JPWO2006080301A1 - 電子部品実装配線体および電子部品実装構造体 - Google Patents
電子部品実装配線体および電子部品実装構造体 Download PDFInfo
- Publication number
- JPWO2006080301A1 JPWO2006080301A1 JP2007500514A JP2007500514A JPWO2006080301A1 JP WO2006080301 A1 JPWO2006080301 A1 JP WO2006080301A1 JP 2007500514 A JP2007500514 A JP 2007500514A JP 2007500514 A JP2007500514 A JP 2007500514A JP WO2006080301 A1 JPWO2006080301 A1 JP WO2006080301A1
- Authority
- JP
- Japan
- Prior art keywords
- wiring body
- electronic component
- component mounting
- flat wiring
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Abstract
Description
2 フラット配線体
3 フラット導体
4 絶縁被覆
5 折曲部
6 給電線
6a 導体
6b 絶縁被覆
7 ピアス端子
7a 背板部
7b 突き刺し片
7c インシュレーションバレル
7d 圧着バレル
8 回路切断部
9 配列方向変換折曲部
9a 山折部
9b 谷折部
10 電子部品実装配線体
20 電子部品
21 発光素子
22 リード
23 接続子
23a 背板部
23b 突き刺し片
23c せん断部
30 ベース構造体
31、31a、31b、31c ベース部材
32 連結部材
33 孔
34 スリット
34a 切欠
35 係止部
36 嵌合柱
37 配列方向変換部
40 リフレクタ
41 挿通孔
42 突起
50 折り目
Claims (10)
- 多数の電子部品が実装されたフラット配線体と、
前記フラット配線体が取り付けられる複数のベース部材とを備え、
前記フラット配線体は、前記電子部品の配列方向が変換されるように折り曲げられて形成される配列方向変換折曲部を有し、
前記ベース部材は、前記配列方向変換折曲部を固定する配列方向変換部を有する電子部品実装配線体。 - 前記複数のベース部材が同一形状であることを特徴とする請求項1に記載の電子部品実装配線体。
- 前記フラット配線体には、後に折り曲げ加工される折曲部に予め折り目が形成されていることを特徴とする請求項1に記載の電子部品実装配線体。
- 前記電子部品が発光ダイオードであることを特徴とする請求項1〜3の何れか1項に記載の電子部品実装配線体。
- 前記フラット配線体の一部に給電線およびピアス端子が接続されており、前記ピアス端子が前記給電線と前記フラット配線体を電気的および機械的に接続することを特徴とする請求項1〜4の何れか1項に記載の電子部品実装配線体。
- 前記電子部品と前記フラット配線体は、背板部および突き刺し片からなる接続子によって電気的および機械的に接続されていることを特徴とする請求項1に記載の電子部品実装配線体。
- 前記電子部品のリードと、前記接続子の前記背板部がせん断接合によって一括接合されていることを特徴とする請求項6に記載の電子部品実装配線体。
- 前記ベース構造体に、前記フラット配線体上に実装された前記電子部品が配置される孔が設けられていることを特徴とする請求項1〜7の何れか1項に記載の電子部品実装配線体。
- 前記ベース部材に、前記フラット配線体の折曲部を固定する固定構造を備えていることを特徴とする、請求項1に記載の電子部品実装配線体。
- 多数の電子部品が実装されたフラット配線体と、
前記フラット配線体が取り付けられる複数のベース部材とを備え、
前記フラット配線体は、前記電子部品の配列方向が変換されるように折り曲げられて形成される配列方向変換折曲部を有し、
前記ベース部材は、前記配列方向変換折曲部を固定する配列方向変換部を有する電子部品実装配線体を立体形状に組み立てた電子部品実装構造体であって、
前記複数のベース部材間を連結する連結部材を用いて立体形状に組み立てられていることを特徴とする電子部品実装構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005016379 | 2005-01-25 | ||
JP2005016379 | 2005-01-25 | ||
PCT/JP2006/301032 WO2006080301A1 (ja) | 2005-01-25 | 2006-01-24 | 電子部品実装配線体および電子部品実装構造体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2006080301A1 true JPWO2006080301A1 (ja) | 2008-06-19 |
Family
ID=36740329
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007500511A Active JP4927703B2 (ja) | 2005-01-25 | 2006-01-24 | 電子部品実装立体配線体および電子部品実装構造体 |
JP2007500514A Pending JPWO2006080301A1 (ja) | 2005-01-25 | 2006-01-24 | 電子部品実装配線体および電子部品実装構造体 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007500511A Active JP4927703B2 (ja) | 2005-01-25 | 2006-01-24 | 電子部品実装立体配線体および電子部品実装構造体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090009977A1 (ja) |
EP (2) | EP1853095A4 (ja) |
JP (2) | JP4927703B2 (ja) |
CN (2) | CN101107890A (ja) |
WO (2) | WO2006080298A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009105027A (ja) * | 2007-10-02 | 2009-05-14 | Fukui Byora Co Ltd | 導電性繊維と電気的接合可能なコネクタ |
JPWO2009118935A1 (ja) * | 2008-03-26 | 2011-07-21 | イビデン株式会社 | フレックスリジッド配線板及びその製造方法 |
FR2936678B1 (fr) * | 2008-09-29 | 2010-11-05 | Cemm Thome | Lampe a diode electroluminescente |
WO2013078180A1 (en) * | 2011-11-23 | 2013-05-30 | 3M Innovative Properties Company | Flexible light emitting semiconductor device having a three dimensional structure |
MX2012001219A (es) * | 2012-01-27 | 2013-07-29 | Cemm Mex S A De C V | Modulo para lampara de led. |
WO2014177625A1 (en) * | 2013-05-03 | 2014-11-06 | Koninklijke Philips N.V. | Circuit board comprising at least one fold |
JP6110267B2 (ja) * | 2013-09-30 | 2017-04-05 | 積水化学工業株式会社 | 圧電センサ構造体 |
KR102303584B1 (ko) | 2013-07-10 | 2021-09-17 | 세키스이가가쿠 고교가부시키가이샤 | 압전 센서 |
