WO2007043267A1

WO2007043267A1 - Apparatus and method for peeling sheet

Info

Publication number: WO2007043267A1
Application number: PCT/JP2006/318007
Authority: WO
Inventors: Masahisa Otsuka
Original assignee: Lintec Corporation
Priority date: 2005-10-13
Filing date: 2006-09-12
Publication date: 2007-04-19
Also published as: JPWO2007043267A1; JP4851466B2; TW200717591A

Abstract

A sheet peeling apparatus (10) is provided with a holding means (11) for holding a wafer (W) integrated in an inner circumference area of a ring frame (RF) through an adhesive (S); a peeling starting portion forming means (12) for the adhesive sheet (S); and a peeling means (15) which shifts in a peeling direction by holding a peeling starting portion (S1). The peeling starting portion forming means (12) is provided with a piece member (32) which rotationally moves in a direction permitting a part of the adhesive sheet (S) to rise from the ring frame (RF) at a position along an inner circumference end of the ring frame (RF). Peeling is performed by permitting a chuck member (40), which constitutes the peeling means (15), to hold the peeling starting portion (S1) peeled by the piece member (32).

Description

Specification

Sheet peeling apparatus and peeling method

Technical field

TECHNICAL FIELD [0001] The present invention relates to a sheet peeling apparatus and a peeling method for peeling a plate-like member force adhesive sheet such as a semiconductor wafer integrated with a ring frame via an adhesive sheet.

Background art

Conventionally, a semiconductor wafer (hereinafter simply referred to as “wafer”) is integrated with an adhesive sheet stretched on an inner peripheral region of a ring frame when performing back surface grinding or the like. Generally done. This adhesive sheet finally peels and removes the wafer and ring frame force. For example, Patent Document 1 discloses such an adhesive sheet peeling apparatus.

Patent Document 1: Japanese Patent Laid-Open No. 11 16862

Disclosure of the invention

Problems to be solved by the invention

[0004] However, the apparatus disclosed in Patent Document 1 has a configuration in which a peeling sheet or tape is attached to an adhesive sheet, and the adhesive sheet is peeled by pulling the peeling sheet. There is an inconvenience that a separate seat is required and the running cost is high. In addition, a device for supplying a peeling sheet and a sheet cutting device are also required, which causes inconvenience that the device is complicated.

[0005] [Object of invention]

The present invention has been devised by paying attention to such inconveniences, and the object thereof is to eliminate the need for a sheet or tape for peeling, and to reduce the force and the structure of the apparatus. It is providing the peeling apparatus and the peeling method.

Means for solving the problem

[0006] In order to achieve the above object, the present invention provides an adhesive from the ring frame and the plate-like member in a state where the plate-like member integrated with the inner peripheral region of the ring frame via an adhesive sheet is supported. In the sheet peeling apparatus for peeling the sheet, A holding means for holding the ring frame, a peeling hooking portion forming means for peeling off a part of the adhesive sheet, and a peeling hooking portion formed by the peeling hooking portion forming means to grasp the adhesive And a peeling means for peeling the sheet with a ring frame force,

The peeling tacking portion forming means includes a peeling force applying member that displaces a part of the adhesive sheet in a direction to lift the ring frame force at a position along the inner peripheral edge portion of the ring frame.

[0007] In the present invention, the peeling force applying member is constituted by a piece member that is attached to a rotating shaft positioned along a radial direction of the ring frame and lifts a part of the adhesive sheet, As the outer edge shape of the piece member, a configuration including an arc-shaped end edge along the inner peripheral edge of the ring frame can be adopted.

[0008] Further, it is preferable to adopt a configuration in which a pair of the peeling force applying members is disposed and the piece members are provided so as to be symmetrically rotatable.

[0009] Further, the peeling force applying member can be constituted by a nozzle that blows gas to a part of the sheet.

[0010] Further, the peeling force applying member is configured by a piece member attached to a rotating shaft positioned along a radial direction of the ring frame, and a nozzle that blows gas to a part of the sheet. You may take the structure of.

