JP5426884B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method for peeling off an adhesive sheet in a state where a plate-like member having an adhesive sheet attached to one surface is fixed.

Conventionally, in a semiconductor manufacturing process, there is a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer) in order to reduce the size of a semiconductor chip. In this grinding process, an adhesive sheet is bonded to the wafer surface (surface on which the circuit is formed), and after the grinding process, the adhesive sheet is peeled off from the wafer. And as such a peeling method of an adhesive sheet, the method of sticking a peeling tape on an adhesive sheet and pulling this peeling tape and peeling an adhesive sheet from a wafer is proposed (for example, patent document 1). reference).
In the peeling method described in Patent Document 1, an adhesive sheet is attached to the surface of a wafer, and then an edge member is positioned on substantially the same plane as the adhesive sheet on the outside of the wafer. Then, the edge member is moved toward the center of the wafer, and when the tip of the edge member reaches the end of the wafer, that is, the peeling start portion of the adhesive sheet, the edge member is moved upward. In other words, by pressing the adhesive sheet and wafer with the edge member at the peeling start portion where the peeling resistance is highest, even when the wafer thickness is thin, there is no burden on the wafer when peeling the adhesive sheet It can be peeled off.

JP 2005-197429 A

  However, in the peeling method as described in Patent Document 1, there is fine control to move the edge member upward when the edge member reaches the peeling start position of the adhesive sheet, and the timing of the upward movement of the edge member is too early. Then, the force in the direction in which the adhesive sheet is not peeled off from the wafer but is also peeled off acts greatly, and the wafer is broken and the circuit provided in the surface is broken.

  The present invention has been devised paying attention to the inconveniences as described above, and the object thereof is a sheet peeling apparatus capable of avoiding unintentional breakage of the plate-like member when peeling the adhesive sheet from the plate-like member. And providing a peeling method.

In order to achieve the above object, the sheet peeling apparatus of the present invention is a sheet peeling apparatus that peels off the adhesive sheet in a state where a plate-like member having an adhesive sheet affixed on one surface is fixed. At least the separable part forming means for forming a separable part that is separable from a part other than the outer edge part, and the separable part and the adhesive sheet attached to the separable part. Separation means comprising: holding means for holding an adhesive sheet as a held portion; and moving means for moving the held portion relative to the plate-like member to separate the adhesive sheet from the plate-like member parts forming means adopts a structure wherein a cutting means for forming a separable part, called by an incision on the other surface of the plate-like member in which the adhesive sheet is attached to the one surface It is.
Another sheet peeling apparatus of the present invention is a sheet peeling apparatus that peels off the adhesive sheet in a state where a plate-like member having an adhesive sheet affixed on one surface is fixed, and an outer edge portion of the plate-like member At least the adhesive sheet of the separable part forming means that forms a separable part separable from a part other than the outer edge part, and the separable part and the adhesive sheet attached to the separable part. The separable part forming means comprises: holding means for holding as a held part; and moving means for moving the held part relative to the plate-like member to peel the adhesive sheet from the plate-like member. irradiates the adhesive sheet laser light to the plate-like member which is attached to the one surface, a laser irradiation unit for forming the separable portion by the irradiated portion fragile, gutter It has adopted the configuration.

In this case, a sheet peeling apparatus of the present invention preferably includes a separable portion removing means for removing from the adhesive sheet the separable portion formed in the previous SL separable portion forming means.

