JPH05211184A - Die bonding device - Google Patents

Abstract

PURPOSE:To provide a device capable of die-bonding pellets with high reliability by a method wherein the pellets adhered on a sheet are precisely exfolitated and picked up without damage or breaking. CONSTITUTION:A die bonding device has a mechanism, wherein one row or a plurality of rows of pellets 3, which are adhered on a sheet 4 fixed by water rings 2 and are individually split, are made to separate from the sheet 4 by peeling off the sheet 4 downwards, are positioned and recognized piece by piece in a state that a plurality of pieces of the pellets are made to align on a pellet arrangement stage 6 and a bonding of the pellets is performed on a lead frame or a pellet mounting part of a ceramic case by suction collets 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device die bonding apparatus.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor device is manufactured, a wafer attached to a sheet is diced into a lattice, and predetermined pellets arranged in the lattice are picked up one by one from a sheet by a vacuum suction collet. A method of carrying it on a predetermined base and performing die bonding is adopted.

That is, in the operation diagram of FIG.
As shown in (a), an X (not shown) driven in the XY directions
Position and fix the wafer ring 2 on the Y table,
A sheet 4 to which pellets 3 are attached is attached and fixed to the lower surface of the wafer ring 2. Immediately below the collet 8, there are arranged a push-up needle 11 which is appropriately positioned below the back surface of the sheet 4 and pushes up the pellet 3 from the back surface of the sheet 4, and a sleeve 12 which supports the push-up needle 11 so as to be vertically movable. The XY table is appropriately moved by the information of the ITV camera (not shown) of the ring 2 to position the predetermined pellet 3 directly under the push-up needle 1, and the collet 8 is lowered as shown in FIG. 3, and then the collet 8 of FIG. As described above, the collet 8 is raised, and at the same time, the push-up needle 11 is pushed upward to push up the pellet 3 and peel the pellet 3 from the sheet 4. After that, the collet 8 is moved to the pellet mounting portion of the lead frame and bonding is performed.

[0004]

However, in this conventional die bonding apparatus, since the sheet is lifted up in a conical shape as shown in FIG. 3 (c), tilting of the pellet occurs at the time of pushing up, and the positional accuracy deteriorates. Also, the contact with the adsorption collet becomes poor and the pellet is damaged. Also,
When the sheet is peeled off, bending stress is applied to the pellet with the push-up needle as a fulcrum. Therefore, in the case of an ultrafine pellet such as a line sensor pellet (short side: 2 mm or less, long side: 15 mm or more), the pellet is cracked due to the sheet tension. Alternatively, when the suction collet and the push-up needle are out of synchronization with each other, there is a problem that the push-up needle pushes the pellet more than necessary to cause cracking.

[0005]

DISCLOSURE OF THE INVENTION A die bonding apparatus of the present invention separates a pellet attached to a sheet from a single row or multiple rows sheet by pulling the sheet downward in synchronization with a wafer ring, A mechanism is provided for positioning and recognizing one by one in a state where a plurality of them are aligned, and moving them to a pellet mounting portion such as a lead frame by a suction collet to perform die bonding.

[0006]

The present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the operation of the first embodiment of the present invention, and FIGS. 1A to 1E are sectional views. Figure 1 (a)
As shown in FIG. 2, the wafer ring 2 holding the sheet 4 to which the pellets 3 each individually divided and arranged vertically and horizontally at a predetermined pitch are attached, is pressed and fixed on the wafer ring base 1 so as to be movable left and right. , Is pushed toward the right side pellet arranging table 6 by a ring pushing means (not shown).
A sheet push rod 5 is arranged above the end of the pellet array table 6 so that the sheet 4 near the inner edge of the wafer ring 2 can be pushed downward. A sheet clamper 7 is arranged below the pellet arranging table 6, and the sheet 4 peeled from the wafer ring 2 by the sheet peeling bar 5.
The edge of the sheet is clamped so that the sheet 4 can be pulled in obliquely downward. Further, above the pellet suction position on the pellet array table 6, an X-Y table (not shown) is used to
A collet 8 for driving in the Y direction is provided.

The operation of the above structure will be described in more detail. The edge of the sheet 4 attached to the wafer ring 2 by the ring pushing means comes immediately before the edge portion 6a of the pellet array table 6. 1B, the sheet 4 at the inner edge of the wafer ring 2 is pushed down by the sheet push rod 5 to separate the sheet 4 from the wafer ring 2, and the end portion of the sheet 4 is moved. Is clamped by the sheet clamper 7.

