JPWO2007043267A1 - Sheet peeling apparatus and peeling method - Google Patents

Abstract

A holding means (11) for holding the wafer (W) integrated with the inner peripheral region of the ring frame (RF) via the adhesive sheet (S), and a peeling trigger part forming means (12) for the adhesive sheet (S). And a peeling means (15) that grasps the peeling trigger part (S1) and moves in the peeling direction to form a sheet peeling apparatus (10). The peeling trigger part forming means (12) includes a piece member (32) that is rotationally displaced in a direction in which a part of the adhesive sheet (S) is lifted from the ring frame (RF) at a position along the inner peripheral edge of the ring frame (RF). The peeling trigger part (S1) peeled off by this piece member (32) is gripped and peeled by the chuck member (40) constituting the peeling means (15).

Description

  The present invention relates to a sheet peeling apparatus and a peeling method for peeling an adhesive sheet from a plate-like member such as a semiconductor wafer integrated with a ring frame via an adhesive sheet.

  Conventionally, semiconductor wafers (hereinafter simply referred to as “wafers”) are generally integrated through an adhesive sheet stretched on the inner peripheral area of the ring frame when performing back surface grinding or the like. Yes. This adhesive sheet is finally peeled off from the wafer and the ring frame. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1.

Japanese Patent Laid-Open No. 11-16862

  However, the apparatus disclosed in Patent Document 1 has a configuration in which an adhesive sheet is peeled off by attaching a peeling sheet or tape to the adhesive sheet and pulling the peeling sheet, and a separate sheet for peeling is necessary. Thus, there is an inconvenience that the running cost is high. In addition, a device for supplying a peeling sheet and a sheet cutting device are also required, which causes a disadvantage that the device becomes complicated.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to eliminate the need for a sheet or tape for peeling, and to simplify the apparatus configuration. And providing a peeling method.

In order to achieve the above object, the present invention provides a sheet for peeling an adhesive sheet from the ring frame and the plate-like member in a state in which the plate-like member integrated with the inner peripheral region of the ring frame via the adhesive sheet is supported. In the peeling device,
The holding means for holding the ring frame, the peeling trigger part forming means for peeling a part of the adhesive sheet from the ring frame, and the peeling trigger part formed by the peeling trigger part forming means are gripped to ring the adhesive sheet. A peeling means for peeling from the frame,
The peeling trigger portion forming means includes a peeling force applying member that displaces a part of the adhesive sheet in a direction to float from the ring frame at a position along the inner peripheral edge portion of the ring frame.

  In the present invention, the peeling force application member is configured by a piece member that is attached to a rotation shaft that is positioned along the radial direction of the ring frame and lifts a part of the adhesive sheet, and an outer edge shape of the piece member is A configuration including an arcuate edge along the inner peripheral edge of the ring frame can be employed.

  Moreover, it is good to take the structure that the said peeling force provision member is made into a pair arrangement | positioning and the said one member is provided so that it can rotate symmetrically.

  Furthermore, the peeling force applying member can be constituted by a nozzle that blows a gas to a part of the sheet.

  Further, the peeling force applying member is configured by a piece member attached to a rotating shaft positioned along the radial direction of the ring frame and a nozzle that blows gas to a part of the sheet. May be.

  Further, a sensor for detecting the presence or absence of the peeling trigger portion is provided in the vicinity of the formation area of the peeling trigger portion, and when the sensor does not detect the peeling trigger portion, the ring frame is rotated by a predetermined angle in a plane to thereby release the peeling trigger. It is preferable to adopt a configuration in which the part forming means is reactivated.

Further, the present invention provides a sheet peeling method for peeling the adhesive sheet from a plate-like member supported via an adhesive sheet on the inner peripheral region of the ring frame.
In a state where the ring frame is held, a peeling force applying member for forming a peeling trigger portion is positioned at a position along the inner peripheral edge of the ring frame,
The adhesive sheet is partially lifted from the ring frame by applying a force in a direction intersecting the surface of the sheet with the peeling force applying member to form a peeling trigger portion,
Next, a method is adopted in which the adhesive sheet is peeled by grasping the peeling trigger part.

