention 本発明の第４の実施形態の半導体装置の構成図The block diagram of the semiconductor device of the 4th Embodiment of this invention 図７の半導体装置を構成するパッケージの構成図FIG. 7 is a configuration diagram of a package constituting the semiconductor device of FIG. 図７の半導体装置の製造方法を説明する工程断面図Process sectional drawing explaining the manufacturing method of the semiconductor device of FIG. 本発明の第５の実施形態の半導体装置の構成図The block diagram of the semiconductor device of the 5th Embodiment of this invention 図１０の半導体装置の製造方法を説明する工程断面図Process sectional drawing explaining the manufacturing method of the semiconductor device of FIG. 図１０の半導体装置の透光性蓋体の交換方法を説明する工程断面図Process sectional drawing explaining the replacement | exchange method of the translucent cover of the semiconductor device of FIG. 本発明の第６の実施形態の半導体装置の構成図The block diagram of the semiconductor device of the 6th Embodiment of this invention 本発明の第７の実施形態の半導体装置の構成図Configuration of a semiconductor device according to a seventh embodiment of the present invention 本発明の第８の実施形態の半導体装置の構成図Configuration diagram of a semiconductor device according to an eighth embodiment of the present invention 従来の半導体装置の構成図Configuration diagram of a conventional semiconductor device

符号の説明Explanation of symbols

１ 光センサ
２ 導体
３ パッケージ
3a ダイアタッチ面
４ ボンディングワイヤ
５ 透光性蓋体
６ 接着剤
７ 基台部
7a 貫通穴
7b 凸部
7c 溝部
7d 溝部
８ 保持部
8a 凹部
９ 凹部
10 支持部材
10a 爪部
11 外枠部
11a 平坦面
11b 段部
11c 凹部
12 保持部
12b 段部
12c 凸部 1 optical sensor 2 conductor 3 package
3a Die attach surface 4 Bonding wire 5 Translucent lid 6 Adhesive 7 Base
7a Through hole
7b Convex
7c Groove
7d Groove 8 Holding part
8a recess 9 recess
10 Support member
10a Claw
11 Outer frame
11a flat surface
11b Step
11c recess
12 Holding part
12b Step
12c Convex

Claims (19)

