JPS6481181A - Surface treatment of metal electrode - Google Patents
Surface treatment of metal electrodeInfo
- Publication number
- JPS6481181A JPS6481181A JP23814387A JP23814387A JPS6481181A JP S6481181 A JPS6481181 A JP S6481181A JP 23814387 A JP23814387 A JP 23814387A JP 23814387 A JP23814387 A JP 23814387A JP S6481181 A JPS6481181 A JP S6481181A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- organic titanate
- film
- metal electrode
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To improve the resistibility of an metal electrode against air pollution by wash-removing the film polluted by air on the surface of the metal electrode, and then forming an organic titanate compound film on this surface. CONSTITUTION:An oxide film formed on the surface of Al electrode is removed being subjected to a chemical grinding bath, and treated with a treating liquid including an organic titanate compound, whereby the organic titanate compound film is formed on the Al electrode surface. This compound serves to protect the Al electrode from being oxidized naturally by air, reducing extremely interruption of a conduction path. Furthermore, when adherable-terminally fused type conductive resin bump is formed on the surface, the organic titanate coating film is bound with the base resin of resin bump to van der Waals force, whereby strong adherence is secured. In this way the Al electrode of an IC chip is treated and connected to a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23814387A JPS6481181A (en) | 1987-09-22 | 1987-09-22 | Surface treatment of metal electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23814387A JPS6481181A (en) | 1987-09-22 | 1987-09-22 | Surface treatment of metal electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6481181A true JPS6481181A (en) | 1989-03-27 |
Family
ID=17025825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23814387A Pending JPS6481181A (en) | 1987-09-22 | 1987-09-22 | Surface treatment of metal electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6481181A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196371A (en) * | 1989-12-18 | 1993-03-23 | Epoxy Technology, Inc. | Flip chip bonding method using electrically conductive polymer bumps |
| US5879761A (en) * | 1989-12-18 | 1999-03-09 | Polymer Flip Chip Corporation | Method for forming electrically conductive polymer interconnects on electrical substrates |
| JP2015173256A (en) * | 2014-03-11 | 2015-10-01 | インテル コーポレイション | integrated circuit package |
-
1987
- 1987-09-22 JP JP23814387A patent/JPS6481181A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196371A (en) * | 1989-12-18 | 1993-03-23 | Epoxy Technology, Inc. | Flip chip bonding method using electrically conductive polymer bumps |
| US5879761A (en) * | 1989-12-18 | 1999-03-09 | Polymer Flip Chip Corporation | Method for forming electrically conductive polymer interconnects on electrical substrates |
| US5918364A (en) * | 1989-12-18 | 1999-07-06 | Polymer Flip Chip Corporation | Method of forming electrically conductive polymer interconnects on electrical substrates |
| JP2015173256A (en) * | 2014-03-11 | 2015-10-01 | インテル コーポレイション | integrated circuit package |
| US9472515B2 (en) | 2014-03-11 | 2016-10-18 | Intel Corporation | Integrated circuit package |
| US10157869B2 (en) | 2014-03-11 | 2018-12-18 | Intel Corporation | Integrated circuit package |
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