In the sheet peeling method for peeling the adhesive sheet from the plate-like member supported via the adhesive sheet in the inner peripheral area of the ring frame,
While holding the ring frame, a piece member for forming a peeling trigger portion at a position along the inner peripheral edge of the ring frame is positioned substantially parallel to the adhesive sheet,
Rotating the other end side with the one end side of the one member as a rotation center to partially lift the adhesive sheet from the ring frame to form a peeling trigger part,
Next, it is possible to adopt a method in which the adhesive sheet is peeled by grasping the peeling trigger part.

Furthermore, in the sheet peeling method of peeling the adhesive sheet from the plate-like member supported via the adhesive sheet in the inner peripheral region of the ring frame,
In a state where the ring frame is held, a nozzle that ejects gas for forming a separation trigger portion is positioned at a position along the inner peripheral edge of the ring frame,
The adhesive sheet is partially lifted from the ring frame by blowing gas to a part of the sheet from the nozzle to form a peeling trigger part,
Next, it is possible to adopt a method in which the adhesive sheet is peeled by grasping the peeling trigger part.

Further, the present invention provides a sheet peeling method for peeling the adhesive sheet from a plate-like member supported via an adhesive sheet on the inner peripheral region of the ring frame.
In a state where the ring frame is held, a piece member for forming a peeling trigger portion and a nozzle for ejecting gas are positioned at a position along the inner peripheral edge of the ring frame,
A force that causes the adhesive sheet to partially lift from the ring frame by rotating the other end around the one end side of the single member and a part of the adhesive sheet from the ring frame by blowing gas to the adhesive sheet Forming the peeling trigger part by acting simultaneously with the lifting force,
Next, it is preferable to adopt a method of grasping the peeling trigger part and peeling the adhesive sheet.

  Moreover, when the said peeling trigger part is not formed, it is good to take the method of changing a peeling position and performing peeling operation again.

  According to the sheet peeling apparatus and the peeling method of the present invention, since the peeling force applying member is used, the peeling force applying member is configured to displace in the direction in which the adhesive sheet is lifted at a position along the inner peripheral edge portion of the ring frame. The need to use a separate sheet or tape for performing initial peeling can be eliminated, and the configuration of the peeling apparatus can be simplified.

  Further, the peeling force applying member is constituted by a piece member and / or a nozzle, and the piece member includes an arc-shaped edge part along the inner peripheral edge of the ring frame, and gas is emitted from the nozzle to a part of the adhesive sheet. Since it is sprayed, a peeling force can be applied at a position closest to the outer edge of the adhesive sheet, so that the peeling force can be effectively applied.

  Further, in the configuration in which the single members constituting the peeling force application member are arranged in a pair, the load on each member can be reduced, while a strong peeling force can be exerted.

  In addition, a sensor that detects the presence or absence of the peeling trigger part is provided, and when the peeling force imparting member rotates and the peeling operation is completed, the ring frame position is changed when the peeling trigger part is not detected. Since the formation operation of the peeling trigger portion can be performed again, even if the adhesive sheet is strongly bonded to the ring frame, it is possible to prevent the possibility of peeling leakage.

The schematic perspective view of the sheet peeling apparatus which concerns on this embodiment. The schematic plan view of FIG. 1 which abbreviate | omitted one part component. The right view of FIG. The schematic perspective view similar to FIG. 1 which abbreviate | omitted some component parts. The principal part side view which shows the initial state which performs sheet | seat peeling. The principal part side view which shows the intermediate | middle stage of sheet | seat peeling. The schematic perspective view similar to FIG. 4 which shows a modification. The principal part side view similar to FIG. 5 which shows a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Holding means 12 Peeling trigger part formation means 15 Peeling means 16 Sensor 30 Rotating shaft 32 Single member (peeling force provision member)
32A Arc-shaped edge 50 nozzle (peeling force imparting member)
RF ring frame S Adhesive sheet S1 Separation trigger W Wafer (plate member)

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “left and right” are directions along the X axis in FIG. 2, “front and back” are used for the Y axis, and “up and down” are used for the direction along the Z axis.

