JPS6430722A - Injection molding device of multilayer printed circuit board - Google Patents

Injection molding device of multilayer printed circuit board

Info

Publication number
JPS6430722A
JPS6430722A JP18598287A JP18598287A JPS6430722A JP S6430722 A JPS6430722 A JP S6430722A JP 18598287 A JP18598287 A JP 18598287A JP 18598287 A JP18598287 A JP 18598287A JP S6430722 A JPS6430722 A JP S6430722A
Authority
JP
Japan
Prior art keywords
layer
board
cavity
molding block
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18598287A
Other languages
Japanese (ja)
Other versions
JPH0479808B2 (en
Inventor
Masakata Kaji
Hironori Koyama
Kazumitsu Omori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP18598287A priority Critical patent/JPS6430722A/en
Publication of JPS6430722A publication Critical patent/JPS6430722A/en
Publication of JPH0479808B2 publication Critical patent/JPH0479808B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1635—Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To make it possible to obtain a multilayer printed circuit board with a single equipment by one molding cycle by a method wherein a cavity to determined the shape of the board is formed on one of molds so as to successively shift a bottom molding block in response to the thicknesses of respective layers of the board, and a device, which distributes circuit films to every layer of the board, is provided on the other mold. CONSTITUTION:On a movable mold 20, a cavity C, which is the shape of the first layer of a board, is formed by a frame molding block 23 and a bottom molding block 25. On the other fixed mold 60, the circuit pattern 15 of the first layer is arranged together with a circuit film 70 by means of a circuit film feeding device 75. Molten resin constituting the board is injected through a runner nozzle 67 in the cavity C in order to form the circuit pattern 15 of the first layer simultaneously and integrally with the molding of the board layer 11 of the first layer. After that, the board layer 11 and a runner are separated from each other by opening the molds. Further, a cavity C2 of the second layer is formed by retreating the bottom molding block 25 by the thickness of a second layer board by means of a bottom molding block shifting mechanism 30. On the other fixed mold 60, the circuit pattern 16 of the second layer is distributed together with the circuit film 70.
JP18598287A 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board Granted JPS6430722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18598287A JPS6430722A (en) 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18598287A JPS6430722A (en) 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board

Publications (2)

Publication Number Publication Date
JPS6430722A true JPS6430722A (en) 1989-02-01
JPH0479808B2 JPH0479808B2 (en) 1992-12-17

Family

ID=16180288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18598287A Granted JPS6430722A (en) 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board

Country Status (1)

Country Link
JP (1) JPS6430722A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425294A2 (en) * 1989-10-26 1991-05-02 Polyplastics Co. Ltd. Two-color molded article for use in circuit formation
FR2900861A1 (en) * 2006-02-20 2007-11-16 Yoshida Industry Co METHOD FOR MANUFACTURING A RESIN MOLDED PRODUCT USING A MOBILE MOLD AND A FIXED MOLD
CN109526146A (en) * 2017-09-19 2019-03-26 丰田自动车株式会社 The manufacturing method and its manufacturing device of wiring plate
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425294A2 (en) * 1989-10-26 1991-05-02 Polyplastics Co. Ltd. Two-color molded article for use in circuit formation
FR2900861A1 (en) * 2006-02-20 2007-11-16 Yoshida Industry Co METHOD FOR MANUFACTURING A RESIN MOLDED PRODUCT USING A MOBILE MOLD AND A FIXED MOLD
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
CN109526146A (en) * 2017-09-19 2019-03-26 丰田自动车株式会社 The manufacturing method and its manufacturing device of wiring plate
CN109526146B (en) * 2017-09-19 2021-11-02 丰田自动车株式会社 Method and apparatus for manufacturing wiring board

Also Published As

Publication number Publication date
JPH0479808B2 (en) 1992-12-17

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