JPS6481392A - Injection molding of printed circuit board - Google Patents

Injection molding of printed circuit board

Info

Publication number
JPS6481392A
JPS6481392A JP23919887A JP23919887A JPS6481392A JP S6481392 A JPS6481392 A JP S6481392A JP 23919887 A JP23919887 A JP 23919887A JP 23919887 A JP23919887 A JP 23919887A JP S6481392 A JPS6481392 A JP S6481392A
Authority
JP
Japan
Prior art keywords
film
board
cavity
circuit
injection molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23919887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563111B2 (enrdf_load_stackoverflow
Inventor
Hironori Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP23919887A priority Critical patent/JPS6481392A/ja
Publication of JPS6481392A publication Critical patent/JPS6481392A/ja
Publication of JPH0563111B2 publication Critical patent/JPH0563111B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP23919887A 1987-09-24 1987-09-24 Injection molding of printed circuit board Granted JPS6481392A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23919887A JPS6481392A (en) 1987-09-24 1987-09-24 Injection molding of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23919887A JPS6481392A (en) 1987-09-24 1987-09-24 Injection molding of printed circuit board

Publications (2)

Publication Number Publication Date
JPS6481392A true JPS6481392A (en) 1989-03-27
JPH0563111B2 JPH0563111B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=17041185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23919887A Granted JPS6481392A (en) 1987-09-24 1987-09-24 Injection molding of printed circuit board

Country Status (1)

Country Link
JP (1) JPS6481392A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206989A (ja) * 1990-11-30 1992-07-28 Nitto Boseki Co Ltd プリント配線体
GB2340666A (en) * 1998-08-17 2000-02-23 Ford Motor Co Method of laminating a flexible circuit to a substrate.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206989A (ja) * 1990-11-30 1992-07-28 Nitto Boseki Co Ltd プリント配線体
GB2340666A (en) * 1998-08-17 2000-02-23 Ford Motor Co Method of laminating a flexible circuit to a substrate.
US6197145B1 (en) 1998-08-17 2001-03-06 Ford Motor Company Method of laminating a flexible circuit to a substrate
GB2340666B (en) * 1998-08-17 2003-10-29 Ford Motor Co Method of laminating a flexible circuit to substrate

Also Published As

Publication number Publication date
JPH0563111B2 (enrdf_load_stackoverflow) 1993-09-09

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