  FIG. 1 shows a schematic perspective view of a sheet peeling apparatus according to the present embodiment, FIG. 2 shows a schematic plan view, and FIG. 3 shows a schematic side view of FIG. Here, FIG. 3 is shown in a state in which some components in the vertical direction are separated from each other in order to avoid complication of the drawings. In these drawings, a sheet peeling apparatus 10 includes a holding unit 11 that holds a wafer W as a plate-like member integrated with a ring frame RF via an adhesive sheet S, and a part of the adhesive sheet S that is attached to the ring frame RF. The peeling trigger part forming means 12 that peels from the peeling trigger, the peeling means 15 that grips and peels the peeling trigger part S1 (see FIG. 5) formed by the peeling trigger part forming means 12, and the presence or absence of the peeling trigger part S1 is detected. Sensor 16 (see FIG. 5).

  The adhesive sheet S is configured to include an ultraviolet curable adhesive layer on the support surface (the lower surface in FIG. 1) side of the wafer W, and an ultraviolet irradiation device (not shown) is provided at a stage before sheet peeling described later. It is designed to be irradiated with ultraviolet rays.

  As shown in FIGS. 2 to 4, the holding means 11 is provided so as to be rotatable in a plane via a base 20 having a substantially square shape in plan view and a motor M located at the center of the base 20. A table 21, a suction table 22 provided at the center of the table 21 and having a suction surface for sucking the lower surface side of the wafer W, and a pair of front and rear columns 23, 23 on the left and right upper surfaces of the table 21, respectively. A pair of left and right lower pressing plates 24 fixed, a pair of upper pressing plates 26 disposed at positions above the lower pressing plates 24, and an upper pressing plate positioned at the upper center of the upper pressing plate 26. And a pair of cylinders 27 that respectively support the hoist 26 so as to be movable up and down. The cylinder 27 is supported by a frame (not shown) fixed to the table 21.

  In the present embodiment, the peeling trigger part forming means 12 has a pair structure. Specifically, a pair of motors M1 supported via a support member (not shown) at an upper position around the table 21, a rotating shaft 30 connected to the output shaft of these motors M1, and the free rotation of each rotating shaft 30 It is comprised by the piece member 32 as a peeling force provision member fixed to the end side. As shown in FIG. 2, the piece member 32 has an arcuate end edge 32A along the inner peripheral edge of the ring frame RF, a straight line portion 32B connected to the tip of the arcuate end edge 32A, and the straight line. 2 is provided in a shape having a curved edge portion 32C positioned between the portion 32B and the distal end portion of the rotary shaft 30, and the linear portions 32B of the piece members 32 face each other and are arranged symmetrically in FIG. Yes. Therefore, the piece member 32 is displaced symmetrically so that the adhesive sheet S is lifted from the ring frame RF when the linear portion 32B side is rotationally displaced about the rotation shaft 30.

  The peeling means 15 is composed of a pair of front and rear chuck members 40 disposed above the piece members 32. These chuck members 40 are provided so as to be spaced apart from each other and accessible, and supported by a guide member (not shown) disposed at a position above the ring frame RF via a frame or the like so as to be in the Y-axis direction, that is, the ring frame. While being provided to be movable along the radial direction of the RF, it is provided to be movable up and down.

  As shown in FIG. 5, the sensor 16 detects the presence or absence of the peeling trigger portion S1 of the adhesive sheet S, and is constituted by an optical sensor. The single member 32 of the peeling trigger portion forming means 12 is rotated. When the operation is performed, it moves to the position shown in FIG. 5 and is supported by a predetermined guide member so as to retreat to a position that does not interfere with the subsequent peeling operation when the peeling trigger portion S1 is detected.

  Next, the sheet peeling operation in the present embodiment will be described with reference to FIGS. Here, it is assumed that the adhesive force is lowered by pre-irradiating the adhesive region between the ring frame RF and the adhesive sheet S and the adhesive region between the adhesive sheet S and the wafer W with ultraviolet rays.