On the other hand, the sheet peeling method of the present invention is a sheet peeling method in which the adhesive sheet is peeled in a state where a plate-like member having an adhesive sheet affixed on one surface is fixed, and the adhesive sheet is on the one surface. Using the affixed plate-like member, the separable part consisting of the outer edge portion of the plate-like member, which is separable from the part other than the outer edge portion, of the plate-like member having the adhesive sheet affixed to the one surface A separable part forming step formed by making a cut on the other surface , and a step of holding at least the adhesive sheet as a held part among the separable part and the adhesive sheet affixed to the separable part; And a moving step of peeling the adhesive sheet from the plate-like member by moving the held portion relative to the plate-like member.
Further, another sheet peeling method of the present invention is a sheet peeling method in which the adhesive sheet is peeled in a state where a plate-like member having an adhesive sheet affixed to one surface is fixed, and the adhesive is bonded to the one surface. Using the plate-like member to which the sheet is affixed, the detachable part that is composed of the outer edge portion of the plate-like member and is separable from the portion other than the outer edge portion, the plate having the adhesive sheet affixed to the one surface At least the adhesion among the separable part forming step formed by irradiating the shaped member with laser light and weakening the irradiated part, and the separable part and the adhesive sheet attached to the separable part Adopting a configuration comprising a step of holding a sheet as a held portion, and a moving step of moving the held portion relative to the plate-like member and peeling the adhesive sheet from the plate-like member. The That.

  At this time, the sheet peeling method of the present invention preferably includes a step of removing the separable portion formed in the separable portion forming step from the adhesive sheet before peeling the adhesive sheet in the moving step. .

  According to the present invention as described above, a separable portion including an outer edge portion is formed on a plate-like member, and at least the adhesive sheet is held among the separable portion and the adhesive sheet attached to the separable portion. It holds as a part and peels an adhesive sheet by moving an adhesive sheet and a plate-shaped member relatively. For this reason, when the held portion is moved relative to the plate-like member, the adhesive sheet can be peeled off from the portion attached to the end of the plate-like member, and the plate-like member is cracked. There is no. Therefore, it is possible to avoid unintended damage of the plate member when the adhesive sheet is peeled from the plate member without fine control.

Further, if the separable part is formed by cutting the plate-like member with the cutting means, the separable part can be formed by a simple process of making the cut, and the configuration is complicated and the cost of the apparatus can be suppressed.
Furthermore, if the separable portion is formed by irradiating the plate-like member with a laser beam by the laser irradiation means to make it weak, the mechanical force is not applied to the plate-like member, and the separable portion is formed. Damage to the plate-like member can be suppressed. Further, since the laser beam can be irradiated from the side where the adhesive sheet is affixed, it is not necessary to reverse the plate-like member in order to peel the adhesive sheet.
And if a separable part is removed from an adhesive sheet before peeling an adhesive sheet, even if it discards the peeled adhesive sheet as it is, an environmental load will not be given.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic plan view showing a semiconductor wafer sheet peeling apparatus 1. FIG. 2 is a partial cross-sectional view showing a cutting device constituting the sheet peeling apparatus 1, and FIG. 3 is a partial cross-sectional view showing the peeling apparatus 3 constituting the sheet peeling apparatus 1.
In these drawings, a sheet peeling apparatus 1 is an apparatus for peeling an adhesive sheet S attached to a surface WA (see FIG. 2) of a wafer W as a plate-like member. The sheet peeling device 1 includes a cutting device 2 that forms a separable portion WC with the back surface WB of the wafer W facing up, and a peeling device 3 that peels the adhesive sheet S with the surface WA of the wafer W facing up. And a transfer device 4 configured to transfer the wafer W processed by the cutting device 2 upside down and transferred to the peeling device 3 by a transfer robot or the like.