[0011] Further, a sensor for detecting the presence or absence of the peeling hooking portion is provided in the vicinity of the formation region of the peeling hooking portion, and when the sensor does not detect the peeling hooking portion, the ring frame is moved in a plane. Rotating the peeling tacking portion forming means by a predetermined angle and re-operating;

V, I prefer to adopt a configuration!

[0012] Further, the present invention provides a plate-like member force supported on the inner peripheral region of the ring frame via an adhesive sheet, in a sheet peeling method for peeling the adhesive sheet,

With the ring frame held, a peeling force application member for forming a peeling tacking portion is positioned at a position along the inner peripheral edge of the ring frame,

By applying a force in a direction intersecting the surface of the sheet by the peeling force applying member, the adhesive sheet is partially lifted to form a peeling tacking portion. And

Next, a method is adopted in which the adhesive sheet is peeled by grasping the peeling tacking portion.

[0013] In addition, the sheet-like member force supported on the inner peripheral region of the ring frame via an adhesive sheet, the sheet peeling method for peeling the adhesive sheet,

In a state where the ring frame is held, a piece member for forming a peeling tacking portion is positioned substantially parallel to the adhesive sheet at a position along the inner peripheral edge of the ring frame, and one end side of the piece member is rotated. Rotate the other end side as the center to partially lift the adhesive sheet with the ring frame force to form a peeling tacking part,

Next, a method can be employed in which the adhesive sheet is peeled by grasping the peeling tacking portion.

[0014] Furthermore, the sheet-like member force supported on the inner peripheral region of the ring frame via the adhesive sheet is a sheet peeling method for peeling the adhesive sheet.

In a state where the ring frame is held, a nozzle that ejects a gas for forming a peeling tacking portion is positioned at a position along the inner peripheral edge of the ring frame, and the nozzle force gas is supplied to a part of the sheet. By spraying, the adhesive sheet causes the ring frame force to partially lift to form a peeling tack portion,

Next, it is possible to use a method in which the adhesive sheet is peeled by grasping the peeling tacking portion.

[0015] Further, the present invention provides a plate-like member force supported on the inner peripheral region of the ring frame via an adhesive sheet, in a sheet peeling method for peeling the adhesive sheet,

While holding the ring frame, a piece member for forming a peeling tacking portion and a nozzle for jetting gas are positioned at a position along the inner peripheral edge of the ring frame, and one end side of the piece member is rotated. Simultaneously, the other end side is rotated around the center to cause the adhesive sheet to partially lift the ring frame force and the force to blow the gas to the adhesive sheet to cause the adhesive sheet to partially lift the ring frame force. To form a peeling tack, Next, it is preferable to take a method in which the adhesive sheet is peeled by grasping the peeling tacking portion.

[0016] Further, when the peeling tacking portion is not formed, it is preferable to change the peeling position and perform a peeling operation again.

The invention's effect

[0017] According to the sheet peeling apparatus and the peeling method of the present invention, the peeling force applying member is used, and the peeling force applying member is displaced in a direction in which the adhesive sheet is lifted at a position along the inner peripheral edge portion of the ring frame. Therefore, the necessity of using a separate sheet or tape for performing initial peeling can be eliminated, and the configuration of the peeling apparatus can be simplified.

[0018] Further, the peeling force applying member is constituted by a piece member and / or a nozzle, and the piece member partially includes an arcuate edge along the inner peripheral edge of the ring frame. Since the gas is blown to the part, the peeling force can be applied at the position closest to the outer edge of the adhesive sheet, so that the peeling force can be effectively applied.

[0019] Further, in the configuration in which the single members constituting the peeling force application member are arranged in a pair, the load on each member can be reduced, and a strong peeling force can be exerted.

[0020] In addition, a sensor for detecting the presence or absence of the peeling tacking portion is provided, and when the peeling tacking portion is not detected even though the peeling force applying member rotates and the peeling operation is completed, the ring frame Since the position can be changed and the peeling tacking part can be formed again

Even if the adhesive sheet is strongly adhered to the ring frame, it is possible to prevent the possibility of peeling leakage.

Brief Description of Drawings

FIG. 1 is a schematic perspective view of a sheet peeling apparatus according to the present embodiment.

[FIG. 2] —The schematic plan view of FIG.

FIG. 3 is a right side view of FIG.

4] A schematic perspective view similar to FIG. 1 with some components omitted.

