JPWO2007040204A1 - 感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法 - Google Patents
感光性樹脂組成物、感光性エレメント、及びプリント配線板の製造方法 Download PDFInfo
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- JPWO2007040204A1 JPWO2007040204A1 JP2007538756A JP2007538756A JPWO2007040204A1 JP WO2007040204 A1 JPWO2007040204 A1 JP WO2007040204A1 JP 2007538756 A JP2007538756 A JP 2007538756A JP 2007538756 A JP2007538756 A JP 2007538756A JP WO2007040204 A1 JPWO2007040204 A1 JP WO2007040204A1
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 235000011180 diphosphates Nutrition 0.000 description 1
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- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
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- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
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- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
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- 239000003112 inhibitor Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
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- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
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- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
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- 239000012046 mixed solvent Substances 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
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- 238000000016 photochemical curing Methods 0.000 description 1
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- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
タ)アクリル酸とはアクリル酸及びそれに対応するメタクリル酸を意味し、(メタ)アクリレートとはアクリレート及びそれに対応するメタクリレートを意味し、(メタ)アクリロイル基とはアクリロイル基及びそれに対応するメタクリロイル基を意味する。
(バインダーポリマー1の合成)
メタクリル酸、メタクリル酸メチル及びスチレンを質量比28:60:12の割合で共重合させ、重量平均分子量60000、ガラス転移温度124℃、酸価68mgKOH/gの共重合体(バインダーポリマー1)を得た。該バインダーポリマー1を、メチルセルソルブ/トルエン(6:4、質量比)に不揮発成分(固形分)50質量%になるように溶解させ、バインダーポリマー1の溶液を得た。
(GPC測定条件)
・ポンプ:日立L−6000型[(株)日立製作所製]
・カラム:GelpackGL−R420+GelpackGL−R430+GelpackGL−R440(計3本)(以上、日立化成工業(株)製、商品名)
・溶離液:テトラヒドロフラン
・測定温度:室温
・流量:2.05mL/分
・検出器:日立L−3300型RI[(株)日立製作所製]
2:ビスフェノールAポリエキシエチレンジメタクリレート:新中村化学工業(株)製商品名(一般式(1)の化合物において、R1がメチル基、X1及びX2がエチレン基、p+qの平均値が約10)
3:ビスフェノールAポリエキシエチレンジメタクリレート:新中村化学工業(株)製商品名(一般式(1)の化合物において、R1がメチル基、X1及びX2がエチレン基、p+qの平均値が約30)
4:エトキシ化トリメチロールプロパントリアクリレート:日本化薬(株)製品名(一般式(2)の化合物において、R3、R4及びR5が水素原子、X3、X4及びX5がエチレン基、k+m+nの平均値が約9)
5:ノニルフェニルポリエチレングリコールアクリレート:東亜合成(株)製品名(一般式(3)の化合物において、R6が水素原子、X6がエチレン基、rの平均値が約4)
6:ノニルフェニルポリエチレングリコールアクリレート:新中村化学(株)製品名(一般式(3)の化合物において、R6が水素原子、X6がエチレン基、rの平均値が約8)
7:ポリプロピレングリコールジアクリレート:新中村化学(株)製品名:新中村化学(株)製品名
8:トリメチロールプロパントリアクリレート:新中村化学(株)製品名
実施例1〜8及び比較例1〜4の感光性樹脂組成物の溶液を、16μm厚のポリエチレンテレフタレートフィルム(ヘーズ:1.7%、商品名GS−16、帝人(株)製)上に均一に塗布し、100℃の熱風対流式乾燥機で10分間乾燥した後、ポリエチレン製保護フィルムで保護し感光性エレメントを得た。感光層の乾燥後の膜厚は、50μmであった。