As shown in FIG. 2, the cutting device 2 has a substantially box-shaped table 10 for fixing the wafer W from the adhesive sheet S side, and a separation unit WC for cutting the wafer W fixed by the table 10 to form a separable part WC. A cutting means 20 as a possible part forming means and a separable part removing means 30 for removing the separable part WC formed by the cutting means 20 from the adhesive sheet S are configured.
A plurality of suction ports 11 for sucking the wafer W are provided on one surface portion constituting the table 10.
The cutting means 20 has a single-axis robot 22 having a slider 21 that can move in the Z-axis direction (vertical direction in FIG. 2) and a slider 23 that can move in the Y-axis direction (perpendicular to the plane of FIG. 2). A single-axis robot 24 attached to the slider 21 of the axial robot 22, a motor 25 attached to the slider 23, and a rotary blade 26 attached to the output shaft of the motor 25 are configured. The rotary blade 26 is provided so that the cutting position of the wafer W is positioned 2.5 mm inside from the outer edge of the wafer W. Here, a region that is 3 mm from the outer edge of the wafer W corresponds to a portion where no circuit or the like is provided on the wafer W.
The separable part removing means 30 includes a suction pad 31 that sucks the separable part WC, a substantially U-shaped holding member 32 that holds the suction pad 31, and a cylinder 33 that moves the holding member 32 in the Z-axis direction. And is configured.

As shown in FIG. 3, the peeling device 3 holds a substantially box-shaped table 40 that fixes the wafer W from the back surface WB side, and a held portion SA that is bonded to the separable portion WC in the adhesive sheet S. A means 50 and a moving means 60 for moving the held portion SA relative to the wafer W are provided.
A plurality of suction ports 41 for sucking the wafer W are provided on one surface portion (upper surface in FIG. 3) constituting the table 40.
The holding means 50 includes a suction pad 51 that sucks the held portion SA, a cylinder 52 that supports the suction pad 51 so as to reciprocate, a holding member 53 that holds the cylinder 52, and the holding member 53 that is attached to the Y axis. And a pressing member 55 that moves in the X-axis direction (left-right direction in FIG. 3) by the slider 56A of the single-axis robot 56 and presses the held portion SA against the suction pad 51. Configured.
The rotating device 54 and the single-axis robot 56 are provided on a slider 63 described later of the moving unit 60.

  The moving means 60 is a single-axis robot 62 having a slider 61 that is attached to the lower surface of the table 40 and is movable in the X-axis direction, and a slider 63 that is provided above the table 40 and is movable in the X-axis direction. 64.

Next, the operation of the sheet peeling apparatus 1 will be described with reference to FIGS. 4 to 5 as a method for peeling the adhesive sheet S in the present embodiment.
As a procedure for peeling the adhesive sheet S from the wafer W, first, the cutting device 2 has the suction pad 31 positioned at the upper position shown by the solid line in FIG. The wafer W placed in such a manner is sucked from the suction port 11 to fix the wafer W. Next, the rotary blade 26 is rotated by the motor 25, and the rotary blade 26 is moved downward by the single-axis robot 22 and brought into contact with the cutting start position T of the cut forming portion shown in FIG. Then, the cutting device 2 forms a cut from the back surface WB to the front surface WA by moving the rotary blade 26 downward in FIG. A D-plate-shaped separable part WC is formed (separable part forming step). Thereafter, as shown in FIG. 4, the rotary blade 26 is moved upward by the single-axis robot 22.
Next, the cutting device 2 moves the suction pad 31 to a lower position indicated by a two-dot chain line in FIG. 2 by the cylinder 33 and sucks the separable portion WC with the suction pad 31. Then, as shown in FIG. 4, the separable portion WC sucked by the suction pad 31 is separated from the adhesive sheet S by moving the suction pad 31 upward by the cylinder 33.
Thereafter, the transport device 4 transports the wafer W from which the separable portion WC has been removed upside down and transports it onto the table 40 of the peeling device 3 so that the adhesive sheet S is on the upper side of the wafer W.