FIG. 5 is a side view of an essential part showing an initial state where sheet peeling is performed.

FIG. 6 is a side view of the main part showing an intermediate stage of sheet peeling. FIG. 7 is a schematic perspective view similar to FIG. 4 showing a modification.

FIG. 8 is a side view of an essential part similar to FIG. 5, showing a modification.

Explanation of symbols

[0022] 10 Sheet peeling device

11 Holding means

12 Peeling part forming means

15 Peeling means

16 sensors

30 axis of rotation

32 Single member (Peeling force imparting member)

32A Arc edge

50 nozzles (peeling force imparting member)

RF ring frame

S adhesive sheet

S1 Peeling and tacking section

w Wafer (plate member)

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In this specification, “left and right” is the direction along the X axis in FIG. 2, “front and back” is used for the Y axis, and “up and down” is used for the direction along the Z axis.

FIG. 1 shows a schematic perspective view of a sheet peeling apparatus according to the present embodiment, FIG. 2 shows a schematic plan view, and FIG. 3 shows a schematic side view of FIG. Yes. Here, FIG. 3 is shown in a state where some components in the vertical direction are separated from each other in order to avoid complication of the drawing. In these drawings, the sheet peeling apparatus 10 includes a holding means 11 for holding the wafer W as a plate-like member integrated with the ring frame RF via the adhesive sheet S, and a part of the adhesive sheet S for the ring frame RF. Peeling part forming means 12 that also peels off force, peeling means 15 that peels off the holding part S1 (see FIG. 5) formed by the peeling part forming part 12, and the peeling part S1 Sensor for detecting the presence or absence of 16 (Fig. 5 Reference) and comprising.

[0025] The adhesive sheet S is configured to include an ultraviolet curable adhesive layer on the support surface (the lower surface in FIG. 1) side of the wafer W. It comes to be irradiated with ultraviolet rays through the irradiation device!

As shown in FIGS. 2 to 4, the holding means 11 is rotatable in a plane via a base 20 having a substantially square shape in plan view and a motor M located at the center of the base 20. A suction table 22 provided with a suction surface that is provided at the center of the table 21 and sucks the lower surface side of the wafer W, and a pair of front and rear columns 23 on the left and right upper surfaces of the table 21; A pair of left and right lower retainer plates 24 fixed through 23, a pair of upper retainer plates 26 respectively disposed at upper positions opposite to these lower retainer plates 24, and an upper center of the upper retainer plate 26. A pair of cylinders 27 that are positioned and support the upper pressing plate 26 so as to be movable up and down are provided. The cylinder 27 is fixed to the table 21 and is supported by a frame (not shown).

[0027] The peeling tacking portion forming means 12 has a pair structure in this embodiment. Specifically, a pair of motors Ml that are supported via an eaves support member (not shown) around the table 21, a rotary shaft 30 connected to the output shaft of these motors Ml, and each rotary shaft 30 And a single member 32 as a peeling force applying member fixed to the free end side. As shown in FIG. 2, the single member 32 has an arcuate edge 32A having an outer edge shape along the inner peripheral edge of the ring frame RF, a linear portion 32B connected to the tip of the arcuate edge 32A, and the straight line 2B is provided with a curved edge portion 32C positioned between the end portion 32B and the tip end portion of the rotary shaft 30, and the linear portions 32B of the single members 32 face each other and are arranged symmetrically in FIG. ing. Accordingly, the piece member 32 is displaced symmetrically so that the ring frame RF force also rises when the linear portion 32B side is rotationally displaced about the rotating shaft 30.

[0028] The peeling means 15 includes a pair of front and rear chuck members 40 disposed above the piece members 32. These chuck members 40 are provided so as to be spaced apart from each other and accessible, and supported by a guide member (not shown) disposed at a position above the ring frame RF via a frame or the like, in the Y-axis direction, that is, the ring frame. RF radial direction It is provided so that it can move along and can be moved up and down.

[0029] As shown in FIG. 5, the sensor 16 detects the presence or absence of the peeling tacking portion S1 of the adhesive sheet S, and is configured by an optical sensor. When the single member 32 rotates, it moves to the position shown in FIG. 5, while when the peeling tacking portion S1 is detected, it is moved to a predetermined guide member so as to retreat to a position that does not interfere with the subsequent peeling operation. It is supported.