縦12.5cm横20cm厚さ1.6mmの両面銅張りエポキシ積層板(日立化成工業(株)製、商品名:MCL−E−61)の片面の銅箔表面に、周縁部1cmを残して、所定のパターンを有するエッチングレジストを形成した。エッチングレジストに覆われていない部分の銅箔をエッチング除去し、金属端子(パッド)や配線を有する回路パターンを形成した。残りのエッチングレジストを剥離して、回路形成済基板を得た。裏面は全面エッチングし、ガラスエポキシ表面が露出した状態にした。
得られた回路形成済基板の回路面に、フォトレジスト(太陽インキ製造(株)製、商品名:PSR−4000)を、周縁部1cmを残して全面に塗布し、80℃で30分間乾燥した。その後、フォトツールを介し、露光機((株)オーク製作所製、商品名:HMW−590)を用いて、めっきする実装パッド部を除く全面を露光した。未露光部分を1質量%炭酸ナトリウム水溶液(30℃)で60秒間スプレー現像し、パッド部上のフォトレジストを除去して、パターンを形成し、その後、150℃で1時間加熱することにより熱硬化させ、回路形成済基板上に表面樹脂層(ソルダーレジスト)を形成した。
表面樹脂層を備えた回路形成済基板の両面に、実施例1〜8及び比較例1〜4で得られた感光性エレメントの感光層(感光性樹脂組成物層)を、圧力0.4MPa、温度110℃、ラミネート速度1.5m/分でラミネートし、積層した。積層された感光層のうち、無電解めっき加工を行う回路パターンを除く全面を露光し、1質量%炭酸ナトリウム水溶液(30℃)で80秒間スプレー現像して硬化物層(レジストパターン)を形成した。
実施例1〜8及び比較例1〜4で得られた積層基板を、Pro Select SF(アトテックジャパン(株)製、商品名)に、50℃にて5分間浸漬し、脱脂処理を行った。室温にて1分間流水で洗浄後、Micro Etch SF(アトテックジャパン(株)製、商品名)に30℃にて1分間浸漬し、ソフトエッチング処理を行った。室温にて1分間流水で洗浄後、5%硫酸溶液に室温にて1分間浸漬し、酸洗処理を行った。
判定基準
A:全面破れ及び膨れなし B:一部破れ及び膨れ有り C:全面破れ及び膨れ有り
縦4cm横5cm厚さ1.6mmの両面銅張りエポキシ積層板(日立化成工業(株)製、商品名:MCL−E−61)の片面に、フォトレジスト(太陽インキ製造(株)製、PSR−4000)を全面塗布し、80℃で30分間乾燥した。
剥離性評価後の上記評価用積層板を用いて、表面樹脂層(ソルダーレジスト)の開口部の側壁(横2.6mm縦0.8mm高さ30μm)に、完全に剥離できずに付着している硬化物層の付着面積を観察した。付着面積の観察には、SEM(日立計測器サービス(株)製SE−2100)を用いた。得られた付着面積を、上記開口部の側壁面積(2.6mm×0.8mm×30μm)で割った値を求め、ランダムに選択した5箇所の上記開口部について得られた値の平均値を、硬化物層の残渣(レジスト残渣)の割合とした。得られたレジスト残渣の割合によって、下記基準のようにレジスト剥離残りを評価した。評価結果を表3及び表4に示す。なお、レジスト残渣が少ないほど良好であることを意味する。
基準
A:レジスト残渣が10%未満 B:レジスト残渣が10%以上50%未満 C:レジスト残渣が50%以上
実施例1〜8及び比較例1〜4で得られた感光性エレメント0.5m2を、PETフィルム及びポリエチレンフィルムを剥がした後、Ni−Pめっき液オーロテックHP(アトテックジャパン(株)製、商品名)に83℃にて5時間浸漬し、無電解Niめっき処理を行った。
めっき浴汚染性(%)=各試料の析出膜厚(μm)/ブランクの析出膜厚(μm)
実施例1〜8及び比較例1〜4から得られた感光性エレメントにおける感光層を、圧力0.4MPa、温度110℃、ラミネート速度1.5m/分の条件で上記銅張り積層板にラミネートし、積層した。得られた積層体の上に、ネガとしてストーファー21段ステップタブレットを置いて、高圧水銀灯ランプを有する露光機((株)オーク製作所製、201GX)を用いて、上記と同様の現像条件において、21段ステップタブレットの8.0段を硬化させるのに必要な露光エネルギー量(mJ/cm2)によって感度を評価した。評価結果を表3及び表4に示す。なお、露光エネルギー量が低いほど感度が高いことを意味する。
Claims (7)
- (A)バインダーポリマー、(B)重合可能なエチレン性不飽和基を有する光重合性化合物及び(C)光重合開始剤を含有する感光性樹脂組成物であって、
(B)成分が、
下記一般式(1)で表されるビスフェノールA系(メタ)アクリレート化合物、
下記一般式(2)で表されるアルコキシ化トリメチロールプロパントリ(メタ)アクリレート化合物、及び
下記一般式(3)で表されるノニルフェニルポリアルキレングリコール(メタ)アクリレート化合物を含む、感光性樹脂組成物。
式(2)中、X3、X4及びX5はそれぞれ独立に炭素数2〜6のアルキレン基を示し、R3、R4及びR5はそれぞれ独立に水素原子又はメチル基を示し、k、m及びnはk+m+n=3〜30となる正の整数を示し、
式(3)中、X6は炭素数2〜6のアルキレン基を示し、R6は水素原子又はメチル基を示し、rは1〜20の整数を示す。] - (C)成分が2,4,5−トリアリールイミダゾール二量体を含む、請求項1記載の感光性樹脂組成物。
- (A)成分及び(B)成分の合計量を100質量部としたときに、
(A)成分の量が40〜80質量部であり、
(B)成分の量が20〜60質量部であり、
(C)成分の量が0.1〜20質量部である、請求項1記載の感光性樹脂組成物。 - 支持体と、該支持体上に設けられた請求項1〜3のいずれか一項に記載の感光性樹脂組成物からなる感光層と、を備える感光性エレメント。
- 前記感光層は、波長365nmの紫外線に対する透過率が5〜75%である、請求項4記載の感光性エレメント。
- 回路形成用基板及び該回路形成用基板上に形成されている回路パターンを有する回路形成済基板と該回路形成済基板上において前記回路パターンが露出するように形成されている表面樹脂層とを備える第1の積層基板の前記表面樹脂層側の面上に、請求項1〜3のいずれか一項に記載の感光性樹脂組成物からなり予め成形された感光層を積層する第1の工程と、
前記感光層の所定部分に活性光線を照射してから現像してパターニングされた硬化物層を形成させ、前記回路形成済基板上に前記表面樹脂層及び前記硬化物層をこの順に備えた第2の積層基板を得る第2の工程と、
前記第2の積層基板に対して無電解めっきを行って前記回路パターン上にめっき層を形成する第3の工程と、
を備えるプリント配線板の製造方法。 - 前記硬化物層が、前記回路パターンの一部が露出するようにパターニングされ、前記回路パターンの露出している部分の全面に前記めっき層を形成する、請求項6記載の製造方法。
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