外部回路と接続するための導体と開口部を封止する透光性蓋体とを備えたパッケージ内に光半導体素子を搭載した半導体装置において、
前記パッケージは、光半導体素子搭載面を有した基台部と、前記基台部の周縁部に固着され前記光半導体素子搭載面の上方に透光性蓋体を保持する形状記憶樹脂製の保持部とで構成された半導体装置。 In a semiconductor device in which an optical semiconductor element is mounted in a package including a conductor for connecting to an external circuit and a translucent lid that seals an opening,
The package includes a base portion having an optical semiconductor element mounting surface, and a shape memory resin holding member that is fixed to a peripheral portion of the base portion and holds a translucent lid above the optical semiconductor element mounting surface. A semiconductor device composed of a part. 保持部の内周に透光性蓋体の周縁部が嵌入する凹部が形成された請求項１記載の半導体装置。   The semiconductor device according to claim 1, wherein a concave portion into which the peripheral edge portion of the translucent lid is fitted is formed on the inner periphery of the holding portion. 保持部と基台部とにわたる内周に透光性蓋体の周縁部が嵌入する凹部が形成された請求項１記載の半導体装置。   The semiconductor device according to claim 1, wherein a concave portion into which the peripheral edge portion of the translucent lid is fitted is formed on an inner circumference extending between the holding portion and the base portion. 外部回路と接続するための導体と開口部を封止する透光性蓋体とを備えたパッケージ内に光半導体素子を搭載した半導体装置において、
前記パッケージは、光半導体素子搭載面を有した基台部と、前記基台部の周縁部に配設され前記光半導体素子搭載面の上方に透光性蓋体を保持する保持部と、前記保持部を基台部上に脱着自在に支持する形状記憶樹脂製の支持部材とで構成された半導体装置。 In a semiconductor device in which an optical semiconductor element is mounted in a package including a conductor for connecting to an external circuit and a translucent lid that seals an opening,
The package includes a base portion having an optical semiconductor element mounting surface, a holding portion that is disposed on a peripheral portion of the base portion and holds a translucent lid above the optical semiconductor element mounting surface, A semiconductor device comprising a support member made of a shape memory resin that detachably supports a holding portion on a base portion. 支持部材は、保持部の下面に接続され、基台部に形成された貫通穴あるいは溝部に嵌め込まれている請求項４記載の半導体装置。   The semiconductor device according to claim 4, wherein the support member is connected to a lower surface of the holding portion and is fitted into a through hole or a groove portion formed in the base portion. 支持部材は、基台部の下面に係止する爪部を有している請求項５記載の半導体装置。   The semiconductor device according to claim 5, wherein the support member has a claw portion that engages with a lower surface of the base portion. 基台部の下面に、支持部材の爪部を収容する凹部が形成されている請求項６記載の半導体装置。   The semiconductor device according to claim 6, wherein a recess for accommodating the claw portion of the support member is formed on the lower surface of the base portion. 保持部は、基台部の周縁部にその全周にわたって配置されている請求項１記載の半導体装置。   The semiconductor device according to claim 1, wherein the holding portion is disposed on the entire periphery of the peripheral portion of the base portion. 保持部は、基台部の周縁部にその周方向に適当間隔をおいて配置されている請求項１または請求項４のいずれかに記載の半導体装置。   5. The semiconductor device according to claim 1, wherein the holding part is disposed at an appropriate interval in a circumferential direction of the peripheral part of the base part. 6. 基台部に保持部を位置決めする凹部が形成された請求項１または請求項４のいずれかに記載の半導体装置。   The semiconductor device according to claim 1, wherein a recess for positioning the holding portion is formed on the base portion. 保持部と基台部とに互いに嵌め合って位置決めする凹部と凸部とが形成された請求項１または請求項４のいずれかに記載の半導体装置。   The semiconductor device according to claim 1, wherein a concave portion and a convex portion that are fitted and positioned to each other are formed on the holding portion and the base portion. 透光性蓋体は、ガラス板または光学フィルタまたは光学レンズである請求項１または請求項４のいずれかに記載の半導体装置。   The semiconductor device according to claim 1, wherein the translucent lid is a glass plate, an optical filter, or an optical lens. 外部回路と接続するための導体と開口部を封止する透光性蓋体とを備えたパッケージ内に光半導体素子を搭載した半導体装置の製造方法であって、
前記パッケージを、光半導体素子搭載面を有した基台部と前記光半導体素子搭載面の上方に透光性蓋体を保持するための形状記憶樹脂製の保持部とに分割形成する工程と、前記基台部の周縁部に前記保持部を配設し固着する工程と、前記保持部を変形させ、その内周に透光性蓋体を嵌め込み、形状復元させる工程とにより形成する半導体装置の製造方法。 A method for manufacturing a semiconductor device in which an optical semiconductor element is mounted in a package including a conductor for connecting to an external circuit and a translucent lid for sealing an opening,