Next, the sheet peeling operation in the present embodiment will be described with reference to FIG. 5 and FIG. Here, it is assumed that the adhesive force is lowered by pre-irradiating the adhesive region between the ring frame RF and the adhesive sheet S and the adhesive region between the adhesive sheet S and Ueno and W with ultraviolet rays.

As shown in FIG. 4, the ring frame RF in which the wafer W is integrated through the adhesive sheet S is taken out from a predetermined stock force via a transfer robot, not shown! After the alignment by the alignment device, the transfer robot transfers the outer peripheral portion of the ring frame RF so as to ride on the lower presser plate 24. Next, the upper pressing plate 26 is lowered by the operation of the cylinder 27, and the ring frame RF is sandwiched between the lower pressing plate 24. At this time, the suction table 22 sucks the wafer W, and the strip member 32 of the peeling hooking portion forming means 12 is positioned on the lower surface side of the adhesive sheet S in a substantially horizontal posture. In addition, the arcuate edge 32A waits at a position along the inner periphery of the ring frame RF.

[0032] When a peeling operation start signal is applied to a control device force (not shown), the piece member 32 is rotationally displaced so that the linear portion 32B is positioned above the rotation shaft 30 as a rotation center, and thereby the piece member The adhesive sheet S region located on the upper surface side of 32 receives a pushing force upward (in the Z-axis direction) and peels off so that the ring frame RF force also rises to form a peeling tack S1 (see FIG. 5). At this time, the sensor 16 is positioned on both sides of the peeling hooking portion S1, and when the sensor 16 detects the peeling hooking portion S1, the sensor 16 moves backward, while the chuck 16 The member 40 approaches the position indicated by the solid line from the position indicated by the two-dot chain line in FIG. 5 and grasps the peeling tacking portion S1. Thereafter, the chuck member 40 moves to the left side as shown in FIG. Lame RF force Adhesive sheet S is collected in a collection box (not shown) after it has been peeled off and completely peeled off.

[0033] In the formation of the peeling tacking portion S1, when the sensor 16 cannot detect the peeling tacking portion S1 even though the peeling operation is completed by the rotation of the single member 32, the table 21 is The motor M is driven to rotate at a predetermined angle in the horizontal plane to change the formation region of the peeling tacking portion, and the peeling member forming operation is performed again by the single member 32, and the sensor 16 is moved to the peeling tacking portion. The same operation is repeated until S1 is detected. Note that it is also possible to determine that there is a separation failure by giving a limit to the number of operations and to notify the operator.

[0034] Therefore, according to such an embodiment, the peeling tacking portion S1 can be formed only by rotating the piece member 32, so that the running cost is minimized and the adhesive sheet S is attached to the ring frame RF force. It can be reliably peeled off.

As described above, the best configuration, method and the like for carrying out the present invention are the forces disclosed in the above description. The present invention is not limited to this.

That is, although the present invention has been illustrated and described with particular reference to particular embodiments, the shape, position, or arrangement of the embodiments described above without departing from the scope of the technical idea and purpose of the present invention. With regard to the above, etc., various changes can be made by those skilled in the art as needed.

For example, as shown in FIGS. 7 and 8, a configuration in which a nozzle 50 as a peeling force applying member is provided below the pair of piece members 32 can be employed. A gas supply source (not shown) is connected to the nozzle 50, and the gas discharged from the tip end of the nozzle is blown to the formation region of the peeling tacking portion, thereby giving a peeling force together with the piece member 32. Is configured to do. When such a configuration is employed, the peeling tacking portion S1 can be formed more reliably. Note that the present invention does not prevent the single member 32 from being omitted and a structure in which gas is blown from the nozzle 50 to the adhesive sheet S to apply a peeling force. Further, the gas to be blown may be not only air but also inert gas such as nitrogen gas or other gas.

In the embodiment, the chuck member 40 is moved in the Y-axis direction, that is, the ring frame R. The force base 20 is configured to be peeled by moving along the radial direction of F. The base 20 is supported on an appropriate guide rail so that it can run, and the table side is moved along the guide rail in the Y-axis direction. As well.