JP2016085952A (ja) * | 2014-10-29 | 2016-05-19 | 京セラドキュメントソリューションズ株式会社 | フラットケーブルおよびそれを備えた画像形成装置ならびにフラットケーブルの曲げ方法 |
FR3030687B1 (fr) * | 2014-12-19 | 2017-01-27 | Valeo Vision | Dispositif d'eclairage et/ou de signalisation comportant une pluralite de diodes electroluminescentes |
JP6796764B2 (ja) * | 2016-09-13 | 2020-12-09 | パナソニックIpマネジメント株式会社 | 実装基台、発光装置、移動体用照明装置及び移動体 |
US11791064B2 (en) | 2018-12-17 | 2023-10-17 | Sumitomo Wiring Systems, Ltd. | Wiring member and attachment structure of wiring member |
JP7314793B2 (ja) * | 2019-12-20 | 2023-07-26 | 株式会社オートネットワーク技術研究所 | 配線部材 |
Citations (5)
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JPH0636620A (ja) * | 1992-07-14 | 1994-02-10 | Nec Gumma Ltd | フレキシブルフラットケーブル |
JPH089543A (ja) * | 1994-06-16 | 1996-01-12 | Yazaki Corp | フラットケーブル用方向転換具 |
JP2003203703A (ja) * | 2002-01-09 | 2003-07-18 | Auto Network Gijutsu Kenkyusho:Kk | 端子とフラット配線材の接続方法及び接続構造 |
JP2004247281A (ja) * | 2003-01-20 | 2004-09-02 | Furukawa Electric Co Ltd:The | 電子部品又は電装品実装配線体及びその組付け方法 |
JP2005209623A (ja) * | 2003-12-26 | 2005-08-04 | Furukawa Electric Co Ltd:The | 電子部品とフラットケーブルの接続構造並びに接続方法及び装置 |
Family Cites Families (13)
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JPS58105162A (ja) * | 1981-11-26 | 1983-06-22 | Konishiroku Photo Ind Co Ltd | 磁性トナ− |
JPS58105162U (ja) * | 1982-01-07 | 1983-07-18 | パイオニア株式会社 | フレキシブル基板 |
JPH02115286U (ja) * | 1989-03-02 | 1990-09-14 | ||
FR2680860B1 (fr) * | 1991-09-02 | 1997-07-04 | Valeo Vision | Element de support, notamment pour feu de signalisation de vehicule automobile et son procede de fabrication. |
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EP1002696B1 (en) * | 1998-11-17 | 2007-08-01 | Ichikoh Industries Limited | Light emitting diode mounting structure |
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JP2003142796A (ja) * | 2001-10-31 | 2003-05-16 | Furukawa Electric Co Ltd:The | 配線回路体への電子部品の実装方法及び実装構造 |
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JP2006127963A (ja) * | 2004-10-29 | 2006-05-18 | Hitachi Ltd | 配光制御デバイス |
-
2006
- 2006-01-24 CN CNA2006800031906A patent/CN101107890A/zh active Pending
- 2006-01-24 JP JP2007500511A patent/JP4927703B2/ja active Active
- 2006-01-24 JP JP2007500514A patent/JPWO2006080301A1/ja active Pending
- 2006-01-24 EP EP06712245A patent/EP1853095A4/en not_active Withdrawn
- 2006-01-24 EP EP06712248A patent/EP1858306A4/en not_active Withdrawn
- 2006-01-24 US US11/883,137 patent/US20090009977A1/en not_active Abandoned
- 2006-01-24 CN CNA2006800031893A patent/CN101107889A/zh active Pending
- 2006-01-24 WO PCT/JP2006/301029 patent/WO2006080298A1/ja active Application Filing
- 2006-01-24 WO PCT/JP2006/301032 patent/WO2006080301A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0636620A (ja) * | 1992-07-14 | 1994-02-10 | Nec Gumma Ltd | フレキシブルフラットケーブル |
JPH089543A (ja) * | 1994-06-16 | 1996-01-12 | Yazaki Corp | フラットケーブル用方向転換具 |
JP2003203703A (ja) * | 2002-01-09 | 2003-07-18 | Auto Network Gijutsu Kenkyusho:Kk | 端子とフラット配線材の接続方法及び接続構造 |
JP2004247281A (ja) * | 2003-01-20 | 2004-09-02 | Furukawa Electric Co Ltd:The | 電子部品又は電装品実装配線体及びその組付け方法 |
JP2005209623A (ja) * | 2003-12-26 | 2005-08-04 | Furukawa Electric Co Ltd:The | 電子部品とフラットケーブルの接続構造並びに接続方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101107889A (zh) | 2008-01-16 |
JPWO2006080298A1 (ja) | 2008-06-19 |
CN101107890A (zh) | 2008-01-16 |
WO2006080301A1 (ja) | 2006-08-03 |
EP1853095A4 (en) | 2009-05-13 |
WO2006080298A1 (ja) | 2006-08-03 |
JP4927703B2 (ja) | 2012-05-09 |
EP1853095A1 (en) | 2007-11-07 |
US20090009977A1 (en) | 2009-01-08 |
EP1858306A4 (en) | 2009-03-11 |
EP1858306A1 (en) | 2007-11-21 |
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