  As shown in FIG. 3, the peeling apparatus 3 has the wafer transferred to the table 40 in a state where the suction pad 51 is positioned at an upper position indicated by a solid line and the holding means 50 is positioned outside the surface of the wafer W. W is sucked from the suction port 41 to fix the wafer W. Next, the peeling device 3 moves the holding means 50 by the single-axis robot 64 and positions the suction pad 51 above the held portion SA of the adhesive sheet S. Then, the suction pad 51 is moved to a lower position indicated by a two-dot chain line in FIG. 3 by the cylinder 52, and the held portion SA is sucked and held by the suction pad 51. Thereafter, as shown in FIG. 5 (A), the held member SA is raised by rotating the holding member 53 by the rotation device 54. Next, the peeling device 3 moves the pressing member 55 to the right side by the single-axis robot 56 and presses the held portion SA against the suction pad 51. Accordingly, the held portion SA is sandwiched between the suction pad 51 and the pressing member 55, and the held portion SA can be prevented from being detached from the suction pad 51 when the adhesive sheet S is peeled off. Then, as shown in FIG. 5B, the table 40 is moved to the left by the single-axis robot 62, and the holding means 50 is moved to the right by the single-axis robot 64, whereby the adhesive sheet S is peeled off. Then, when the adhesive sheet S is completely peeled off, the operation is terminated.

According to the present embodiment as described above, the following effects are obtained.
That is, the sheet peeling apparatus 1 forms a separable portion WC composed of the outer edge portion on the wafer W, holds the held portion SA attached to the separable portion WC in the adhesive sheet S, and holds the held portion SA. And the wafer W are moved relative to each other to peel off the adhesive sheet S. For this reason, peeling of the adhesive sheet S is started from the portion attached to the end WD (see FIG. 5A) of the wafer W by holding the held portion SA outside the surface of the wafer W. The wafer W is not broken. Therefore, unintentional breakage of the wafer W at the time of peeling of the adhesive sheet S can be prevented without fine control.

  Further, since the separable part WC is formed by cutting the wafer W with the rotary blade 26, the separable part WC can be formed by a simple process, and the complexity of the configuration and the cost increase of the apparatus can be suppressed. Furthermore, since the separable part WC is removed from the adhesive sheet S before the adhesive sheet S is peeled off, even if the peeled adhesive sheet S is discarded as it is, no environmental load is given.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, although the case where the plate-like member is a semiconductor wafer has been described in the above-described embodiment, the plate-like member is not limited to the semiconductor wafer W, and other objects such as a glass plate, a steel plate, or a resin plate are used. It can also be used as a target, and the semiconductor wafer can be exemplified by a silicon wafer, a compound wafer, etc., and a peeling device or a peeling method for peeling an adhesive sheet (sheet, film, tape, etc.) affixed to the plate member. The present invention can also be applied to.
Moreover, although the case where the separable portion WC and the held portion SA are sucked and held has been illustrated in the above embodiment, a configuration in which the detachable portion WC and the held portion SA are held by attaching a peeling tape can be employed. Further, the held portion SA can be held only by suction of the suction pad 51 without providing the pressing member 55. Further, in the above-described embodiment, the separable portion WC is formed by the notch reaching the front surface WA from the back surface WB of the wafer W. However, the separable portion WC is formed by the notch not reaching the front surface WA of the wafer W. The separable part WC can be bent along the cut so as to be separated from the wafer W. Moreover, the moving means 60 can peel the adhesive sheet S by moving only the table 40 or the holding means 50. Further, the cutting means 20 and the separable part removing means 30 are provided on the table 10 of the cutting apparatus 2, and the holding means 50 and the moving means 60 are provided on the table 40 of the peeling apparatus 3. The cutting means 20, the separable part removing means 30, the holding means 50, and the moving means 60 can be provided on one table.

And the laser irradiation means 70 as a separable part formation means as shown in FIG. 6 is applicable. The laser irradiation means 70 is provided with a laser light source 71 instead of the rotary blade 26 and the motor 25 of the cutting means 20 of the above embodiment, and a holding member 72 that holds the laser light source 71 and is attached to the slider 23. It has a configuration. Then, the laser irradiation means 70 emits the laser light L from the laser light source 71 and moves the laser light source 71 in the Y-axis direction to form a fragile portion J along the Y-axis direction in the wafer W. In other words, by folding along the fragile portion J, a substantially D-shaped separable portion WC that consists of the outer edge portion of the wafer W and is separable from the wafer W is formed. With such a configuration, no mechanical force is applied to the wafer W, and breakage of the plate-like member when the separable portion WC is formed can be suppressed.
Further, without providing the separable portion removing means 30 in the cutting device 2, the holding means 50 can hold the adhesive sheet S and the separable portion WC as the held portion SA.