Next, as shown in FIG. 1C, the wafer ring base 1 is moved rightward to reduce the gap between the wafer ring base 1 and the pellet array base edge portion 6a to approximately the thickness of the sheet 4. In this state, the wafer ring 2 and the sheet clamper 7 are synchronously moved to the right and diagonally downward to the right, so that the wafer ring 2 and the pellet 3 are separated by the sheet 4. At this time, the pellet 3 is the sheet 4
The sheet 4 is transferred to the pellet suction position of the pellet arranging table 6 along with the peeling of the sheet 4 until completely peeled.
The sheet peeling angle θ at this time is preferably 5 to 20 °, though it depends on the size of the pellet. Further, in this case, the wafer ring 2 was moved in parallel with the pellet arranging table 6, but when the pellet size was 2 mm square or more, the wafer ring 2 was moved at an angle of 0 to 5 ° with respect to the pellet arranging table 6. You may move it by holding.

In this way, the wafer ring 2 and the sheet clamper 7 are stopped in a state where the pellets 3 arranged in a vertical line are peeled from the sheet 4, and the peeled pellets 3 as shown in FIG. 1D are not shown in the ITV camera. Recognize one by one,
It is positioned, adsorbed by the collet 8, raised as shown in FIG. 1 (e), the non-defective pellets are transferred and placed on the pellet mounting portion on the lead frame, and the defective pellets are discarded.
At this time, since the pellet 3 is separated from the sheet 4, it can be easily picked up by the collet 8, and it is not necessary to push it up with a push-up needle from below, and therefore, the positional accuracy is not deteriorated and the pellet is not damaged. After that, this operation is repeated, and when the pellets in one column are exhausted, the wafer ring 2 and the sheet clamper 7 are operated again to peel the next column.

FIG. 2 is a diagram showing the operation of the second embodiment of the present invention, and FIGS. 2 (a) to 2 (d) are sectional views. In this embodiment, as shown in FIG. 2A, the pellet array table is a drivable pellet array belt 10 which can be driven in synchronization with the wafer ring 2 and the sheet clamper 7. In such a structure, as in the first embodiment, the wafer ring is moved to the position just before the edge portion 9 by the ring pushing means, and then, as shown in FIG.
As shown in (b), the sheet 4 is separated from the wafer ring 2 by the sheet push rod 5, and is clamped by the sheet clamper 7.

Next, as shown in FIG. 2C, the wafer ring 2,
By driving the sheet clamper 7 and the pellet arranging belt 10 in synchronization with each other, the pellets 3 are separated from the sheet 4. In this case, since the pellet arrangement belt 10 is synchronized with the wafer ring 2 and the sheet 4, FIG.
The pellets 3 peeled off as described above can be peeled off at a time while maintaining the vertical and horizontal alignment, and then they are recognized one by one with the ITV camera,
Positioning has an advantage that only non-defective pellets can be selected and picked up.

[0012]

As described above, according to the die bonding apparatus of the present invention, the pellets attached to the sheet are separated from the single-row or multi-row sheets by peeling the sheet downward and aligned on the pellet arranging table. Since the individual positioning, recognition, and pickup are performed in this state, the tilt of the pellet at the time of pushing up is eliminated, and the position accuracy deteriorates,
No damage to the pellet due to contact with the adsorption collet. In addition, since it is not necessary to push up with a lifting needle, pellet breakage does not occur even with ultra-fine pellets such as pellets for line sensors, which not only greatly improves the manufacturing yield of semiconductor devices but also improves reliability. Has the effect.

[Brief description of drawings]

FIG. 1 is a view showing the operation of the first embodiment of the present invention, and FIGS. 1 (a) to (e) are sectional views.

FIG. 2 is a view showing the operation of the second embodiment of the present invention, and FIGS. 2 (a) to 2 (d) are sectional views.

FIG. 3 is a diagram showing an operation of a conventional die bonding apparatus, and FIGS. 3 (a) to 3 (c) are sectional views.

[Explanation of symbols]

 1 Wafer ring base 2 Wafer ring 3 Pellet 4 Sheet 5 Sheet peeling bar 6 Pellet array base 6a Pellet array base Edge part 7 Sheet clamper 8 Collet 9 Edge part 10 Pellet array belt 11 Push-up needle 12 Sleeve θ Sheet peeling angle

Claims (1)

[Claims] 1. A die bonding apparatus for bonding a semiconductor pellet to a pellet mounting portion of a lead frame or a ceramic case, a means for pushing a wafer ring having a sheet on which the pellet is attached fixed from a ring base, and an inner edge of the pushed ring. A sheet stripping bar that pushes down nearby sheets, a sheet clamper that sandwiches the stripped sheet edge part and pulls diagonally downward in synchronization with the extrusion of the wafer ring, and an edge part that strips moving pellets from the sheet, and strips A die-bonding apparatus comprising: a pellet arranging table on which the arranged pellets are placed, a means for positioning and recognizing the arranged pellets, and a suction collet for moving the pellets to the pellet mounting portion for bonding.