Furthermore, although the case where the plate-like member is a wafer is illustrated and described, other plate-shaped electronic components, glass, a resin substrate, a metal plate, and the like may be used.

In addition, the peeling tacking portion forming means 12 has a pair structure, but may have a single structure. In other words, one piece member may be configured to be rotatable about the rotation axis. In short, the present invention only needs to be provided so as to impart a lifting force to the adhesive sheet S.

Claims

The scope of the claims

[1] In the sheet peeling apparatus in which the ring frame and the plate-shaped member also peel off the adhesive sheet while supporting the plate-shaped member integrated with the inner peripheral area of the ring frame via the adhesive sheet.

A holding means for holding the ring frame, a peeling hooking portion forming means for peeling off a part of the adhesive sheet, and a peeling hooking portion formed by the peeling hooking portion forming means to grasp the adhesive And a peeling means for peeling the sheet with a ring frame force,

The peeling tacking portion forming means includes a peeling force applying member that displaces a part of the adhesive sheet in a direction in which the ring frame force rises at a position along an inner peripheral edge portion of the ring frame. Sheet peeling device.

[2] The peeling force imparting member is constituted by a piece member that is attached to a rotating shaft that is positioned along the radial direction of the ring frame to lift a part of the adhesive sheet, and an outer edge shape of the piece member. The sheet peeling apparatus according to claim 1, wherein the sheet peeling device includes an arcuate edge along an inner peripheral edge of the ring frame.

3. The sheet peeling apparatus according to claim 2, wherein the peeling force applying members are arranged in a pair, and the one piece members are provided so as to be capable of rotating symmetrically.

[4] The sheet peeling apparatus according to [1], wherein the peeling force applying member is constituted by a nozzle that blows gas onto a part of the sheet.

[5] The peeling force applying member is composed of a single member attached to a rotating shaft positioned along the radial direction of the ring frame, and a nozzle that blows gas to a part of the sheet! The sheet peeling apparatus according to claim 1, wherein:

[6] A sensor for detecting the presence or absence of the peeling hooking portion is provided in the vicinity of the formation area of the peeling hooking portion, and the ring frame is rotated by a predetermined angle in the plane when the sensor does not detect the peeling hooking portion. 6. The sheet peeling apparatus according to claim 1, wherein the peeling tacking portion forming means is operated again.

[7] A plate-like member force supported via an adhesive sheet on the inner peripheral region of the ring frame. A sheet peeling method for peeling the adhesive sheet, While holding the ring frame, a peeling force applying member for forming a peeling tacking portion is positioned at a position along the inner peripheral edge of the ring frame,

By applying a force in a direction intersecting the surface of the sheet by the peeling force applying member, the adhesive sheet is partially lifted to form a peeling tacking portion,

Next, the sheet peeling method, wherein the adhesive sheet is peeled by grasping the peeling tacking portion.

[8] A plate-like member force supported via an adhesive sheet on the inner peripheral area of the ring frame. A sheet peeling method for peeling the adhesive sheet,

[9] A plate-like member force supported via an adhesive sheet on the inner peripheral region of the ring frame. A sheet peeling method for peeling the adhesive sheet,

In a state where the ring frame is held, a nozzle for ejecting a gas for forming a peeling tacking portion is positioned at a position along the inner peripheral edge of the ring frame,

The nozzle force by blowing a gas to a part of the sheet, the ring frame force partially lifted to form a peeling tack portion,

[10] A plate-like member force supported via an adhesive sheet on the inner peripheral region of the ring frame. A sheet peeling method for peeling the adhesive sheet,

With the ring frame held, a piece member for forming a peeling tacking portion and a nozzle for ejecting gas are positioned at a position along the inner peripheral edge of the ring frame. Rotating the other end side around one end side of the one member to force the adhesive sheet to partially lift the ring frame force, and blowing the gas onto the adhesive sheet to cause the adhesive sheet to ring frame force part The force that lifts up automatically acts at the same time to form a peeling tacking part,

11. The sheet peeling method according to claim 10, wherein when the peeling tacking portion is not formed, the peeling position is changed and the peeling operation is performed again.