  As shown in FIG. 4, the ring frame RF in which the wafer W is integrated through the adhesive sheet S is taken out from a predetermined stocker via a transfer robot (not shown), and the transfer is performed after alignment by an alignment device (not shown). The robot transfers the outer peripheral portion of the ring frame RF so as to get on the lower pressing plate 24. Next, the upper pressing plate 26 is lowered by the operation of the cylinder 27, and the ring frame RF is sandwiched between the lower pressing plate 24. At this time, the suction table 22 sucks the wafer W, and the strip member 32 of the peeling trigger portion forming means 12 is positioned on the lower surface side of the adhesive sheet S while maintaining a substantially horizontal posture, and has an arc shape. The end edge 32A waits at a position along the inner periphery of the ring frame RF.

  When a peeling operation start signal is given from a control device (not shown), the piece member 32 is rotationally displaced so that the linear portion 32B is positioned upward with the rotation shaft 30 as a rotation center, thereby being positioned on the upper surface side of the piece member 32. The adhesive sheet S area to be pressed receives a push-up force upward (Z-axis direction), and is peeled off so as to be lifted from the ring frame RF to form a peeling trigger part S1 (see FIG. 5). At this time, the sensor 16 is positioned on both sides of the separation trigger portion S1, and when the separation trigger portion S1 is detected by the sensor 16, the sensor 16 is retracted while the chuck member 40 is In FIG. 5, the separation trigger S <b> 1 is gripped by approaching the position indicated by the two-dot chain line to the position indicated by the solid line. Thereafter, as shown in FIG. 6, the chuck member 40 moves to the left side so that the adhesive sheet S is sequentially peeled from the wafer W and the ring frame RF, and is completely removed after the peeling is completed. The adhesive sheet S is collected in the box.

  In the formation of the peeling trigger portion S1, when the sensor 16 cannot detect the peeling trigger portion S1 even though the strip member 32 rotates and the peeling operation is completed, the table 21 is driven by the motor M. It operates so as to rotate a predetermined angle in the horizontal plane and change the formation area of the peeling trigger part, and the same operation is performed until the strip member 32 performs the peeling trigger part forming operation again and the sensor 16 detects the peeling trigger part S1. repeat. It should be noted that it is also possible to determine that there is a separation failure by giving a limit to the number of operations and to inform the operator.

  Therefore, according to such an embodiment, the peeling trigger portion S1 can be formed by merely rotating the piece member 32. Therefore, the adhesive sheet S is reliably peeled from the ring frame RF with the running cost being suppressed as much as possible. be able to.

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the present invention has been illustrated and described mainly with respect to specific embodiments, but the shape, position, or position of the above-described embodiments can be reduced without departing from the scope of the technical idea and object of the present invention. With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, as shown in FIGS. 7 and 8, it is possible to employ a configuration in which a nozzle 50 as a peeling force application member is provided below the pair of piece members 32. A gas supply source (not shown) is connected to the nozzle 50, and the gas discharged from the tip of the nozzle is blown to the formation region of the peeling trigger portion so as to apply a peeling force together with the piece member 32. It is configured. When such a configuration is adopted, the peeling trigger portion S1 can be formed more reliably. In addition, this invention does not prevent the said piece member 32 being abbreviate | omitted and setting it as the structure which sprays gas on the adhesive sheet S from the nozzle 50, and only provides peeling force. Further, the gas to be blown may be not only air but also inert gas such as nitrogen gas or other gas.

  In the above embodiment, the chuck member 40 is moved along the Y-axis direction, that is, along the radial direction of the ring frame RF. However, the base 20 is supported by an appropriate guide rail and travels. It is good also as a structure which moves a table side in a Y-axis direction along a guide rail by providing.

  Furthermore, although the case where the plate-like member is a wafer is illustrated and described, other plate-like electronic components, glass, a resin substrate, a metal plate, and the like may be used.

  Moreover, although the peeling trigger part formation means 12 was made into a pair structure, it is good also as a single structure. That is, the structure provided so that one piece member could rotate centering on a rotating shaft may be sufficient. In short, the present invention only needs to be provided so as to impart a lifting force to the adhesive sheet S.