Dividing the package into a base portion having an optical semiconductor element mounting surface and a shape memory resin holding portion for holding a translucent lid above the optical semiconductor element mounting surface; A semiconductor device formed by a step of disposing and fixing the holding portion on a peripheral portion of the base portion, and a step of deforming the holding portion, fitting a translucent lid on the inner periphery thereof, and restoring a shape. Production method. 透光性蓋体を嵌め込む際に、保持部あるいは基台部上端の内周に予め形成された凹部により位置決めする請求項１３記載の半導体装置の製造方法。   The method of manufacturing a semiconductor device according to claim 13, wherein when the translucent lid is fitted, positioning is performed by a recess formed in advance on the inner periphery of the upper end of the holding part or the base part. 外部回路と接続するための導体と開口部を封止する透光性蓋体とを備えたパッケージ内に光半導体素子を搭載した半導体装置の製造方法であって、
前記パッケージを、光半導体素子搭載面を有した基台部と透光性蓋体を保持するための保持部とに分割形成するとともに、前記基台部に一端が保持部に対向する貫通穴あるいは溝部を形成する工程と、前記保持部の下面に形状記憶樹脂製の支持部材を接続する工程と、前記保持部に接続した支持部材を変形させ、前記基台部の貫通穴あるいは溝部に嵌め込み、形状復元させることにより、前記保持部を基台部上に支持部材により支持固定する工程と、前記保持部に前記透光性蓋体を固着する工程とにより形成する半導体装置の製造方法。 A method for manufacturing a semiconductor device in which an optical semiconductor element is mounted in a package including a conductor for connecting to an external circuit and a translucent lid for sealing an opening,
The package is divided into a base portion having an optical semiconductor element mounting surface and a holding portion for holding the translucent lid, and a through hole or one end of the base portion facing the holding portion is provided. A step of forming a groove portion, a step of connecting a support member made of shape memory resin to the lower surface of the holding portion, a supporting member connected to the holding portion is deformed, and is fitted into a through hole or a groove portion of the base portion, A manufacturing method of a semiconductor device formed by a step of supporting and fixing the holding portion on a base portion by a support member and a step of fixing the translucent lid to the holding portion by restoring the shape. 基台部上に保持部を配設する際に、保持部の下端が嵌入するように基台部に予め形成された凹部により位置決めする請求項１３または請求項１５のいずれかに記載の半導体装置の製造方法。   The semiconductor device according to claim 13, wherein when the holding portion is disposed on the base portion, the semiconductor device is positioned by a recess formed in advance in the base portion so that the lower end of the holding portion is fitted. Manufacturing method. 基台部上に保持部を配設する際に、基台部と保持部とに互いに嵌め合うように予め形成された凹部と凸部とにより位置決めする請求項１３または請求項１５のいずれかに記載の半導体装置の製造方法。   16. When the holding portion is disposed on the base portion, the positioning is performed by a concave portion and a convex portion that are formed in advance so as to be fitted to the base portion and the holding portion. The manufacturing method of the semiconductor device of description. 保持部の形状記憶性を利用して透光性蓋体を交換する請求項１３記載の半導体装置の製造方法。   The method of manufacturing a semiconductor device according to claim 13, wherein the translucent lid is replaced using shape memory property of the holding portion. 支持部材の形状記憶性を利用して保持部と支持部材との一体化物を交換する請求項１５記載の半導体装置の製造方法。   The method of manufacturing a semiconductor device according to claim 15, wherein an integrated product of the holding portion and the support member is exchanged using shape memory property of the support member.
JP2005109284A 2005-04-06 2005-04-06 Semiconductor device and manufacturing method thereof Withdrawn JP2006294659A (en)

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US8143721B2 (en) * 2007-06-29 2012-03-27 Intel Corporation Package substrate dynamic pressure structure
JP2012089881A (en) * 2009-07-29 2012-05-10 Kingpak Technology Inc Image sensor package structure
WO2024014313A1 (en) * 2022-07-12 2024-01-18 ソニーセミコンダクタソリューションズ株式会社 Semiconductor device and electronic equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8143721B2 (en) * 2007-06-29 2012-03-27 Intel Corporation Package substrate dynamic pressure structure
US8617921B2 (en) 2007-06-29 2013-12-31 Intel Corporation Package substrate dynamic pressure structure
US9111929B2 (en) 2007-06-29 2015-08-18 Intel Corporation Package substrate dynamic pressure structure
EP2280415A2 (en) * 2009-07-29 2011-02-02 Kingpak Technology Inc. Image sensor package structure with large air cavity
EP2280415A3 (en) * 2009-07-29 2012-03-07 Kingpak Technology Inc. Image sensor package structure with large air cavity
JP2012080129A (en) * 2009-07-29 2012-04-19 Kingpak Technology Inc Image sensor package with large air cavity space
JP2012089881A (en) * 2009-07-29 2012-05-10 Kingpak Technology Inc Image sensor package structure
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