1 is a schematic plan view of a sheet peeling apparatus according to an embodiment of the present invention. The fragmentary sectional view of a cutting device. The fragmentary sectional view of a peeling apparatus. Operation | movement explanatory drawing of a cutting device. (A), (B) is operation | movement explanatory drawing of a peeling apparatus. The fragmentary sectional view which shows the separable part formation means which concerns on the modification of this invention.

1 Sheet peeling device 20 Cutting means (separable part forming means)
30 Separable part removing means 50 Holding means 60 Moving means 70 Laser irradiation means (separable part forming means)
S Adhesive sheet SA Holding part W Wafer (Semiconductor wafer, plate-like member)
WC separable part

Claims (6)

A sheet peeling apparatus for peeling the adhesive sheet in a state where a plate-like member having an adhesive sheet attached to one surface is fixed,
A separable part forming means comprising an outer edge part of the plate-like member and forming a separable part separable from parts other than the outer edge part;
A holding means for holding at least the adhesive sheet as a held part among the separable part and the adhesive sheet affixed to the separable part;
A moving means for moving the held portion relative to the plate-like member and peeling the adhesive sheet from the plate-like member;
The separable part forming means is a cutting means for forming the separable part by making a cut in the other surface of the plate-like member having the adhesive sheet pasted on the one surface. Sheet peeling device. A sheet peeling apparatus for peeling the adhesive sheet in a state where a plate-like member having an adhesive sheet attached to one surface is fixed,
A separable part forming means comprising an outer edge part of the plate-like member and forming a separable part separable from parts other than the outer edge part;
A holding means for holding at least the adhesive sheet as a held part among the separable part and the adhesive sheet affixed to the separable part;
A moving means for moving the held portion relative to the plate-like member and peeling the adhesive sheet from the plate-like member;
The separable portion forming means irradiates the plate-like member having the adhesive sheet affixed to the one surface with laser light, and weakens the irradiated portion to form the separable portion. A sheet peeling apparatus characterized by being a means.   The sheet peeling apparatus according to claim 1, further comprising a separable part removing unit that removes the separable part formed by the separable part forming unit from the adhesive sheet. A sheet peeling method for peeling the adhesive sheet in a state where a plate-like member having an adhesive sheet attached to one surface is fixed,
Using a plate-like member with the adhesive sheet affixed to the one surface , a separable portion consisting of an outer edge portion of the plate-like member and separable from a portion other than the outer edge portion is bonded to the one surface. A separable part forming step that is formed by making a cut in the other surface of the plate-like member to which the sheet is attached ;
A step of holding at least the adhesive sheet as a held portion among the separable portion and the adhesive sheet affixed to the separable portion;
A sheet peeling method comprising: moving the held portion relative to the plate-like member to peel the adhesive sheet from the plate-like member. A sheet peeling method for peeling the adhesive sheet in a state where a plate-like member having an adhesive sheet attached to one surface is fixed,
Using a plate-like member with the adhesive sheet affixed to the one surface , a separable portion consisting of an outer edge portion of the plate-like member and separable from a portion other than the outer edge portion is bonded to the one surface. A separable part forming step in which the plate-like member to which the sheet is attached is irradiated with a laser beam to make the irradiated part fragile, and
A step of holding at least the adhesive sheet as a held portion among the separable portion and the adhesive sheet affixed to the separable portion;
A sheet peeling method comprising: moving the held portion relative to the plate-like member to peel the adhesive sheet from the plate-like member.   6. The method according to claim 4, further comprising a step of removing the separable portion formed in the separable portion forming step from the adhesive sheet before peeling the adhesive sheet in the moving step. Sheet peeling method.

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