Claims (11)

In a sheet peeling device that peels the adhesive sheet from the ring frame and the plate-like member in a state where the plate-like member integrated via the adhesive sheet is supported on the inner peripheral region of the ring frame,
The holding means for holding the ring frame, the peeling trigger part forming means for peeling a part of the adhesive sheet from the ring frame, and the peeling trigger part formed by the peeling trigger part forming means are gripped to ring the adhesive sheet. A peeling means for peeling from the frame,
The peeling trigger part forming means is configured to include a peeling force applying member that displaces a part of the adhesive sheet in a direction of rising from the ring frame at a position along the inner peripheral edge of the ring frame. Sheet peeling device. The peeling force imparting member is constituted by a piece member that is attached to a rotating shaft that is positioned along the radial direction of the ring frame and lifts a part of the adhesive sheet, and the outer edge shape of the piece member is the ring frame. The sheet peeling apparatus according to claim 1, further comprising an arcuate end edge along the inner periphery of the sheet. 3. The sheet peeling apparatus according to claim 2, wherein the peeling force applying members are arranged in a pair, and the piece members are provided so as to be symmetrically rotatable. The sheet peeling apparatus according to claim 1, wherein the peeling force applying member is configured by a nozzle that blows gas onto a part of the sheet. The said peeling force provision member is comprised by the piece member attached to the rotating shaft located along the radial direction of the said ring frame, and the nozzle which blows gas to a part of said sheet | seat. Item 2. A sheet peeling apparatus according to Item 1. A sensor for detecting the presence or absence of a peeling trigger part is provided in the vicinity of the formation area of the peeling trigger part, and when the sensor does not detect the peeling trigger part, the ring frame is rotated within a plane by a predetermined angle to form the peeling trigger part. The sheet peeling apparatus according to any one of claims 1 to 5, wherein the means is operated again. In the sheet peeling method of peeling the adhesive sheet from the plate-like member supported via the adhesive sheet in the inner peripheral area of the ring frame,
In a state where the ring frame is held, a peeling force applying member for forming a peeling trigger portion is positioned at a position along the inner peripheral edge of the ring frame,
The adhesive sheet is partially lifted from the ring frame by applying a force in a direction intersecting the surface of the sheet with the peeling force applying member to form a peeling trigger portion,
Next, the sheet peeling method is characterized in that the adhesive sheet is peeled by grasping the peeling trigger part. In the sheet peeling method of peeling the adhesive sheet from the plate-like member supported via the adhesive sheet in the inner peripheral area of the ring frame,
While holding the ring frame, a piece member for forming a peeling trigger portion at a position along the inner peripheral edge of the ring frame is positioned substantially parallel to the adhesive sheet,
Rotating the other end side with the one end side of the one member as a rotation center to partially lift the adhesive sheet from the ring frame to form a peeling trigger part,
Next, the sheet peeling method is characterized in that the adhesive sheet is peeled by grasping the peeling trigger part. In the sheet peeling method of peeling the adhesive sheet from the plate-like member supported via the adhesive sheet in the inner peripheral area of the ring frame,
In a state where the ring frame is held, a nozzle that ejects gas for forming a separation trigger portion is positioned at a position along the inner peripheral edge of the ring frame,
The adhesive sheet is partially lifted from the ring frame by blowing gas to a part of the sheet from the nozzle to form a peeling trigger part,
Next, the sheet peeling method is characterized in that the adhesive sheet is peeled by grasping the peeling trigger part. In the sheet peeling method of peeling the adhesive sheet from the plate-like member supported via the adhesive sheet in the inner peripheral area of the ring frame,
In a state where the ring frame is held, a piece member for forming a peeling trigger portion and a nozzle for ejecting gas are positioned at a position along the inner peripheral edge of the ring frame,
A force that causes the adhesive sheet to partially lift from the ring frame by rotating the other end around the one end side of the single member and a part of the adhesive sheet from the ring frame by blowing gas to the adhesive sheet Forming the peeling trigger part by acting simultaneously with the lifting force,
Next, the sheet peeling method is characterized in that the adhesive sheet is peeled by grasping the peeling trigger part. The sheet peeling method according to claim 10, wherein when the peeling trigger part is not formed, the peeling position is changed and the peeling operation is performed again.

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